DRV设备驱动电机布局优化与设计指南

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"该资源是一份关于无刷电机驱动板设计的指导，主要基于DEV8313芯片，涵盖了布局和走线的关键要点。报告强调了电路热量分布的重要性，并提供了最佳实践建议，以实现高效、低噪声和紧凑的驱动系统设计。" 在设计无刷电机驱动板时，特别是基于DEV8313的系统，设计师需要考虑多种因素来确保最佳性能。这些因素包括电源效率、高速切换频率、低噪声抖动以及紧凑的板级设计。TI（德州仪器）的DRV系列器件因其高度集成和内置保护电路而成为此类系统的理想选择。 1. **接地优化 (Grounding Optimization)**: 接地是驱动板设计中的关键部分，因为它直接影响到信号完整性和电磁兼容性(EMC)。良好的接地策略可以降低噪声，提高系统的稳定性。在设计中，应使用大面积的接地平面，避免长的接地回路，以减少地平面间的阻抗并降低噪声耦合。同时，确保电源和信号地的分离，以防止相互干扰。 2. **热管理 (Thermal Overview)**: 无刷电机在运行时会产生大量热量，因此必须对散热进行有效管理。设计时要考虑功率器件的热阻和热容，合理布局发热元件，使热量能迅速散发。使用热垫或热通孔可以帮助将热量从器件传递到PCB的顶部或底部，进一步通过散热器或空气流动来散热。热设计不仅关乎设备的寿命，还直接影响到系统的稳定性和效率。 3. **走线策略 (Routing Strategies)**: 高速开关信号的走线应尽可能短且直，以减少信号损失和辐射。高电流路径应保持连续且宽，以降低电阻和电压降。敏感信号应远离噪声源，如功率开关和电感，采用屏蔽走线或地平面隔离。 4. **电源布局 (Power Supply Layout)**: 电源去耦是必不可少的，确保每个电源引脚附近都有适当的电容，以滤除高频噪声。使用不同类型的电容（如陶瓷、钽、铝电解）可以覆盖广泛的频率范围。 5. **保护电路 (Protection Circuits)**: DRV系列器件通常包含内置保护功能，如短路保护、过流保护和热关断。理解这些保护机制的工作原理并在设计中充分考虑它们，可以防止器件在异常条件下受损。 6. **紧凑设计 (Compact Design)**: 在有限的空间内实现高效能驱动系统需要精细的布局。利用多层板可以减少布线复杂性，但要确保电源层和地层之间的良好隔离。 7. **信号完整性 (Signal Integrity)**: 高速信号的上升时间短，需要特别注意信号的质量和抗干扰能力。适当的信号线宽、阻抗匹配和去耦电容的使用有助于保证信号的完整传输。这份应用报告为设计人员提供了一个全面的指南，帮助他们实现一个高性能的无刷电机驱动解决方案，降低热应力，优化效率，并最小化驱动应用中的噪声。遵循这些最佳实践，可以确保驱动板设计的可靠性和长期稳定性。

G H

www.ti.com

Thermal Overview

SLVA959A–November 2018–Revised January 2019

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Best Practices for Board Layout of Motor Drivers

Figure 6. Current Paths in an Electronic System

The supply lines in Figure 6 form loops A–C–D–B and A–E–F–B. The energy that the system requires to

operate is conducted by these lines.

Loops L-M-F-D, N-Q-P-F, and G-H-J-K are formed by signals and controls. The area these lines enclose

is usually small if those lines outside the system are not considered. However, these lines must be

considered at high frequency because they often transmit signals which can affect EMC performance.

Current loops can also form when connectors, headers, or other components break up a ground plane.

This causes high-frequency components of switching currents to travel further around the board and

effectively create a large loop. This can also occur with vias and is highlighted in Section 3.2.2

2 Thermal Overview

Motor drivers are not ideal devices, in real-world applications some of their power is dissipated internally

as heat. The energy converted to heat must be dealt with before damage occurs to the driver. Proper PCB

design can effectively remove heat generated by inefficiencies and keep the device at a recommended

temperature.

2.1 PCB Conduction and Convection

An important consideration for motor driver thermal performance is the pathways which heat generated

inside the device can dissipate. Three primary paths for heat to go from the die into lower temperature

environments are:

• Encapsulation material

• Bond wires

• Thermal pad

Using these three paths as examples, the thermal pad is the most efficient path for heat to go from the

device, followed by the encapsulation material, and finally the bond wires. The technology used in the

thermal pad integrated circuit package creates a low thermally resistive path from the die to external

copper planes. Therefore the thermal pad can efficiently conduct a large amount of heat away from the

die. The thermal pad poured underneath the driver should be large enough to cover the entire area of the

thermal pad, and still include a large surface area on other parts of the PCB. The thermal pad should also

be tightly bound to the bottom ground plane with several thermal vias placed directly underneath the

thermal pad. Figure 7 shows an example of the exit paths used by heat generated in the device die.

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