NCV7428
www.onsemi.com
4
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Units
V
S
Maximum DC voltage at V
S
pin −0.3 45 V
V
OUT
Maximum voltage at V
OUT
pin −0.3 6 V
V
LIN
Maximum voltage at LIN bus pin −45 45 V
V
Dig_IO_inputs
Maximum voltage at digital input pins (TxD, EN) −0.3 45 V
V
Dig_IO_outputs
Maximum voltage at digital output pins (RxD, RSTN) −0.3 V
OUT
+0.3 V
T
AMB
Ambient temperature range −40 +125 °C
T
J
Junction temperature range −40 +170 °C
T
STG
Storage temperature range −55 +150 °C
V
ESD
System ESD at pins VS, LIN as per IEC 61000−4−2: 330 W / 150 pF
(Verified by external test house)
≥ ±14
kV
Human body model at pins VS, LIN stressed towards GND with 1500 W / 100 pF ≥ ±8
kV
Human body model at all pins as per JESD22−A114 / AEC−Q100−002
≥ ±4
kV
Charge device model at all pins as per JESD22−C101 / AEC−Q100−011
≥ ±500
V
Machine model; (200 pF; 0.75 mH; 10 W) as per JESD22−A115 / AEC−Q100−003
±200 V
MSL Moisture Sensitivity Level SOIC
DFN
2
1
−
T
SLD
Lead temperature Soldering − Reflow (SMD styles only), Pb−Free (Note 1) 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Table 4. OPERATING RANGES
Symbol Parameter Min Max Units
V
S
VS operating voltage for parametric operation (Note 2) 5.5 28 V
VS operating voltage for limited operation (Note 2) 4 28 V
V
OUT5
Regulated voltage at V
OUT
supply output for 5 V versions 4.9 5.1 V
V
OUT33
Regulated voltage at V
OUT
supply output for 3.3 V versions 3.234 3.366 V
I
VOUT
Current delivered by the V
OUT
regulator 70 mA
V
LIN
Operating voltage at LIN bus pin 0 V
S
V
V
Dig_IO_inputs
Operating voltage at digital input pins (TxD, EN) 0 5.5 V
V
Dig_IO_outputs
Operating voltage at digital output pins (RxD, RSTN) 0 V
OUT
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
2. Below 5.5 V at V
S
pin in normal mode, the bus will either stay recessive or comply with the voltage level specifications and transition time
specifications as required by SAE J2602. It is ensured by the battery monitoring circuit. Above 28 V at V
S
pin, LIN communication is
operational (LIN pin toggling) but parameters cannot be guaranteed. For higher battery voltage operation above 28 V, LIN pull−up resistor
must be selected large enough to avoid clamping of LIN pin by voltage drop over external pull−up resistor and LIN pin min current limitation.
Table 5. THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, SOIC−8 (Note 3)
Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4)
Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5)
R
q
JA
R
q
JA
125
75
°C/W
°C/W
Thermal Characteristics, DFN−8 (Note 3)
Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4)
Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5)
R
q
JA
R
q
JA
133
55
°C/W
°C/W
3. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe
Operating parameters.
4. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage.
5. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage for the signal layer and
4 thermal vias connected between exposed pad and first inner Cu layer.
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