"NCV7428：带有LIN和LDO稳压器的系统基础芯片综合文档"

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The NCV7428 is a comprehensive System Basis Chip (SBC) with integrated LIN and LDO voltage regulator, designed by Semiconductor Components Industries. This chip is specifically developed for automotive Electronic Control Units (ECUs) and combines numerous functions necessary for the proper operation of these units. The NCV7428 not only provides and monitors the low-voltage power supply for the application microcontroller and other loads, but it also includes a LIN transceiver. This integrated functionality allows for efficient and reliable power management and communication within the ECU system. One of the key features of the NCV7428 is its control logic, which ensures a safe power-up sequence. This is essential for automotive applications where stable and controlled power delivery is critical for the proper functioning of the ECUs. Additionally, the chip contains built-in diagnostics and protection features to safeguard the system from potential faults or failures. Furthermore, the NCV7428 offers robust ESD performance, making it suitable for the harsh and demanding conditions present in automotive environments. Its high levels of reliability and durability contribute to the overall safety and longevity of the electronic control systems in vehicles. In summary, the NCV7428 with integrated LIN and LDO voltage regulator is a comprehensive and essential component for automotive ECUs. Its multifunctional capabilities, advanced control logic, and built-in protection features make it a reliable and efficient solution for power management and communication within automotive electronic systems. With the NCV7428, Semiconductor Components Industries provides automotive manufacturers with a high-performance and robust System Basis Chip to meet the stringent requirements of modern vehicle electronics.

NCV7428

www.onsemi.com

Table 3. ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min Max Units

Maximum DC voltage at V

pin −0.3 45 V

OUT

Maximum voltage at V

OUT

pin −0.3 6 V

LIN

Maximum voltage at LIN bus pin −45 45 V

Dig_IO_inputs

Maximum voltage at digital input pins (TxD, EN) −0.3 45 V

Dig_IO_outputs

Maximum voltage at digital output pins (RxD, RSTN) −0.3 V

OUT

+0.3 V

AMB

Ambient temperature range −40 +125 °C

Junction temperature range −40 +170 °C

STG

Storage temperature range −55 +150 °C

ESD

System ESD at pins VS, LIN as per IEC 61000−4−2: 330 W / 150 pF

(Verified by external test house)

≥ ±14

Human body model at pins VS, LIN stressed towards GND with 1500 W / 100 pF ≥ ±8

Human body model at all pins as per JESD22−A114 / AEC−Q100−002

≥ ±4

Charge device model at all pins as per JESD22−C101 / AEC−Q100−011

≥ ±500

Machine model; (200 pF; 0.75 mH; 10 W) as per JESD22−A115 / AEC−Q100−003

±200 V

MSL Moisture Sensitivity Level SOIC

DFN

−

SLD

Lead temperature Soldering − Reflow (SMD styles only), Pb−Free (Note 1) 260 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

Table 4. OPERATING RANGES

Symbol Parameter Min Max Units

VS operating voltage for parametric operation (Note 2) 5.5 28 V

VS operating voltage for limited operation (Note 2) 4 28 V

OUT5

Regulated voltage at V

OUT

supply output for 5 V versions 4.9 5.1 V

OUT33

Regulated voltage at V

OUT

supply output for 3.3 V versions 3.234 3.366 V

VOUT

Current delivered by the V

OUT

regulator 70 mA

LIN

Operating voltage at LIN bus pin 0 V

Dig_IO_inputs

Operating voltage at digital input pins (TxD, EN) 0 5.5 V

Dig_IO_outputs

Operating voltage at digital output pins (RxD, RSTN) 0 V

OUT

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

2. Below 5.5 V at V

pin in normal mode, the bus will either stay recessive or comply with the voltage level specifications and transition time

specifications as required by SAE J2602. It is ensured by the battery monitoring circuit. Above 28 V at V

pin, LIN communication is

operational (LIN pin toggling) but parameters cannot be guaranteed. For higher battery voltage operation above 28 V, LIN pull−up resistor

must be selected large enough to avoid clamping of LIN pin by voltage drop over external pull−up resistor and LIN pin min current limitation.

Table 5. THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, SOIC−8 (Note 3)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5)

125

°C/W

Thermal Characteristics, DFN−8 (Note 3)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5)

133

°C/W

3. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

4. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage.

5. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage for the signal layer and

4 thermal vias connected between exposed pad and first inner Cu layer.

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