n the present research, a hybrid laser polishing technology combining pulsed laser and continuous wave laser was applied to polish the surface of laser directed energy deposition (LDED) Inconel 718 superalloy components. The surface morphology, microstructure evolution and microhardness of the as-fabricated, the single pulsed laser polishing (SPLP) and the hybrid laser polishing (HLP) processed samples were investigated. The results revealed that the as-fabricated sample has a rough surface with sintered powders. In the matrix, the NbC carbide and Cr2Nb based Laves phase array parallel to the build direction and the small γʺ-Ni3Nb particles precipitate in matrix uniformly. The surface roughness of the as-fabricated sample is 15.75 μm which is decreased to 6.14 μm and 0.23 μm by SPLP and HLP processing, respectively. The SPLP processing refines the grains and secondary phase significantly in the remelted layer which is reconstructured with the cellular structure and plenty of substructures. The HLP processing also refines the grain and secondary phase but the secondary phases still exhibit array distribution. In addition, the tangled dislocations pile up along the interface of secondary phases. Compared with the as-fabricated sample, the SPLP processing decreases the surface microhardness but the HLP processing increases the surface microhardness, and the Young's elasticity modulus of surface layer is improved by SPLP and HLP processing to 282 ± 5.21 GPa and 304 ± 5.57 GPa, respectively. 翻译
时间: 2024-04-23 15:28:59 浏览: 29
在本研究中,采用脉冲激光和连续波激光相结合的混合激光抛光技术,对激光直接能量沉积(LDED)Inconel 718高温合金组件的表面进行了抛光。研究了原始制备的样品、单脉冲激光抛光(SPLP)处理的样品和混合激光抛光(HLP)处理的样品的表面形貌、微观结构演变和显微硬度。结果表明,原始制备的样品表面粗糙,有烧结粉末存在。在基体中,NbC碳化物和Cr2Nb基Laves相平行于构建方向排列,小的γʺ-Ni3Nb颗粒均匀沉淀在基体中。原始制备样品的表面粗糙度为15.75μm,经过SPLP处理后降低到6.14μm,经过HLP处理后降低到0.23μm。SPLP处理显著细化了重熔层的晶粒和二次相,重构出具有细胞结构和大量亚结构的层。HLP处理也细化了晶粒和二次相,但二次相仍呈阵列分布。此外,缠结的位错沿着二次相的界面堆积。与原始制备样品相比,SPLP处理降低了表面显微硬度,而HLP处理增加了表面显微硬度,并且SPLP和HLP处理使表层的杨氏弹性模量分别提高到282±5.21GPa和304±5.57GPa。
相关问题
an increased roughness of the bond pad surface was recorded.原因可能是什么
There are several possible reasons for an increased roughness of the bond pad surface, including:
1. Wear and tear: Over time, the bond pad surface may become worn and rough due to repeated use and contact with other materials.
2. Manufacturing defects: The roughness may be a result of a defect in the manufacturing process, such as uneven polishing or etching.
3. Environmental factors: Exposure to harsh environmental conditions like humidity or high temperatures can cause the bond pad surface to become rough.
4. Material properties: The roughness may be a result of the properties of the material used for the bond pad, such as its hardness or brittleness.
5. Improper handling: Roughness may be caused by improper handling during assembly or testing, such as using the wrong tools or applying too much force.
CMP抛光原理更加学术化
CMP(Chemical Mechanical Polishing)抛光是一种结合化学反应和机械磨削的表面处理技术。其原理是将化学反应剂和磨料混合涂覆在待处理表面,通过摩擦和压力的作用,使化学反应剂与待处理表面发生反应,同时磨料磨削表面,将其表面不平整处去,从而达到平整、光滑的效果。
具体来说,CMP抛光是通过磨料在高速旋转的研磨盘上与待处理表面摩擦,使表面微观颗粒得到去除,同时化学反应剂和表面发生反应,实现表面化学处理的过程。该过程中,磨料的尺寸、形状、硬度等特性都会影响抛光效果,而化学反应剂的成分和浓度则会影响表面的化学反应过程。
总之,CMP抛光原理是一种复杂的物理化学过程,需要对磨料、化学反应剂等多种因素进行精细调控,才能达到理想的抛光效果。