"PICMG3.0标准完整版及其注意事项介绍"
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这段文字是关于PICMG3.0标准完整版的描述。PICMG3.0是一种工业计算机制造商组织（PCI）制定的标准，旨在定义先进TCABase规范的技术要求和规范。这是PICMG3.0修订版3.0 AdvancedTCA Base Specification发布候选1.2版本，于2008年2月19日发布。
根据这份规范，不要将设计或声称符合或采用PICMG规范，并且不要分发此规范。这份规范的版权归PCI工业计算机制造商组织所有。制定者对采用者的注意事项是遵守或采用PICMG规范的可能性。
PICMG3.0标准完整版规范旨在提供工业计算机制造商一个统一的硬件平台，以满足先进TCA系统的需求。先进TCA是一种高性能、可扩展的开放技术规范，用于设计和构建可靠性、可扩展性和可维护性要求较高的计算机系统。
这个规范提供了先进TCA系统的物理和电气要求，包括机箱、后端插槽、电源、温度传感器等方面。它还定义了基于通用物理层的高速互联技术和其他接口标准，如以太网、串行RapidIO、PCI Express等，以支持高速数据传输和系统间通信。
PICMG3.0标准完整版规范还规定了先进TCA系统的管理和维护要求。它定义了远程管理接口和协议，以实现系统的监控、故障检测和诊断功能。此外，规范还提供了日志记录、事件通知和远程控制等系统管理功能。
通过采用PICMG3.0标准完整版规范，制造商可以确保他们的产品符合先进TCA系统的要求。这有助于提高系统的互操作性、可插拔性和可靠性，同时降低系统集成和维护的成本。
总之，PICMG3.0标准完整版规范是一个重要的技术文档，定义了先进TCA系统的硬件和管理要求。它为工业计算机制造商提供了一个统一的平台，使他们能够设计和构建高性能、可靠性和可维护性的先进TCA系统。通过采用这个规范，制造商可以确保他们的产品符合行业的要求，同时提高系统的互操作性和可靠性。
xvi PICMG 3.0 R3.0 AdvancedTCA Base Specification RC 1.1 February 19, 2008
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
2-50 Subrack side view (with Front Board and RTM) ...............................................................2-102
2-51 Subrack side view (Front Boards and RTMs removed)....................................................2-103
2-52 Envelope for Backplane support bar ................................................................................2-104
2-53 Backplane support bar with varying Zone 3 implementations ..........................................2-105
2-54 Subrack interface to Handle and Front Board Face Plate features ..................................2-107
2-55 Subrack interface to Handle and RTM Face Plate feature ...............................................2-108
2-56 Front Board Guide Rail dimensions and PCB reference plane ........................................2-110
2-57 RTM Guide Rail dimensions and PCB reference plane ...................................................2-111
2-58 Conductive Guide Rail keepout ........................................................................................2-112
2-59 ESD Clip position in the Guide Rail ..................................................................................2-113
2-60 Example of ESD Clip ........................................................................................................2-114
2-61 Subrack EMC Gasket position..........................................................................................2-116
2-62 Wrist strap terminal with Shelf Ground marking ...............................................................2-121
2-63 Side view of example cable trays .....................................................................................2-126
2-64 I/O cable routing ...............................................................................................................2-127
3-1 Management aspects of an example AdvancedTCA® Shelf................................................3-2
3-2 Management aspects of an alternate example AdvancedTCA® Shelf.................................3-4
3-3 Example Board interfaces ....................................................................................................3-6
3-4 Example Hardware and Physical Address mapping diagram.............................................3-24
3-5 Managed FRU state transition diagram..............................................................................3-37
3-6 FRU state transitions, including unexpected transitions and error conditions ....................3-55
3-7 Implementation options for an AdvancedTCA® Shelf Manager .........................................3-80
3-8 FRU inventory recommended write algorithm ..................................................................3-113
3-9 Channel mappings for ShMC Cross-connects between Hub Slots and dedicated ShMC
sites ..................................................................................................................................3-120
3-10 Example single-channel Link mapping .............................................................................3-126
3-11 Example multi-channel Backplane routing diagram .........................................................3-128
3-12 IPM Controller transmit.....................................................................................................3-146
3-13 IPM Controller receive ......................................................................................................3-146
3-14 Fault monitoring responsibility ..........................................................................................3-165
3-15 Power/cooling system stages ...........................................................................................3-167
3-16 Power discovery Board/FRU participation........................................................................3-177
3-17 Power renegotiation..........................................................................................................3-195
3-18 IPMI event thresholds with hysteresis ..............................................................................3-198
4-1 Shelf level power distribution example (2 Feeds).................................................................4-1
4-2 Shelf level power distribution example (8 Feeds).................................................................4-2
4-3 Power distribution with and without a Frame-level PDU.......................................................4-5
4-4 Multiple power Feeds to a Shelf ...........................................................................................4-7
4-5 Fusing example ....................................................................................................................4-9
4-6 Ratio of maximum allowed current surge ...........................................................................4-12
4-7 Plant model for fault analysis..............................................................................................4-13
4-8 Example fault transients .....................................................................................................4-14
4-9 Typical power distribution in a Shelf ...................................................................................4-16
4-10 Board insertion sequence diagram.....................................................................................4-23
4-11 Board extraction sequence diagram...................................................................................4-24
4-12 Example of diagram with diode coupling of input power ...................................................4-27
4-13 Example diagram without diode coupling of input power ...................................................4-28
4-14 Shielding effectiveness.......................................................................................................4-30
5-1 Example of Shelf airflow .......................................................................................................5-2
5-2 Board, Shelf and Frame power scaling ................................................................................5-4
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