Freescale MC9S08AW60 单片机技术手册更新
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"MC9S08AW60.pdf 是Freescale半导体公司关于08系列MC9S08AW60单片机的技术手册补充文档，内容涉及到从黄金线到铜线封装的转变，以及相关器件的更新包装信息。这份文档提供了旧版（黄金线）与新版（铜线）封装的对比表格，并指示用户如何在Freescale官网上查找新包装的图纸。此外，还提到了QFN封装的电气连接推荐指南EB806，用于指导设备的暴露垫上的电气连接建议。"
MC9S08AW60是一款由Freescale Semiconductor生产的微控制器，属于08系列。这份技术手册的补充部分主要关注的是产品封装的变化，由于某些封装从黄金线改为铜线，导致了封装外形编号的变更。这些更改是为了适应技术的发展和改进，比如提高生产效率、降低成本或者改善电气性能。
在文档中列出的表格里，可以看到不同型号的微控制器，如MC9S08AC16、MC9S08GB60A等，它们的原有（黄金线）封装文档编号与当前（铜线）封装文档编号的对应关系。例如，MC9S08AW60的旧版包装文档编号是98ARH99048A，而新版则是98ASA00466D。如果开发者或工程师需要查看新的封装设计，他们可以通过访问Freescale的官方网站，搜索新的98A封装编号来获取详细信息。
此外，文档还提及了QFN（Quad Flat No-Lead，无引脚四方扁平封装）的使用指南EB806，该指南对于理解QFN和DFN（Dual Flat No-Lead，双面无引脚扁平封装）设备的暴露垫上的电气连接具有重要意义。这包括了在使用QFN封装时，如何确保正确且安全的电气连接，以防止潜在的热管理问题和信号完整性问题。
总结起来，这份MC9S08AW60的技术手册补充文档是开发和设计过程中不可或缺的参考资料，它提供了关键的封装更新信息，帮助工程师们适应新的制造标准，同时保证设计的兼容性和可靠性。对于使用或计划使用MC9S08AW60及其相关型号的单片机的开发者来说，了解这些变更和建议是非常重要的。
MC9S08AW60 Data Sheet, Rev 2
14 Freescale Semiconductor
Section Number Title Page
10.4.3 Timer x Counter Modulo Registers (TPMxMODH:TPMxMODL) .............................172
10.4.4 Timer x Channel n Status and Control Register (TPMxCnSC) ....................................173
10.4.5 Timer x Channel Value Registers (TPMxCnVH:TPMxCnVL) ....................................174
10.5 Functional Description ..................................................................................................................175
10.5.1 Counter .........................................................................................................................175
10.5.2 Channel Mode Selection ...............................................................................................176
10.5.3 Center-Aligned PWM Mode ........................................................................................178
10.6 TPM Interrupts ..............................................................................................................................179
10.6.1 Clearing Timer Interrupt Flags .....................................................................................179
10.6.2 Timer Overflow Interrupt Description ..........................................................................179
10.6.3 Channel Event Interrupt Description ............................................................................180
10.6.4 PWM End-of-Duty-Cycle Events .................................................................................180
Chapter 11
Serial Communications Interface (S08SCIV2)
11.1 Introduction ...................................................................................................................................181
11.1.1 Features .........................................................................................................................183
11.1.2 Modes of Operation ......................................................................................................183
11.1.3 Block Diagram ..............................................................................................................183
11.2 Register Definition ........................................................................................................................185
11.2.1 SCI Baud Rate Registers (SCIxBDH, SCIxBHL) ........................................................186
11.2.2 SCI Control Register 1 (SCIxC1) .................................................................................187
11.2.3 SCI Control Register 2 (SCIxC2) .................................................................................188
11.2.4 SCI Status Register 1 (SCIxS1) ....................................................................................189
11.2.5 SCI Status Register 2 (SCIxS2) ....................................................................................191
11.2.6 SCI Control Register 3 (SCIxC3) .................................................................................191
11.2.7 SCI Data Register (SCIxD) ..........................................................................................192
11.3 Functional Description ..................................................................................................................192
11.3.1 Baud Rate Generation ...................................................................................................193
11.3.2 Transmitter Functional Description ..............................................................................193
11.3.3 Receiver Functional Description ..................................................................................194
11.3.4 Interrupts and Status Flags ...........................................................................................196
11.3.5 Additional SCI Functions .............................................................................................197
Chapter 12
Serial Peripheral Interface (S08SPIV3)
12.0.1 Features .........................................................................................................................201
12.0.2 Block Diagrams ............................................................................................................201
12.0.3 SPI Baud Rate Generation ............................................................................................203
12.1 External Signal Description ..........................................................................................................204
12.1.1 SPSCK — SPI Serial Clock .........................................................................................204
12.1.2 MOSI — Master Data Out, Slave Data In ....................................................................204
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