NXP i.MX6 UltraLite 数据手册：工业级ARMCortex-A7处理器

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"IMX6UL数据手册是关于NXP Semiconductors的i.MX6 UltraLite系列处理器的技术文档，主要介绍了该处理器的特性、技术规格和封装信息。手册适用于工业级应用，包含了多个型号如MCIMX6G1CVM05AA到MCIMX6G3CVK05AB的详细数据。" 本文将详细阐述i.MX6 UltraLite处理器的关键知识点： 1. **i.MX6 UltraLite处理器家族**：这是一款基于ARMCortex-A7内核的高性能、超低功耗处理器。它由NXP Semiconductors设计，旨在为嵌入式和工业应用提供强大且节能的计算能力。 2. **Cortex-A7核心**：Cortex-A7是ARM Holdings的一个32位微处理器架构，以其高效能与低功耗著称。在i.MX6 UltraLite中，该核心可以运行在高达528MHz的速度，适合对处理速度有一定要求但又需考虑功耗的应用场景。 3. **处理器速度与性能**：最高528MHz的工作频率使得i.MX6 UltraLite能够快速执行复杂指令，满足实时操作系统和多任务处理的需求。 4. **集成电源管理**：i.MX6 UltraLite集成了电源管理功能，有助于优化系统能耗，适应各种电源条件，延长电池寿命，尤其适合移动和物联网(IoT)设备。 5. **封装选项**：提供两种塑料封装形式，即BGA14x14mm，0.8mm节距和BGA9x9mm，0.5mm节距。这些封装设计考虑了不同应用的空间和散热需求。 6. **订购信息**：手册中包含表格提供了详细的订购信息，帮助客户选择合适的处理器型号。表格通常包括产品代码、版本和物理特性等关键信息。 7. **工业级应用**：作为工业级产品，i.MX6 UltraLite设计考虑了在严苛环境下的稳定性和可靠性，能够承受宽温度范围和高振动等级。 8. **技术数据**：文档中的技术数据涵盖了电气特性、接口规范、内存配置、安全认证等多个方面，为系统设计者提供了全面的参考信息。 9. **应用领域**：i.MX6 UltraLite处理器广泛应用在智能家电、汽车电子、医疗设备、工业自动化、消费电子等需要高性能低功耗解决方案的领域。 i.MX6 UltraLite处理器是NXP Semiconductors的一款重要产品，其强大的单核Cortex-A7架构和出色的能效比，使其成为工业级嵌入式系统的理想选择。通过深入理解数据手册，开发者可以有效地利用其特性来设计和实现高效的嵌入式系统。

i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017

14 NXP Semiconductors

Modules list

QSPI Quad SPI Connectivity

peripherals

Quad SPI module act as an interface to external serial

flash devices. This module contains the following

features:

• Flexible sequence engine to support various flash

vendor devices

• Single pad/Dual pad/Quad pad mode of operation

• Single Data Rate/Double Data Rate mode of

operation

• Parallel Flash mode

• DMA support

• Memory mapped read access to connected flash

devices

• Multi-master access with priority and flexible and

configurable buffer for each master

SAI1

SAI2

SAI3

— — The SAI module provides a synchronous audio

interface (SAI) that supports full duplex serial interfaces

with frame synchronization, such as I2S, AC97, TDM,

and codec/DSP interfaces.

SDMA Smart Direct Memory

Access

System Control

Peripherals

The SDMA is multi-channel flexible DMA engine. It

helps in maximizing system performance by off-loading

the various cores in dynamic data routing. It has the

following features:

• Powered by a 16-bit instruction-set micro-RISC

engine

• Multi-channel DMA supporting up to 32 time-division

multiplexed DMA channels

• 48 events with total flexibility to trigger any

combination of channels

• Memory accesses including linear, FIFO, and 2D

addressing

• Shared peripherals between ARM and SDMA

• Very fast context-switching with 2-level priority based

preemptive multi-tasking

• DMA units with auto-flush and prefetch capability

• Flexible address management for DMA transfers

(increment, decrement, and no address changes on

source and destination address)

• DMA ports can handle unit-directional and

bi-directional flows (copy mode)

• Support of byte-swapping

• Library of Scripts and API is available

2x SIMv2 Smart Card Connectivity

peripherals

Smart card interface compliant with ISO7816.

Table 3. i.MX 6UltraLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

Click to BUY NOW!

Modules list

i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017

NXP Semiconductors 15

SJC System JTAG Controller System Control

Peripherals

The SJC provides JTAG interface, which complies with

JTAG TAP standards, to internal logic. The i.MX

6UltraLite processors use JTAG port for production,

testing, and system debugging. In addition, the SJC

provides BSR (Boundary Scan Register) standard

support, which complies with IEEE1149.1 and

IEEE1149.6 standards.

The JTAG port must be accessible during platform initial

laboratory bring-up, for manufacturing tests and

troubleshooting, as well as for software debugging by

authorized entities. The i.MX 6UltraLite SJC

incorporates three security modes for protecting

against unauthorized accesses. Modes are selected

through eFUSE configuration.

SNVS Secure Non-Volatile

Storage

Security Secure Non-Volatile Storage, including Secure Real

Time Clock, Security State Machine, Master Key

Control, and Violation/Tamper Detection and reporting.

SPDIF Sony Philips Digital

Interconnect Format

Multimedia

Peripherals

A standard audio file transfer format, developed jointly

by the Sony and Phillips corporations. Has Transmitter

and Receiver functionality.

System Counter — — The system counter module is a programmable system

counter which provides a shared time base to the

Cortex A series cores as part of ARM’s generic timer

architecture. It is intended for use in application where

the counter is always powered on and supports

multiple, unrelated clocks.

TSC Touch Screen Touch Controller With touch controller to support 4-wire and 5-wire

resistive touch panel.

TZASC Trust-Zone Address

Space Controller

Security The TZASC (TZC-380 by ARM) provides security

address region control functions required for intended

application. It is used on the path to the DRAM

controller.

UART1

UART2

UART3

UART4

UART5

UART6

UART7

UART8

UART Interface Connectivity

Peripherals

Each of the UART modules support the following serial

data transmit/receive protocols and configurations:

• 7- or 8-bit data words, 1 or 2 stop bits, programmable

parity (even, odd or none)

• Programmable baud rates up to 5 Mbps.

• 32-byte FIFO on Tx and 32 half-word FIFO on Rx

supporting auto-baud

Table 3. i.MX 6UltraLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

Click to BUY NOW!

i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017

16 NXP Semiconductors

Modules list

uSDHC1

uSDHC2

SD/MMC and SDXC

Enhanced Multi-Media

Card / Secure Digital Host

Controller

Connectivity

Peripherals

i.MX 6UltraLite specific SoC characteristics:

All four MMC/SD/SDIO controller IPs are identical and

are based on the uSDHC IP. They are:

• Fully compliant with MMC command/response sets

and Physical Layer as defined in the Multimedia

Card System Specification, v4.5/4.2/4.3/4.4/4.41/

including high-capacity (size > 2 GB) cards HC

MMC.

• Fully compliant with SD command/response sets

and Physical Layer as defined in the SD Memory

Card Specifications, v3.0 including high-capacity

SDXC cards up to 2 TB.

• Fully compliant with SDIO command/response sets

and interrupt/read-wait mode as defined in the SDIO

Card Specification, Part E1, v3.0

Two ports support:

• 1-bit or 4-bit transfer mode specifications for SD and

SDIO cards up to UHS-I SDR104 mode (104 MB/s

max)

• 1-bit, 4-bit, or 8-bit transfer mode specifications for

MMC cards up to 52 MHz in both SDR and DDR

modes (104 MB/s max)

• 4-bit or 8-bit transfer mode specifications for eMMC

chips up to 200 MHz in HS200 mode (200 MB/s max)

USB Universal Serial Bus 2.0 Connectivity

Peripherals

USBO2 (USB OTG1 and USB OTG2) contains:

• Two high-speed OTG 2.0 modules with integrated

HS USB PHYs

• Support eight Transmit (TX) and eight Receive (Rx)

endpoints, including endpoint 0

WDOG1

WDOG3

Watch Dog Timer Peripherals The Watch Dog Timer supports two comparison points

during each counting period. Each of the comparison

points is configurable to evoke an interrupt to the ARM

core, and a second point evokes an external event on

the WDOG line.

WDOG2

(TZ)

Watch Dog (TrustZone) Timer Peripherals The TrustZone Watchdog (TZ WDOG) timer module

protects against TrustZone starvation by providing a

method of escaping normal mode and forcing a switch

to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. Such

situation is undesirable as it can compromise the

system’s security. Once the TZ WDOG module is

activated, it must be serviced by TZ software on a

periodic basis. If servicing does not take place, the timer

times out. Upon a time-out, the TZ WDOG asserts a TZ

mapped interrupt that forces switching to the TZ mode.

If it is still not served, the TZ WDOG asserts a security

violation signal to the CSU. The TZ WDOG module

cannot be programmed or deactivated by a normal

mode SW.

Table 3. i.MX 6UltraLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

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Modules list

i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017

NXP Semiconductors 17

3.1 Special signal considerations

Table 4 lists special signal considerations for the i.MX 6UltraLite processors. The signal names are listed

in alphabetical order.

The package contact assignments can be found in Section 6, “Package information and contact

assignments".” Signal descriptions are provided in the i.MX 6UltraLite Reference Manual

(IMX6ULRM).

Table 4. Special Signal Considerations

Signal Name Remarks

CCM_CLK1_P/

CCM_CLK1_N

One general purpose differential high speed clock Input/output is provided.

It can be used:

• To feed external reference clock to the PLLs and further to the modules inside SoC.

• To output internal SoC clock to be used outside the SoC as either reference clock or as a

functional clock for peripherals.

See the i.MX 6UltraLite Reference Manual (IMX6ULRM) for details on the respective clock trees.

Alternatively one may use single ended signal to drive CLK1_P input. In this case corresponding

CLK1_N input should be tied to the constant voltage level equal 1/2 of the input signal swing.

Termination should be provided in case of high frequency signals.

After initialization, the CLK1 input/output can be disabled (if not used). If unused either or both of

the CLK1_N/P pairs may remain unconnected.

RTC_XTALI/RTC_XTALO If the user wishes to configure RTC_XTALI and RTC_XTALO as an RTC oscillator, a 32.768 kHz

crystal, (100 k ESR, 10 pF load) should be connected between RTC_XTALI and RTC_XTALO.

Keep in mind the capacitors implemented on either side of the crystal are about twice the crystal

load capacitor. To hit the exact oscillation frequency, the board capacitors need to be reduced to

account for board and chip parasitics. The integrated oscillation amplifier is self biasing, but

relatively weak. Care must be taken to limit parasitic leakage from RTC_XTALI and RTC_XTALO

to either power or ground (>100 M). This will debias the amplifier and cause a reduction of startup

margin. Typically RTC_XTALI and RTC_XTALO should bias to approximately 0.5 V.

If it is desired to feed an external low frequency clock into RTC_XTALI, the RTC_XTALO pin must

remain unconnected or driven with a complimentary signal. The logic level of this forcing clock

should not exceed VDD_SNVS_CAP level and the frequency should be <100 kHz under typical

conditions.

In case when high accuracy real time clock are not required system may use internal low frequency

ring oscillator. It is recommended to connect RTC_XTALI to GND and keep RTC_XTALO

unconnected.

XTALI/XTALO A 24.0 MHz crystal should be connected between XTALI and XTALO.

The crystal must be rated for a maximum drive level of 250 W. An ESR (equivalent series

resistance) of typical 80  is recommended. NXP BSP (board support package) software requires

24 MHz on XTALI/XTALO.

The crystal can be eliminated if an external 24 MHz oscillator is available in the system. In this

case, XTALO must be directly driven by the external oscillator and XTALI mounted with 18 pF

capacitor. Please refer to the EVK board reference design for details. The logic level of this forcing

clock cannot exceed NVCC_PLL level.

If this clock is used as a reference for USB, then there are strict frequency tolerance and jitter

requirements. See OSC24M chapter and relevant interface specifications chapters for details.

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i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017

18 NXP Semiconductors

Modules list

DRAM_VREF When using DDR_VREF with DDR I/O, the nominal reference voltage must be half of the

NVCC_DRAM supply. The user can tie DDR_VREF to a precision external resistor divider. Use a

1k 0.5% resistor to GND and a 1 k 0.5% resistor to NVCC_DRAM. Shunt each resistor with a

closely-mounted 0.1 µF capacitor.

To reduce supply current, a pair of 1.5 k 0.1% resistors can be used. Using resistors with

recommended tolerances ensures the ± 2% DDR_VREF tolerance (per the DDR3 specification) is

maintained when two DDR3 ICs plus the i.MX 6UltraLite are drawing current on the resistor divider.

ZQPAD DRAM calibration resistor 240  1% used as reference during DRAM output buffer driver

calibration should be connected between this pad and GND.

GPANAIO This signal is reserved for NXP manufacturing use only. This output must remain unconnected.

JTAG_nnnn The JTAG interface is summarized in Table 5. Use of external resistors is unnecessary. However,

if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is

followed. For example, do not use an external pull down on an input that has on-chip pull-up.

JTAG_TDO is configured with a keeper circuit such that the non-connected condition is eliminated

if an external pull resistor is not present. An external pull resistor on JTAG_TDO is detrimental and

should be avoided.

JTAG_MOD is referenced as SJC_MOD in the i.MX 6UltraLite reference manual. Both names refer

to the same signal. JTAG_MOD must be externally connected to GND for normal operation.

Termination to GND through an external pull-down resistor (such as 1 k) is allowed. JTAG_MOD

set to hi configures the JTAG interface to mode compliant with IEEE1149.1 standard. JTAG_MOD

set to low configures the JTAG interface for common SW debug adding all the system TAPs to the

chain.

NC These signals are No Connect (NC) and should be floated by the user.

POR_B This cold reset negative logic input resets all modules and logic in the IC.

May be used in addition to internally generated power on reset signal (logical AND, both internal

and external signals are considered active low).

ONOFF ONOFF can be configured in debounce, off to on time, and max time-out configurations. The

debounce and off to on time configurations supports 0, 50, 100 and 500 ms. Debounce is used to

generate the power off interrupt. While in the ON state, if ONOFF button is pressed longer than the

debounce time, the power off interrupt is generated. Off to on time supports the time it takes to

request power on after a configured button press time has been reached. While in the OFF state,

if ONOFF button is pressed longer than the off to on time, the state will transition from OFF to ON.

Max time-out configuration supports 5, 10, 15 seconds and disable. Max time-out configuration

supports the time it takes to request power down after ONOFF button has been pressed for the

defined time.

TEST_MODE TEST_MODE is for NXP factory use. The user must tie this pin directly to GND.

Table 5. JTAG Controller Interface Summary

JTAG I/O Type On-chip Termination

JTAG_TCK Input 47 kpull-up

JTAG_TMS Input 47 kpull-up

JTAG_TDI Input 47 kpull-up

JTAG_TDO 3-state output Keeper

Table 4. Special Signal Considerations (continued)

Signal Name Remarks

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