飞思卡尔Cortex-A8双核处理器IMX6Q7CVT08AD数据手册

需积分: 16 104 浏览量更新于2024-07-18 收藏 3.02MB PDF 举报

飞思卡尔半导体公司发布了MCIMX6DQIEC_MCIMX6Q7CVT08AD芯片的数据手册，该芯片基于Cortex-A8架构，拥有双核设计，隶属于飞思卡尔的I.MX系列。这款处理器最高工作频率可达1GHz，集成了先进的Cortex-A9核心，提供强大的处理能力。它具有2D和3D图形处理单元，支持1080p视频处理，并内置了高级的电源管理功能，适用于对性能和能效有高要求的应用场景。每个i.MX6DQ/6Q处理器都配备了一个64位的DDR3/LVDDR3/LPDDR2-1066内存接口，这使得数据传输速度得到了显著提升，能够轻松处理多任务和高性能应用程序的需求。此外，还包括众多外围接口，如Wi-Fi、蓝牙、GPS、硬盘接口、显示和摄像头传感器，使得系统集成更加便捷，扩展性极强。 i.MX6DQ/6Q系列处理器在设计上特别考虑到了多种应用场景，比如需要高性能图形处理的移动设备、嵌入式系统或者需要多媒体处理的智能设备。其关键特性包括： 1. 多级内存系统：处理器内部采用层次化的存储结构，包括L1指令缓存、L1数据缓存、L2缓存以及内部和外部存储器，这种设计有助于提高数据访问效率和降低延迟。 2. 高性能处理器核心：Cortex-A8架构提供了出色的计算性能，对于需要实时处理和复杂算法的任务表现出色。 3. 图形和视频处理能力：内置的2D和3D图形处理器支持高清视频播放和图形渲染，适合于游戏开发、视频编辑等应用。 4. 灵活的接口选项：丰富的外设接口支持各种标准，便于与其他硬件设备进行高效通信和数据交换。 5. 功耗管理：内置的电源管理技术可优化能耗，延长电池寿命，适合低功耗场景。飞思卡尔的MCIMX6DQIEC_MCIMX6Q7CVT08AD是一款针对高性能和多样应用场景设计的双核Cortex-A8处理器，具备卓越的运算能力、内存管理和丰富的接口，是寻求高性能和低功耗解决方案的工程师们的理想选择。

i.MX 6Dual/6Quad Applications Processors for Industrial Products, Rev. 4, 07/2015

16 Freescale Semiconductor Inc.

Modules List

uSDHC-1

uSDHC-2

uSDHC-4

SD/MMC and SDXC

Enhanced

Multi-Media Card /

Secure Digital Host

Controller

Connectivity

Peripherals

i.MX 6Dual/6Quad specific SoC characteristics:

All four MMC/SD/SDIO controller IPs are identical and are based on the

uSDHC IP. They are:

• Conforms to the SD Host Controller Standard Specification version 3.0

• Fully compliant with MMC command/response sets and Physical Layer

as defined in the Multimedia Card System Specification,

v4.2/4.3/4.4/4.41 including high-capacity (size > 2 GB) cards HC MMC.

Hardware reset as specified for eMMC cards is supported at ports #3

and #4 only.

• Fully compliant with SD command/response sets and Physical Layer

as defined in the SD Memory Card Specifications, v3.0 including

high-capacity SDHC cards up to 32 GB and SDXC cards up to 2TB.

• Fully compliant with SDIO command/response sets and

interrupt/read-wait mode as defined in the SDIO Card Specification,

Part E1, v1.10

• Fully compliant with SD Card Specification, Part A2, SD Host

Controller Standard Specification, v2.00

All four ports support:

• 1-bit or 4-bit transfer mode specifications for SD and SDIO cards up to

UHS-I SDR104 mode (104 MB/s max)

• 1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 52

MHz in both SDR and DDR modes (104 MB/s max)

However, the SoC-level integration and I/O muxing logic restrict the

functionality to the following:

• Instances #1 and #2 are primarily intended to serve as external slots or

interfaces to on-board SDIO devices. These ports are equipped with

“Card Detection” and “Write Protection” pads and do not support

hardware reset.

• Instances #3 and #4 are primarily intended to serve interfaces to

embedded MMC memory or interfaces to on-board SDIO devices.

These ports do not have “Card detection” and “Write Protection” pads

and do support hardware reset.

• All ports can work with 1.8 V and 3.3 V cards. There are two completely

independent I/O power domains for Ports #1 and #2 in four bit

configuration (SD interface). Port #3 is placed in his own independent

power domain and port #4 shares power domain with some other

interfaces.

VDOA VDOA Multimedia

Peripherals

The Video Data Order Adapter (VDOA) is used to re-order video data from

the “tiled” order used by the VPU to the conventional raster-scan order

needed by the IPU.

VPU Video Processing

Unit

Multimedia

Peripherals

A high-performing video processing unit (VPU), which covers many

SD-level and HD-level video decoders and SD-level encoders as a

multi-standard video codec engine as well as several important video

processing, such as rotation and mirroring.

See the i.MX 6Dual/6Quad reference manual (IMX6DQRM) for complete

list of VPU’s decoding/encoding capabilities.

WDOG-1 Watchdog Timer

Peripherals

The Watchdog Timer supports two comparison points during each

counting period. Each of the comparison points is configurable to evoke

an interrupt to the ARM core, and a second point evokes an external event

on the WDOG line.

Table 2. i.MX 6Dual/6Quad Modules List (continued)

Block

Mnemonic

Block Name Subsystem Brief Description

Modules List

i.MX 6Dual/6Quad Applications Processors for Industrial Products, Rev. 4, 07/2015

Freescale Semiconductor Inc. 17

3.1 Special Signal Considerations

The package contact assignments can be found in Section 6, “Package Information and Contact

Assignments.” Signal descriptions are defined in the i.MX 6Dual/6Quad reference manual

(IMX6DQRM). Special signal consideration information is contained in the Hardware Development

Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors

(IMX6DQ6SDLHDG).

3.2 Recommended Connections for Unused Analog Interfaces

The recommended connections for unused analog interfaces can be found in the section, “Unused analog

interfaces,” of the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of

Applications Processors (IMX6DQ6SDLHDG).

WDOG-2

(TZ)

Watchdog

(TrustZone)

Timer

Peripherals

The TrustZone Watchdog (TZ WDOG) timer module protects against

TrustZone starvation by providing a method of escaping normal mode and

forcing a switch to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. Such a situation is

undesirable as it can compromise the system’s security. Once the TZ

WDOG module is activated, it must be serviced by TZ software on a

periodic basis. If servicing does not take place, the timer times out. Upon

a time-out, the TZ WDOG asserts a TZ mapped interrupt that forces

switching to the TZ mode. If it is still not served, the TZ WDOG asserts a

security violation signal to the CSU. The TZ WDOG module cannot be

programmed or deactivated by a normal mode Software.

EIM NOR-Flash /PSRAM

interface

Connectivity

Peripherals

The EIM NOR-FLASH / PSRAM provides:

• Support 16-bit (in muxed IO mode only) PSRAM memories (sync and

async operating modes), at slow frequency

• Support 16-bit (in muxed IO mode only) NOR-Flash memories, at slow

frequency

• Multiple chip selects

XTALOSC Crystal Oscillator

interface

— The XTALOSC module enables connectivity to external crystal oscillator

device. In a typical application use-case, it is used for 24 MHz oscillator.

Table 2. i.MX 6Dual/6Quad Modules List (continued)

Block

Mnemonic

Block Name Subsystem Brief Description

Electrical Characteristics

i.MX 6Dual/6Quad Applications Processors for Industrial Products, Rev. 4, 07/2015

Freescale Semiconductor Inc. 19

4.1.2 Thermal Resistance

4.1.2.1 FCPBGA Package Thermal Resistance

Table 5 provides the FCPBGA package thermal resistance data.

LVDS I/O supply voltage Supplies denoted as I/O supply -0.3 2.8 V

VDD_HIGH_IN supply voltage VDD_HIGH_IN -0.3 3.6 V

USB VBUS USB_H1_VBUS/USB_OTG_VBUS — 5.25 V

Input voltage on USB_OTG_DP, USB_OTG_DN,

USB_H1_DP, USB_H1_DN pins

USB_DP/USB_DN -0.3 3.63 V

Input/output voltage range V

out

-0.5 OVDD

+0.3 V

ESD damage immunity:

esd

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage temperature range T

STORAGE

-40 150

OVDD is the I/O supply voltage.

Table 5. FCPBGA Package Thermal Resistance Data

Thermal Parameter Test Conditions Symbol

Value

Unit

No Lid Lid

Junction to Ambient

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Single-layer board (1s); natural convection

Per JEDEC JESD51-3 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified

package.

θJA

31 24 °C/W

Four-layer board (2s2p); natural convection

θJA

22 15 °C/W

Junction to Ambient

Single-layer board (1s); air flow 200 ft/min

Per JEDEC JESD51-6 with the board horizontal.

θJMA

24 17 °C/W

Four-layer board (2s2p); air flow 200 ft/min

θJMA

18 12 °C/W

Junction to Board

1,4

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—R

θJB

12 5 °C/W

Junction to Case (top)

1,5

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1). The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the

interface layer.

—R

θJCtop

<0.1 1 °C/W

Table 4. Absolute Maximum Ratings (continued)

Parameter Description Symbol Min Max Unit

剩余162页未读，继续阅读

DOUSHINIDE

粉丝: 11
资源: 10

飞思卡尔Cortex-A8双核处理器IMX6Q7CVT08AD数据手册

IMX226Datasheet_E_Rev0.rar_imx datasheet_imx*_imx226 datasheet_

【lvgl_gui】100ask_imx6ull_pro开发板系统烧写工具+镜像

imx6q_test.zip_ imx6q_test_IMX6Q_IMX6X can_imx6q can_imx6q iic

IMX291LQR-C_(E)Data_Sheet_E15511C59_IMX291LQR_IMX291_imx291手册_

IMX6DQPCEC.rar_IMX6Q_imx6q资料_imx6中文手册_imx6平台_imx6芯片介绍

gpio.rar_IMX6 GPIO_imx6_imx6 gpio驱动_imx6 驱动_linux gpio

IMX335LQN_SupportPackage、IMX335LQN_Datasheet

IMX117CQT_Data_Sheet

IMX118CQT_Data_Sheet

iMX6SLEVK_DESIGNFILES_IMX6SLEVK_

最新资源