TI RF430FRL154H：低功耗13.56MHz射频传感器与控制器

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TI-RF430FRL154H是一款专为物联网 (IoT) 应用设计的高性能低功耗无线传感器解决方案。该设备的核心是MSP430™混合信号微控制器，具备以下关键特性： 1. **射频接口兼容性**：支持ISO/IEC 15693和ISO/IEC 18000-3 (模式1) 标准，使其适用于工业和医疗领域的无线通信。 2. **高效时钟系统**：内置4MHz高频时钟和256kHz低频时钟源，以及外部时钟输入，提供了灵活性和精确性。 3. **电源选项**：可以使用电池供电，也可通过13.56MHz磁场获得能量，适应多样化的能源需求。 4. **传感器接口**：集成14位Σ-Δ模数转换器(ADC) 和16位Timer_A，支持电阻传感器，并配备CRC16CCITT生成器。 5. **低功耗模式**：在激活模式下，功率消耗为140 µA/MHz，而在待机模式(LPM3)下仅16 µA，显著延长电池寿命。 6. **内存和存储**：包括2KB FRAM用于存储程序代码，4KB SRAM和8KB ROM，以及开发模式下的8KB ROM映射到SRAM便于固件开发。 7. **通信接口**：eUSCI_B模块支持3线和4线SPI和I2C通信，方便与外部设备交互。 8. **微控制器特性**：基于16位RISC架构，CPU系统时钟可达2MHz，具备全4线制JTAG调试接口。 9. **应用场景**：适用于工业无线传感器网络和医用无线传感器环境，例如用于追踪、监测和数据采集。 10. **说明文档**：用户可以参考《RF430FRL15xH系列技术参考手册》(SLAU506) 了解完整模块细节，以及《RF430FRL15xH固件用户指南》(SLAU603) 学习应用操作和编程技巧。这款RF430FRL154H芯片因其集成度高、功耗低和广泛的应用兼容性，在物联网领域具有很高的实用价值，特别适合那些对无线通信、电池续航和数据存储有严格要求的应用项目。

RF430FRL152H, RF430FRL153H, RF430FRL154H

ZHCSD28C –NOVEMBER 2012–REVISED DECEMBER 2014

www.ti.com.cn

5 Specifications

5.1 Absolute Maximum Ratings

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

MIN MAX UNIT

Voltage applied at V

DDB

referenced to V

AMR

) -0.3 1.65 V

Voltage applied at V

ANT

referenced to V

AMR

) -0.3 3.6 V

Voltage applied to any pin (references to V

) -0.3 V

DDB

+ 0.3 V

Diode current at any device pin

(2)

±2 mA

Current derating factor when I/O ports are switched in parallel electrically and logically

(3)

0.9

Storage temperature range, T

stg

(4) (5) (6)

-40 125 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are referenced to V

(3) The diode current increases to ±4.5 mA when two pins are connected, it increases to ±6.75 mA when three pins are connected, and so

on.

(4) Soldering during board manufacturing must follow the current JEDEC J-STD-020 specification with peak reflow temperatures not higher

than classified on the device label on the shipping boxes or reels. If hand soldering is required for application prototyping, peak

temperature must not exceed 250°C for a total of 5 minutes for any single device.

(5) Data retention on FRAM memory cannot be ensured when exceeding the specified maximum storage temperature, T

stg

(6) Programming of devices with user application code should only be performed after reflow or hand soldering. Factory programmed

information, such as calibration values, are designed to withstand the temperatures reached in the current JEDEC J-STD-020

specification.

5.2 ESD Ratings

VALUE UNIT

Electrostatic discharge (ESD)

ESD

Human body model (HBM), per ANSI/ESDA/JEDEC JS001

(1)(2)

±2000 V

performance

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) Low leakage pin: ADC0 has reduced ESD tolerance of ±500 V HBM.

5.3 Recommended Operating Conditions

Typical data are based on V

DDB

= 1.5 V, T

= 25°C (unless otherwise noted)

MIN NOM MAX UNIT

DDB

Supply voltage during program execution 1.45 1.65 V

Supply voltage (GND reference) 0 V

Operating free-air temperature 0 70 °C

VDDB

Capacitor on V

DDB

(1)

100 nF

VDDSW

Capacitor on V

DDSW

(1)

2.2 µF

Charge pump capacitor between CP1 and CP2.

FLY

10 nF

Recommended ratio between C

FLY

and C

VDD2X

is ≥ 1:10.

(1)

Capacitor on V

DD2x

VDD2X

100 nF

Recommended ratio between C

FLY

and C

VDD2X

is ≥ 1:10.

(1)

VDDD

Capacitor on V

DDD

(1)

1 µF

SVSS

Capacitor between SVSS and V

(1)

1 µF

SYSTEM

System frequency

(2) (3)

2 MHz

CLKIN

External clock input frequency 32 kHz

(1) Low equivalent series resistance (ESR) capacitor

(2) The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the

specified maximum frequency.

(3) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.

Submit Documentation Feedback

Product Folder Links: RF430FRL152H RF430FRL153H RF430FRL154H

RF430FRL152H, RF430FRL153H, RF430FRL154H

www.ti.com.cn

ZHCSD28C –NOVEMBER 2012–REVISED DECEMBER 2014

5.4 Recommended Operating Conditions, Resonant Circuit

MIN NOM MAX UNIT

Carrier frequency 13.56 MHz

ANT_peak

Antenna input voltage 3.6 V

Z Impedance of LC circuit 6.5 15.5 kΩ

RES

Coil inductance 2.66 µH

RES

Resonance capacitance 51.8 – C

(1)

QT Tank quality factor 30

(1) See the RF13M parameter section.

5.5 Active Mode Supply Current Into V

DDB

Excluding External Current

over recommended operating free-air temperature (unless otherwise noted)

(1)

Frequency (f

MCLK

= f

SMCLK

)

EXECUTION

PARAMETER V

DDB

1 MHz 2 MHz UNIT

MEMORY

TYP MAX TYP MAX

AM, FRAM

(2)

FRAM 1.5 V 330 420 480 580 µA

AM, RAM

(2)

RAM 1.5 V 220 300 250 320 µA

AM, ROM

(2)

ROM 1.5 V 220 300 230 300 µA

(1) All inputs are tied to 0 V or to V

. Outputs do not source or sink any current.

(2) f

ACLK

= 256 kHz, CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0

5.6 Low-Power Mode Supply Current (Into V

DDB

) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

(1)

0ºC 20ºC 45ºC 70ºC

PARAMETER V

DDB

UNIT

TYP MAX TYP MAX TYP MAX TYP MAX

MCLK

= off, f

SMCLK

1 MHz, f

ACLK

= 32 kHz,

LPM0

(2)

1.5 V 170 230 190 210 260 340 µA

CPUOFF = 1, SCG0 = 0,

SCG1 = 0, OSCOFF = 0

MCLK

= f

SMCLK

= off,

ACLK

= 16 kHz,

LPM3

(3)

1.5 V 12 20 13 16 25 65 µA

CPUOFF = 1, SCG0 = 1,

SCG1 = 1, OSCOFF = 0

MCLK

= f

SMCLK

= f

ACLK

0 Hz

LPM4

(4)

1.5 V 11 16 12 15 24 60 µA

CPUOFF = 1, SCG0 = 1,

SCG1 = 1, OSCOFF = 1

(1) Including current for WDT clocked by ACLK.

(2) CSS: SELM=SELS=HF_CLK, SELA=LF_CLK, DIVM=/2 (2MHz), DIVS=/4 (1MHz), DIVA=/8 (32kHz)

SD14: reset values

RFPMM: battery switch on (EN_BATSWITCH=1)

(3) CSS: SELM=HF_CLK, SELS=SELA=LF_CLK, DIVM=/2 (2MHz), DIVS=/32 (8kHz), DIVA=/16 (16kHz)

SD14: reset values

RFPMM: EN_BATSWITCH=1(battery switch enabled)

(4) CSS: SELM=HF_CLK, SELS=SELA=LF_CLK, DIVM=/2 (2MHz), DIVS=/32 (8kHz), DIVA=/16 (16kHz)

SD14: reset values

RFPMM: EN_BATSWITCH=1(battery switch enabled)

Submit Documentation Feedback

Product Folder Links: RF430FRL152H RF430FRL153H RF430FRL154H

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