逻辑芯片选型全攻略:快速定位与设计要点

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"这是一份关于逻辑芯片选型的指南,旨在帮助用户快速找到适合自己需求的芯片,并在设计过程中提供指导。" 在电子设计领域,逻辑芯片是不可或缺的一部分,它们用于实现数字电路的各种功能,包括数据处理、信号控制等。选型逻辑芯片时,有以下几个关键因素需要考虑: 1. **应用需求**:首先要明确你的项目需要解决什么问题,比如需要高速数据处理、低功耗运行、高密度集成还是特定的接口功能。这将决定你需要选择的芯片类型,如门阵列、FPGA、CPLD或ASIC。 2. **性能参数**:了解芯片的工作频率、电源电压、输入/输出电平、驱动电流、功耗等参数。这些参数决定了芯片能否在你的系统中正常工作。 3. **封装与引脚数**:封装形式(如SOIC、QFP、BGA)会影响焊接难度和板级空间占用。引脚数则对应着芯片的功能数量,需确保满足设计需求。 4. **兼容性与接口**:检查芯片是否与现有系统中的其他组件兼容,例如总线标准、时钟同步方式、数据传输协议等。 5. **可靠性与稳定性**:考虑芯片的工作温度范围、生命周期、ESD保护特性,以及在极端环境下的表现。 6. **供应商支持**:选择有良好技术支持和服务的供应商,以便在设计过程中获得必要的帮助。 7. **成本与批量**:根据预算和预期的生产量来平衡性能和价格。注意,批量采购通常可以获得更好的价格。 8. **兼容标准**:如果应用涉及通信协议(如SPI、I2C、UART),确保芯片符合相应的标准,以保证与其他设备的互操作性。 9. **功耗管理**:对于电池供电或对能耗敏感的设备,低功耗模式、动态电压调整和功率门控等功能可能至关重要。 10. **软件和开发工具**:评估可用的开发工具,如仿真器、编程器、IP核库,以及相关的软件支持。 11. **持续性与更新**:了解制造商的产品路线图,确保选择的芯片在未来一段时间内仍能得到支持和更新。 12. **认证与合规性**:对于特定行业的应用,可能需要满足特定的安全、电磁兼容性(EMC)、RoHS等标准。 此外,值得注意的是,德州仪器(Texas Instruments, TI)和其他半导体制造商保留随时更改产品或服务的权利,建议在下单前验证最新信息的完整性和准确性。TI对其产品按照销售时适用的规格进行性能保证,并执行测试以支持此保证,但并非所有参数都会被特定测试。购买时需同意销售条款,包括关于保修、专利侵权和责任限制的条款。
2019-06-24 上传
As the world leader in logic, Texas Instruments (TI) offers a full spectrum of logic functions and technologies ranging from the mature bipolar and BiCMOS families to the latest advanced CMOS families. TI offers process technologies with the logic performance and features needed in today’s elec- tronic markets while maintaining support for the traditional logic products. TI’s product offerings include the following process technolo- gies or device families: •AC, ACT, AHC, AHCT, ALVC, AUC, AUP, AVC, FCT, HC, HCT, LV-A, LV-AT, LVC, TVC •ABT, ABTE, ALB, ALVT, BCT, HSTL, LVT •BTA, CB3Q, CB3T, CBT, CBT-C, CBTLV, FB, FIFOs, GTL, GTLP, JTAG, I2C, VME •ALS, AS, F, LS, S, TTL Some Logic families have been in the marketplace for years, the oldest well into their fourth decade. The “Logic Migration Overview” section gives logic users a visual guide to migra- tion from the older to the newer technologies. Today’s applications are evolving with greater functionality and smaller size. TI’s goal is to help designers easily find the ideal logic technology or function they need. By offering logic families at every price/performance node along with bench- mark delivery, reliability and worldwide support, TI maintains a firm commitment to remain in the market with both leading- edge and mature logic lines. The “Product Index” section pro- vides a snapshot of TI’s extensive portfolio by function versus technology. The “Functional Cross-Reference” section shows the portfolio by device (type number) versus technology. Logic suppliers have historically focused on speed and low power as the priorities for product family improvement. As shown in Figure 1, fast performance is offered by many new TI product technologies such as AUC (1.8 V), ALVC (3.3 V) and 0 5 10 15 20 25 0 1 2 3 4 5 6 7 CMOS Voltage, VCC (V) Typical Propagation Delay, tpd (ns) HC AHC AC LVA LVC ALVC AVC AUC Figure 1. CMOS Voltage vs. Speed LV-A (5 V), depending on operating voltage requirements. Other technologies such as AUP focus on delivering “best-in- class” low-power performance. The “Packaging and Marking Information” section shows the wide variety of packaging options offered by TI. Included are advanced surface-mount packages like the fine-pitch, small- outline ball-grid-array (BGA) packages, quad flat no-lead (QFN) packages for gates and octals; and WCSP (NanoStar™/ NanoFree™) packages for single-, dual- and triple-gate functions. The new NanoStar/NanoFree WCSP packages are the world’s smallest logic packages, offering a 70% savings in space over industry-standard SC-70 packages. The “Resources” section provides additional information about TI logic families, including a list of technical literature and an overview of alternate sources for most logic families. Data sheets can be downloaded from the TI web site at www.ti.comor ordered through your local sales office or TI authorized distributor. (See back cover.)