5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
CPU SIGNAL
DDR3 MEMORY
eMMC, SPI NOR FLASH
SD CARD, SATA
LVDS, HDMI
EPCD EXP PORTS
CAMERA, EXP PORT
SENSORS
AUDIO
USB
EHTERNET
JTAG, DEBUG
mPCIe CONN
AUX SDIO CONN, CAN
GPS MODULE
AUX VOLT REG
Table of Content
TITLE PAGE
CPU POWER
Page 1
Page 2
Page 3
Page 4
Page 5
Page 6
Page 7
Page 8
Page 9
Page 10
Page 11
Page 12
Page 13
Page 14
Page 15
Page 16
Page 17
Page 18
i.MX6 SMART DEVICE SYSTEM
X1
Revision History
Rev. Code Date Description
11/02/2011 Rev X1 Draft
GENERAL DESIGN NOTES
DC Voltage Output: 5VDC
-
+
AC ADAPTER SPECIFICATIONS
Outer Diameter: 5.5mm
Inner Diameter: 2.1mm
Polarity:
Current Output: ~ 5A (depending on application)
Page 19
Page 20
Page 21
BATTERY CHARGER
PF0100 PMIC
BOOT SELECT
BUILD OPTION TABLES
Page 22
Page 23
PIN MUX TABLEPage 24
COMM CHANNEL STEERING
MCIMX6DL-SDP
A 12/15/2011 Release to Prototype Phase
AX1 02/09/12
Draft Rev B Respin:
- Changed Audio CODEC to WM8962 per Marketing Request.
- Removed two digital microphones. Changed mics to Wolfson WM2730 per Marketing.
- Connected NVCC_JTAG rail to GEN_3V3.
- Added PFET Switch to SWBST supply to isolate it from System power.
- Changed HDMI Media guard to CM2020 IC to correct I2C HDMI issue.
- Changed voltage sides on U9 level shifter.
- Changed SW4 to 3.15V output. Moved audio 1.8V to GEN_1V8.
- Changed camera 1V5 supply to VGEN2, other 1V5 loads moved to VGEN1.
- Added isolation PFETs to Audio voltage supplies.
- Switched USB_OTG_ID to pin ENET_RX_ER, USBOTG_OC to pin EIM2
and USBH1_OC to pin EIM_D30 to match pinmux functionality.
- Added parallel termination resistors to PCIe differential clock traces.
- Added next generation DEVSLP option for SATA connection.
- Moved DISP0_PWR_EN to NANDF_WP_B to correct pull up voltage issue.
- Deleted auxiliary 3.15V voltage regulator.
- Designated several capacitors on processor core power rails as DNP.
Validation proved unnecessary.
- Moved I2C3 SDA from GPIO_16. This pin must be unconnected for
Ethernet 1588 (time stamp) functionality to work.
- Added shield ground pins to LVDS connectors.
- Changed extrnal speaker capacitors to higher voltage rating.
- Changed external regulator to supply 3.0V power to VSNVS.
- Changed PF0100 microprocessor program circuit to DNP.
- Added 5V supply to LCD expansion headers.
- Connected HPOUTFB directly to Audio GND.
- Connected VDDOTP to ground to boot PMIC from program settings.
- Added isolation to prevent back powering board from USB when no battery present.
- Back annotated Schematic to Layout. REFDES may have changed from Rev A.
- Populated optional "PWRON" button circuit for use with Android.
- Removed write protect on NOR Flash.
- Removed LC filter circuit from external speakers.
- Added an additional 2 100uF capacitors to MPCIE_3V3 next to connector.
- Updated Power Rail, IOMUX, and Configuration Tables.
B 02/17/12 Release to Production
B1 04/11/12
Release to Production
- Depopulated Q512 because of schematic error.
- Cut trace to U12 pin 5 to prevent false USB plug in detects.
- Added schematic page to detail applicable board TDAs that affect Rev B boards.
- Populating CAN components U517 and U518 per Marketing Request.
- Added resistor RX1 across pads for C55 to improve 24MHz clock stability.
- Pull up resistors R629 and R639 have been changed to DNP.
- R30 is DNP to support TO1.0 issue on i.MX6 DualLite Silicon.
TEMPORARY DEVIATIONSPage 25
- Changed Marketing part number to MCIMX6DL-SDP
- Changed R7, R112 and R585 to DNP
- Changed C540 to "POPULATED"
- Added notes that the SATA interface does not exist on the i.MX6 DualLite
version of the i.MX6 Processor Familiy.
B2 05/04/12
B3 05/25/12
- Changed DDR3 Memory to new 1.35V capable memory MT41K128M16JT.
- Changed C540 to 1.0 uF per Wolfson recommendation.
- Changed R183 and R189 to 2.37K pull ups to bring I2C rise time into specification.
B4 07/18/12
- Removed buffers U500 and U520 from digital microphone data outputs.
A note is added to show required hand wire modification.
- The Battery Charge Done LED is disconnected and R522 is depopulated.
New parts RX2, CX1 and UX1 are added. Traces show required hand modifications.
- Optional Power On Circuit has been disabled and U511 and R578
are now DNP. A new Diode DX1 has been added to allow EIM_D29
to sense a button press.
- RESET button SW2 now connects to the PWRON pin of the PMIC.
- Added 10K pull down resistor RX3 to SDCKE0 trace.
- SIM Card Connector CON1 is now populated by default.
- Battery Connector Header CON3 is now populated by default.
- Changed resistors R174 and R176 and to depopulated by default.
LVDS0 EDID will not be connected to I2C2 channel unless needed.
1. Unless Otherwise Specified:
All resistors are in ohms, 5%, 1/16 Watt
All capacitors are in uF, 20%, 50V
All voltages are DC
All polarized capacitors are Tantalum
3. Interrupted lines coded with the same letter or letter
combinations are electrically connected.
4. Device type number is for reference only. The number
varies with the manufacturer.
5. Special signal usage:
_B or 'n' Denotes - Active-Low Signal
<> or [] Denotes - Vectored Signals
6. Interpret diagram in accordance with American
National Standards Institute specifications, current
revision, with the exception of logic block symbology.
2. Critical compenents that require tolerances tighter
than listed in Note 1are labeled with required tolerance
on schematic. Non-critical components may be filled
with tighter tolerance parts for BOM consolidation
purposes, but may be changed to meet the general
tolerances of Note 1 if desired.
- Changed U1 to i.MX 6 TO1.2 processor.
- Changed C68 and C612 to DNP.
- Populated C682 and C716 with 22uF capacitors.
09/25/12B5
- All hand wire changes made in Revision B4 are now formally made in the netlist
and the layout files.
- Q512 is changed to populated.
- Optional Start Up circuit has been modified.
- PMIC Programming Micro-Processor is removed.
- CX1 capacitor is changed to C504
- DX1 diode is changed to D4
- RX1 resistor changed to R216
- RX2 resistor changed to R19
- RX3 resistor changed to R635
- UX1 buffer changed to U507
- Add DNP Input to U13 buffer for USB_OTG_PWR_EN.
Buffer now powered from GEN_3V3.
- FA_ANA and VDD_FA signals now connected to ground.
- Added resistor options to EIM_DA7 trace to EPD connector.
- Connected EIM_DA9 to EPDC connector J508 to supply SDCE5 if needed.
- Optional LDO U9 is now depopulated.
- Added Connector J13 to support BT from SDIO Card through DNP resistors.
- Added GPIO control of Battery Charge Enable pins through DNP resistor.
- Changed C594 to 0.22uF
- Changed C31 to 47uF.
- Added C555 as second 22uF capacitor in parallel with C546.
- Changed C561, C562, C586 and C596 to 0.47uF.
- Added additional 47uF bulk capacitor C769 to SD2 socket VDD supply.
- Added option to route HDMI DDC comms seperate from I2C2 comms channel.
- C597 populated to provide de-bounce to RESET circuit.
- Depopulated C68, C612. Populated C682, C716 closer to pins.
- Depopulated C39, C606, C607, C608, C609, C610, C673 and C681.
- Added DNP R302 to provide alternate 5V supply path to USB_H1_VBUS.
- Added DNP R632 to provide alternate gating of PMIC_5V source (tied to VDDSOC).
- Added DNP L25 and L26 to provide alternate 2.8V supply path to camera modules.
- Added test pads to LVDS third data lanes to support testing with will 24-bit panels.
- Changed capacitors C6 and C7 to Zero Ohm resistors.
- Changed Battery Charge ICs U502 and U503 to MAX8903C version.
10/01/12C1
C2 11/09/12
X
- Moved Ferrite Beads L10 and L17 to pads for L15 and L26.
Camera Analog Voltage supply moved to VGEN3.
- Added notes for 24MHz crystal and USB layout design.
- Changed R17, R21, R25, R27, R68, R85, R582, and R660 to 1% resistors
due to lead time availability issues.
Drawing Title:
Size
Document Number
Rev
Date:
Sheet
of
Page Title:
Designer:
Drawn by:
Approved:
Multimedia Application Division,
Wireless & Mobile System Group
This document contains information proprietary to Freescale Semiconductor and shall not be used for
engineering design, procurement or manufacture in whole or in part without the express written permission
of Freescale Semiconductor.
ICAP Classification: FCP: _____ FIUO: _____ PUBI: _____
SOURCE:SCH-27417 PDF:SPF-27417 C2
MCIMX6DL-SMART DEVICE PLATFORM
D
Friday, November 09, 2012
TITLE PAGE
Mark Middleton
<Approver>
Mark Middleton
125
Drawing Title:
Size
Document Number
Rev
Date:
Sheet
of
Page Title:
Designer:
Drawn by:
Approved:
Multimedia Application Division,
Wireless & Mobile System Group
This document contains information proprietary to Freescale Semiconductor and shall not be used for
engineering design, procurement or manufacture in whole or in part without the express written permission
of Freescale Semiconductor.
ICAP Classification: FCP: _____ FIUO: _____ PUBI: _____
SOURCE:SCH-27417 PDF:SPF-27417 C2
MCIMX6DL-SMART DEVICE PLATFORM
D
Friday, November 09, 2012
TITLE PAGE
Mark Middleton
<Approver>
Mark Middleton
125
Drawing Title:
Size
Document Number
Rev
Date:
Sheet
of
Page Title:
Designer:
Drawn by:
Approved:
Multimedia Application Division,
Wireless & Mobile System Group
This document contains information proprietary to Freescale Semiconductor and shall not be used for
engineering design, procurement or manufacture in whole or in part without the express written permission
of Freescale Semiconductor.
ICAP Classification: FCP: _____ FIUO: _____ PUBI: _____
SOURCE:SCH-27417 PDF:SPF-27417 C2
MCIMX6DL-SMART DEVICE PLATFORM
D
Friday, November 09, 2012
TITLE PAGE
Mark Middleton
<Approver>
Mark Middleton
125
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