3
®
BUF600, 601
BUF600AP, AU BUF601AU
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
HARMONIC DISTORTION
Second Harmonic f = 10MHz, V
O
= 1.4Vp-p –65 –65 dBc
Third Harmonic –64 –67 dBc
Second Harmonic f = 30MHz, V
O
= 1.4Vp-p –51 –59 dBc
Third Harmonic –56 –62 dBc
Second Harmonic f = 50MHz, V
O
= 1.4Vp-p –43 –53 dBc
Third Harmonic –48 –54 dBc
GAIN FLATNESS PEAKING
V
O
= 0.4Vp-p, DC to 30MHz 0.01 0.005 dB
V
O
= 0.4Vp-p, 30MHz to 300MHz 0.3 0.1 dB
LINEAR PHASE DEVIATION
V
O
= 0.4Vp-p, DC to 30MHz 5.5 3.8 Degrees
V
O
= 0.4Vp-p, 30 to 300MHz 55 45 Degrees
TIME DOMAIN
RISE TIME 10% to 90%, 700ps
1.4Vp-p Step 0.82 0.87 ns
2.8Vp-p Step 0.97 0.95 ns
5.0Vp-p Step 1.18 1.13 ns
SLEW RATE
V
O
= 1.4Vp-p 1500 1500 V/µs
V
O
= 2.8Vp-p 2400 2400 V/µs
V
O
= 5.0Vp-p 3400 3600 V/µs
AC-SPECIFICATIONS (CONT)
At V
CC
= ±5V, R
LOAD
= 200Ω (BUF600) and 100Ω (BUF601), R
SOURCE
= 50Ω, and T
AMB
= +25°C, unless otherwise noted.
PIN CONFIGURATION
Top View
DIP/SO-8
FUNCTION DESCRIPTION
In Analog Input
Out Analog Output
+V
CC
Positive Supply Voltage; typical +5VDC
–V
CC
Negative Supply Voltage; typical –5VDC
FUNCTIONAL DESCRIPTION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
Power Supply Voltage .......................................................................... ±6V
Input Voltage
(1)
......................................................................... ±V
CC
±0.7V
Operating Temperature..................................................... –40°C to +85°C
Storage Temperature ...................................................... –40°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ................................................ +300°C
NOTE: (1) Inputs are internally diode-clamped to ±V
CC.
ABSOLUTE MAXIMUM RATINGS
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
(1)
RANGE
BUF600AP Plastic 8-Pin DIP 006 –40°C to +85°C
BUF600AU SO-8 Surface Mount 182 –40°C to +85°C
BUF601AU SO-8 Surface Mount 182 –40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION
1
2
3
4
8
7
6
5
+V
CC
NC
NC
In
Out
NC
NC
–V
CC
BUF600, BUF601
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.