英飞凌TDA21472 OptiMOS™ 功率级芯片中文规格书

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"TDA21472是英飞凌（INFINEON）推出的一款集成化电源管理芯片，中文版规格书提供了详细的技术参数和应用信息。这款芯片是一款OptiMOS™功率级器件，主要用于DC-DC转换器电压调节。" TDA21472的主要特点包括： 1. 集成化设计：芯片内部集成了驱动器、肖特基二极管以及高低侧MOSFET，实现了高度集成，简化了电路设计。 2. 高精度电流检测：提供5毫伏/安培的片上MOSFET电流感应，并具有温度补偿功能，确保在不同环境温度下准确报告电流。 3. 输入电压范围：支持4.25V至16V的宽输入电压范围，适应性强。 4. 供电电压：VCC和VDRV供电范围为4.25V至5.5V，保证了芯片正常工作。 5. 输出电压与电流：输出电压可调，最低0.25V，最高5.5V，最大输出电流可达70A，适用于大电流应用。 6. 高工作频率：最高可支持1.5MHz的工作频率，满足高速转换需求。 7. 保护功能：具备VCC/VDRV欠压锁定（UVLO）、热关断、故障标志，确保系统安全运行。 8. 温度模拟输出：8毫伏/摄氏度的温度模拟输出，可用于监测系统温度。 9. 周期性过电流保护：具有可编程阈值的周期性过电流保护及故障标志，能有效防止过载。 10. MOSFET相故障检测：能够检测MOSFET相位故障并发出警告，增强系统稳定性。 11. 自动补充 bootstrap 电容：自动管理 bootstrap 电容的充放电，确保高侧MOSFET的可靠开关。 12. 节能模式：深睡眠模式降低待机功耗，实现节能。 13. PWM输入兼容：兼容3.3V三态PWM输入，方便与各种控制器配合使用。 14. 支持负载瞬态响应：具备Body-Braking负载瞬态支持，确保负载变化时的稳定工作。 15. 小型封装：采用5mm x 6mm x 1mm的小型PQFN封装，节省空间，适合紧凑型应用。 16. 环保认证：无铅且符合RoHS标准，符合环保要求。这款芯片广泛应用于需要高效、高密度电源转换的场合，如服务器、通信设备、数据中心和工业自动化系统等，其丰富的保护功能和高效的性能设计使得TDA21472成为现代电源管理领域的重要选择。

Data Brief Please read the Important Notice and Warnings at the end of this document V 1.0

www.infineon.com page 1 of 4 2019-07-17

TDA21472

TDA21472 OptiMOS™ Powerstage

DC-DC converter voltage regulator

Features

 Co-packaged driver, Schottky diode, and high-side and low-side MOSFETs

 5-mV/A on-chip MOSFET current sensing with temperature compensated reporting

 Input voltage (VIN) range of 4.25 V to 16 V

 VCC and VDRV supply of 4.25 V to 5.5 V

 Output voltage range from 0.25 V up to 5.5 V

 Output current capability of 70 A

 Operation up to 1.5 MHz

 VCC/VDRV under voltage lockout (UVLO)

 8-mV/°C temperature analog output

 Thermal shutdown and fault flag

 Cycle-by-cycle over current protection with programmable threshold and fault flag

 MOSFET phase fault detection and flag

 Auto-replenishment of bootstrap capacitor

 Deep-sleep mode for power saving

 Compatible with 3.3-V tri-state PWM input

 Body-Braking load transient support

 Small 5 mm x 6 mm x 1 mm PQFN package

 Lead free RoHS compliant package

Description

The TDA21472 power stage contains a low quiescent-current synchronous buck gate-driver IC co-packaged

with Schottky diode, and high-side and low-side MOSFETs. The package is optimized for PCB layout, heat

transfer, driver/MOSFET control timing, and minimal switch node ringing when layout guidelines are followed.

The gate driver and MOSFET combination enables higher efficiency at the lower output voltages required by

cutting edge CPU, GPU and DDR memory designs.

The TDA21472 internal MOSFET current sense algorithm with temperature compensation achieves superior

current sense accuracy versus best-in-class controller-based inductor DCR sense methods. Protection includes

cycle-by-cycle over current protection with programmable threshold, VCC/VDRV UVLO protection, phase fault

detection, IC temperature reporting and thermal shutdown. The TDA21472 also features auto-replenishment of

the bootstrap capacitor to prevent over-discharging. The TDA21472 features a deep-sleep power saving mode,

which greatly reduces the power consumption when the multiphase system enters PS3/PS4 mode.

Operation at switching frequency as high as 1.5 MHz enables high performance transient response, allowing

reduction of output inductance and output capacitance while maintaining industry leading efficiency.

The TDA21472 is optimized for CPU core power delivery in server applications. The ability to meet the stringent

requirements of the server market also makes it ideally suited for powering GPU and DDR memory designs.

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