表 16-4. CANBIT 寄存器值 .............................................................................................. 942
表 16-5. CAN 寄存器映射 ................................................................................................ 945
表 17-1. 模拟比较器触发 信号 (64LQFP) .......................................................................... 976
表 17-2. 内部参考电压和 ACREFCTL 域值 ....................................................................... 978
表 17-3. 模拟比较器参考电压特性,V
DDA
= 3.3V,EN= 1 且 RNG = 0 ............................... 979
表 17-4. 模拟比较器参考电压特性,V
DDA
= 3.3V,EN= 1 且 RNG = 1 ............................... 979
表 17-5. 模拟比较器触发 寄存器映射 ................................................................................ 980
表 18-1. PWM 信号 (64LQFP) ......................................................................................... 991
表 18-2. PWM 寄存器映射 ............................................................................................... 998
表 19-1. QEI 信号 (64LQFP) .......................................................................................... 1064
表 19-2. QEI 寄存器映射 ............................................................................................... 1067
表 21-1. 默认为复用功能的 GPIO 管脚 ........................................................................... 1085
表 21-2. 按管脚编号分类的信号 ..................................................................................... 1086
表 21-3. 按信号名称分类的信号 ..................................................................................... 1092
表 21-4. 按功能分类的信号(GPIO 除外) ..................................................................... 1099
表 21-5. GPIO 管脚和复用功能 ...................................................................................... 1106
表 21-6. 复用功能的可能的管脚赋值 ............................................................................... 1109
表 21-7. 未用信号的连接(64 管脚 LQFP) .................................................................... 1112
表 22-1. Maximum Ratings ............................................................................................ 1113
表 22-2. ESD Absolute Maximum Ratings ...................................................................... 1113
表 22-3. Temperature Characteristics ............................................................................. 1114
表 22-4. Thermal Characteristics ................................................................................... 1114
表 22-5. Recommended DC Operating Conditions .......................................................... 1115
表 22-6. Recommended GPIO Pad Operating Conditions ................................................ 1115
表 22-7. GPIO Current Restrictions ................................................................................ 1115
表 22-8. GPIO Package Side Assignments ..................................................................... 1116
表 22-9. JTAG Characteristics ....................................................................................... 1118
表 22-10. Power-On and Brown-Out Levels ...................................................................... 1120
表 22-11. Reset Characteristics ....................................................................................... 1125
表 22-12. LDO Regulator Characteristics ......................................................................... 1127
表 22-13. Phase Locked Loop (PLL) Characteristics ......................................................... 1128
表 22-14. Actual PLL Frequency ...................................................................................... 1128
表 22-15. PIOSC Clock Characteristics ............................................................................ 1129
表 22-16. Low-Frequency internal Oscillator Characteristics .............................................. 1129
表 22-17. Main Oscillator Input Characteristics ................................................................. 1129
表 22-18. Crystal Parameters .......................................................................................... 1131
表 22-19. Supported MOSC Crystal Frequencies .............................................................. 1132
表 22-20. System Clock Characteristics with ADC Operation ............................................. 1132
表 22-21. Sleep Modes AC Characteristics ....................................................................... 1133
表 22-22. Time to Wake with Respect to Low-Power Modes .............................................. 1133
表 22-23. Flash Memory Characteristics ........................................................................... 1135
表 22-24. EEPROM Characteristics ................................................................................. 1135
表 22-25. GPIO Module Characteristics ............................................................................ 1136
表 22-26. Pad Voltage/Current Characteristics for Fail-Safe Pins ....................................... 1137
表 22-27. Fail-Safe GPIOs that Require an External Pull-up .............................................. 1138
表 22-28. Non-Fail-Safe I/O Pad Voltage/Current Characteristics ....................................... 1138
表 22-29. ADC Electrical Characteristics .......................................................................... 1140
表 22-30. SSI Characteristics .......................................................................................... 1143
2014
年
01
月
29
日
16
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