"2022年JEDEC MO-276R_0塑料底部注册及其特点总结"

JEDEC MO-276R_0 2022 Registration - Plastic Bottom Grid, Array Ball with a 0.50 mm Pitch Rectangular Family is a recent document that was downloaded on October 25, 2022, at 5:05 pm PDT. The document, accessed by the email address cdm_lj@163.com, pertains to a specific standardized packaging technology for electronic components. This technology involves a plastic bottom grid array ball with a 0.50 mm pitch in a rectangular family configuration. The JEDEC standard outlined in the document serves as a guideline for manufacturers in the electronics industry to ensure compatibility and reliability in the design and production of components. By adhering to this standard, companies can streamline their manufacturing processes and improve interoperability between different components and systems. The document provides detailed specifications and requirements for the plastic bottom grid array ball packaging technology, including dimensions, materials, testing procedures, and other technical considerations. By following these guidelines, manufacturers can produce components that meet industry standards and perform reliably in various applications. Overall, the JEDEC MO-276R_0 2022 Registration - Plastic Bottom Grid, Array Ball with a 0.50 mm Pitch Rectangular Family document plays a crucial role in the advancement of electronic packaging technology. It facilitates standardization and interoperability in the industry, ultimately benefiting manufacturers, consumers, and the overall electronic ecosystem.