翻译 The superficial surface microstructure investigations carried out by SEM and EBSD reveal the influence of LAMill process on the machined workpiece. It is interesting that the LAMill machined workpiece (using parameters selected by solving the inverse problem [19]) presents less damage in reference to grain alternation (white layer and material drag) and misorientation depth in the superficial surface when compared with CMill workpiece. This phenomenon is attributed to the 3D uniformly distributed laser heating effect resulting in a controlled softening depth of the workpiece which is subsequently removed by the machining process; this has been validated by putting in evidence the re-solidified layer on LS samples as well as the melt-like layer found in LAMill generated chips. Besides, the less broaden peaks of LAMill sample in XRD patterns also indicates that LAMill process presents a thinner grain refinement layer (white layer) compared with CMill one which showed broaden XRD peaks

通过 SEM 和 EBSD 进行的表面微结构调查显示了 LAMill 加工对加工件的影响。有趣的是，通过解决逆问题选择参数加工的 LAMill 加工件 ( [19] ) 与 CMill 加工件相比，在表面上损伤（白层和材料拖曳）和偏斜深度方面较少。这种现象归因于 3D 均匀分布的激光加热效应，导致工件的控制软化深度，随后被加工过程删除；这已通过在 LS 样品上证明再固化层以及在 LAMill 生成的芯片中发现的熔融层来证实。此外，LAMill 样品在 XRD 图案中的峰值较窄也表明 LAMill 加工过程比 CMill 加工过程具有更薄的粒细化层（白层），而 CMill 加工过程显示了加宽的 XRD 峰值。