MAX32660-TQFN
时间: 2023-09-29 08:08:22 浏览: 90
TQFN20-EP-5x5 三维3D封装,MAX31865 PCB封装
MAX32660-TQFN是一种小尺寸的芯片封装,适用于MAX32660微控制器。这种封装的引脚布局为TQFN,封装尺寸为5mm x 5mm,引脚间距为0.5mm。MAX32660-TQFN芯片在温度范围-40°C至115°C内工作,适用于各种应用场景。<span class="em">1</span><span class="em">2</span><span class="em">3</span>
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