Data Sheet 11 Rev. 1.00
2022-10-12
BTS7030-2EPG
PROFET™ +2 12V
General Product Characteristics
4.4.1 PCB Setup
Figure 5 1s0p PCB Cross Section
Figure 6 2s2p PCB Cross Section
Figure 7 PCB setup for thermal simulations
Figure 8 Thermal vias on PCB for 2s2p PCB setup
70 µm modeled (traces, cooling area)
1,5 mm
70 µm, 5% metalization*
PCB_Zth_1s0p.emf
*: means percentual Cu metalization on each layer
70 µm modeled (traces)
35 µm, 90% metalization*
1,5 mm
70 µm, 5% metalization*
PCB_Zth_2s2p.emf
35 µm, 90% metalization*
*: means percentual Cu metalization on each layer
PCB_sim_setup_TSDSO14.emf
PCB 1s0p + 600 mm2 cooling PCB 2s2p / 1s0p footprint
P CB_ 2s 2p _vi as_T S DS O14. emf
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