3.5. Soldering and IC handling
Since the chip is only 50μm thick, a careful handling during the surface mount assembly process shall be taken in order to avoid mechani-
cal damage. In addition to that, careful PCB layout is needed in order to achieve reliable assembly results with a high yield. Please refer to
the application notes AN04 and AN08 from epc which contains comprehensive information to these topics. This application note can be
downloaded at www.espros.com/application-notes.
Item Description
Solder balls: Alloy Sn96.5Ag3.0Cu0.5 (SAC305)
Soldering profile For infrared or conventional soldering, the solder profile has to follow the recommendations of
IPC/JEDEC J-STD020C (revision C and later) for lead-free assembly.
Soldering lead temperature T
L
= 260 ºC for 4s with a maximum gradient of 6 ºC/s
Allowed cleaning agents Isopropanol
Packaging technology Bare-die CSP with underfill
Pick and place
Figure 11: Pick & place; left: good nozzle, good picking; right: bad nozzle, bad picking
The nozzle needs a flat surface. It must not touch the pixel-field area.
It should not have any flashes where it touches the chip. The chip can get damaged.
The nozzle has to bring the F
Z
force evenly distributed in a vertical way to the center of the solder
balls during picking and placing. Refer to Figure 11, left picture. It means that it should be large
enough so that it picks the chip not just in the middle of the part but in the area above the solder balls.
Bending of the chip is not allowed. Refer to Figure 11, right picture
Keep attention having no shear forces to the solder balls during picking the chip from the tape pocket
and/or placing.
Maximum vertical force F
Z
per chip: ≤ 0.8 N.
Maximum shear force F
SH_B
per ball: ≤ 0.5 N.
Preferred is forceless picking with vacuum only.
It is also highly recommended to use a „kiss-and-goodbye“ concept to place the component. It means
that the nozzle should blow the part away when it does the placing.
Table 9: IC handling specification
4. Ordering Information
Part Number Part Name Package RoHS compliance
P100 183 epc660-CSP68 CSP68 Yes
P100 244 epc660 Card Edge Connector Carrier PCB 37.25 x 36.00 mm Yes
Table 10: Ordering Information
Figure 12: epc660-CSP68
(bottom and top side)
Figure 13: epc660 Card Edge Connector Carrier
© 2017 ESPROS Photonics Corporation
Characteristics subject to change without notice
18 / 116 Datasheet_epc660-V1.09
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