EPC660 3D TOF摄像头数据手册：高集成、低功耗的毫米级测量解决方案

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"EPC660是一款专为3D Time-of-Flight (TOF) 成像设计的高度集成芯片，其数据手册详细介绍了这款器件。该芯片拥有320x240像素（QVGA）分辨率的3D成像能力，作为一款系统级芯片，它集成了CCD像素阵列以及全套控制逻辑，旨在实现设备的高效运作。通信采用高速12位并行视频接口，这使得即使在移动设备中，集成3D摄像头功能所需的额外组件也非常有限。 EPC660支持毫米级测量范围，最大可实现100米内的距离测量，并且在全帧模式下可以提供每秒65帧的TOF图像。通过先进的操作模式，该芯片的性能甚至可以提升到每秒超过1000帧TOF图像。这种高度集成的优势使得基于EPC660的相机系统设计变得简单，元件数量极少，对于简化硬件设计和降低系统总体功耗非常有利。此外，EPC660的光学前端具有极高的灵敏度，这意味着对于照明系统的需求较低，从而进一步降低了整个系统的能耗。该芯片还配备了一个评估套件，其中包括硬件和软件示例，以及详尽的手册，为开发者提供了丰富的开发资源和支持。这款芯片不仅适用于工业和科研应用，也是现代智能设备中增强用户体验，如人脸识别、手势识别等场景的理想选择。"

3.2. Pin1 marking

The following pictures shows the epc660 chip from the bottom side with view to the solder balls. Please note the location of pin 1.

epc660 chip from the solder ball side Top right corner from the solder ball side

Figure 9: Pin 1 marking

3.3. Location of the photosensitive area

The photosensitive area is not marked neither on the front nor on the backside of the IC. As a visible reference, a metal ring of the IC can

be used. From the solder ball side it is visible. Also from the front side (photosensitive area) it can be seen with a camera which is sensitive

in the near infrared wavelength domain (950 .. 1'150nm).

Characteristics subject to change without notice

16 / 116 Datasheet_epc660-V1.09

www.espros.com

Pin 1 Pin 1

3.4. PCB design and SMD manufacturing process considerations

Since the epc660 chip comes in a very small 68 pin chip scale package, the PCB layout should be made with special care. Since the sili -

con chip is small and light weight compared the the solder balls, it is highly recommended that all tracks to the chip should come straight

from the side. A consequent symmetrical design is therefore highly recommended to achieve high production yield.

The pads and the tracks should also have exactly the same width and shall be covered by a solder resist mask in order to avoid drain of

the solder tin alloy to the track.

Track:

0.150

Pad:

 0.250

lde

r s

top

pen



0.3

Pitch: 0.500

Solder stop

covers PCB

and tracks

Analog ground plane

- Fully covered with solder stop

- Thermal heat-sinking (vias) to the PCB backside

- Vias must be filled solid or covered by solder mask

to prevent drain of underfill into or through the vias

Important Note

Due to the thin chip substrate,

unevenness of the substrate surface

will be visible on the top surface of

the chip. This may cause optical issues

and has to be considered carefully.

Figure 10: Recommended PCB layout (all measures in mm)

As shown in Figure 10, a ground plane shall be placed on the top PCB layer underneath the chip. This ground plane acts as a shield to

suppress high frequency emission of fast interface signal lines. It is important that this plane is completely flat. Thus, the plane must not be

scattered nor divided into sections. It should be rather full-faced and no via must be placed in this plane. Otherwise, the chip will pick up

the surface and get bended.

Underfill of the components reduces stress to the solder pads caused by e.g. temperature cycling or mechanical bending.The thermal and

mechanical fatigue will be reduced and the longterm reliability will be increased. Underfill and underfill selection is application specific. It

shall follow JEDEC-STD JEP150: Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Sur-

face- Mount Components.

Please also refer to the application note AN04 - Assembly of Wafer Level Chip Scale (WL-CSP) Packages - which can be downloaded

from the ESPROS website at www.espros.com/application-notes. Obeying the recommendations in the applications AN04, a high manu-

facturing yield can be achieved.

Characteristics subject to change without notice

17 / 116 Datasheet_epc660-V1.09

www.espros.com

3.5. Soldering and IC handling

Since the chip is only 50μm thick, a careful handling during the surface mount assembly process shall be taken in order to avoid mechani-

cal damage. In addition to that, careful PCB layout is needed in order to achieve reliable assembly results with a high yield. Please refer to

the application notes AN04 and AN08 from epc which contains comprehensive information to these topics. This application note can be

downloaded at www.espros.com/application-notes.

Item Description

Solder balls: Alloy Sn96.5Ag3.0Cu0.5 (SAC305)

Soldering profile For infrared or conventional soldering, the solder profile has to follow the recommendations of

IPC/JEDEC J-STD020C (revision C and later) for lead-free assembly.

Soldering lead temperature T

= 260 ºC for 4s with a maximum gradient of 6 ºC/s

Allowed cleaning agents Isopropanol

Packaging technology Bare-die CSP with underfill

Pick and place

Figure 11: Pick & place; left: good nozzle, good picking; right: bad nozzle, bad picking

The nozzle needs a flat surface. It must not touch the pixel-field area.

It should not have any flashes where it touches the chip. The chip can get damaged.

The nozzle has to bring the F

force evenly distributed in a vertical way to the center of the solder

balls during picking and placing. Refer to Figure 11, left picture. It means that it should be large

enough so that it picks the chip not just in the middle of the part but in the area above the solder balls.

Bending of the chip is not allowed. Refer to Figure 11, right picture

Keep attention having no shear forces to the solder balls during picking the chip from the tape pocket

and/or placing.

Maximum vertical force F

per chip: ≤ 0.8 N.

Maximum shear force F

SH_B

per ball: ≤ 0.5 N.

Preferred is forceless picking with vacuum only.

It is also highly recommended to use a „kiss-and-goodbye“ concept to place the component. It means

that the nozzle should blow the part away when it does the placing.

Table 9: IC handling specification

4. Ordering Information

Part Number Part Name Package RoHS compliance

P100 183 epc660-CSP68 CSP68 Yes

P100 244 epc660 Card Edge Connector Carrier PCB 37.25 x 36.00 mm Yes

Table 10: Ordering Information

Figure 12: epc660-CSP68

(bottom and top side)

Figure 13: epc660 Card Edge Connector Carrier

Characteristics subject to change without notice

18 / 116 Datasheet_epc660-V1.09

www.espros.com

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