STM32F030系列：ARM Cortex-M0基于的32位微控制器数据手册

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"STM32F030系列是意法半导体（STMicroelectronics）生产的一系列基于ARM Cortex-M0内核的32位微控制器，主要针对价值线市场，适用于需要高性能、低功耗和丰富外设接口的应用。该系列包括STM32F030x4、STM32F030x6和STM32F030x8三种型号，闪存容量从16KB到64KB不等，还配备了定时器、ADC以及多种通信接口，工作电压范围在2.4V至3.6V之间。" STM32F030系列的关键特性包括： 1. 内核：采用ARM Cortex-M0处理器，最高工作频率可达48MHz，提供了高效的处理能力。 2. 存储器：提供16KB到64KB的闪存存储空间，用于程序存储；同时具有4KB到8KB的SRAM，且带有硬件奇偶校验功能，确保数据安全。 3. CRC计算单元：支持数据完整性检查，提高系统可靠性。 4. 电源管理：支持2.4V至3.6V的工作电压范围，具备上电/掉电复位(POR/PDR)功能，以及睡眠、停止和待机等多种低功耗模式。 5. 时钟管理：具备4MHz到32MHz的晶体振荡器，32kHz振荡器用于RTC（实时时钟）并可进行校准，内置8MHz RC振荡器（可乘以6倍的PLL选项）和40kHz RC振荡器。 6. I/O端口：多达55个快速I/O，所有I/O均可映射到外部中断向量，其中36个I/O支持5V耐压。 7. DMA控制器：5通道DMA控制器，可以高效地处理内存与外设之间的数据传输。 8. ADC：12位ADC，转换时间为1.0μs，最多支持16个通道，测量范围0至3.6V，可独立于2.4V至3.6V的模拟电源工作。 9. 定时器：最多10个定时器，包括一个16位7通道高级控制定时器，支持6通道PWM输出、死区时间生成和紧急停止功能；另一个16位定时器，可配置为最多4个输入捕获/输出比较通道。此外，STM32F030系列还集成了丰富的通信接口，如USART、SPI、I2C等，适合于各种应用场合，如物联网设备、嵌入式控制系统、传感器接口等。这些特性使得STM32F030系列在嵌入式设计中具有很高的灵活性和性价比。

DocID024849 Rev 1 15/88

STM32F030x4 STM32F030x6 STM32F030x8 Functional overview

Figure 2. Clock tree

1. LSI/LSE is not available on STM32F030x8 devices.

/32

4-32 MHz

HSE OSC

OSC_IN

OSC_OUT

OSC32_IN

OSC32_OUT

8 MHz

HSI RC

to IWDG

PLL

x2,x3,..

x16

PLLMUL

MCO

Main clock

output

AHB

PLLCLK

HSI

HSE

APB

prescaler

/1,2,4,8,16

ADC

Prescaler

/2,4

HCLK

PLLCLK

to AHB bus, core,

memory and DMA

to ADC

14 MHz max

LSE

LSI

HSI

HSE

to RTC

PLLSRC

MCO

SYSCLK

RTCCLK

RTCSEL[1:0]

SYSCLK

to TIM1,3,6,

14,15,16,17

If (APB1 prescaler

=1) x1 else x2

FLITFCLK

to Flash programming interface

HSI14

14 MHz

HSI14 RC

HSI14

/244

LSE

to I2C1

to USART1

LSE

HSI

SYSCLK

PCLK

SYSCLK

HSI

PCLK

MS32138V1

to cortex System timer

FHCLK Cortex free running clock

to APB peripherals

AHB

prescaler

/1,2,..512

CSS

/1,2,

3,..16

LSE OSC

32.768kHz

LSI RC

40kHz

LSI

LSE

(1)

Functional overview STM32F030x4 STM32F030x6 STM32F030x8

16/88 DocID024849 Rev 1

3.7 General-purpose inputs/outputs (GPIOs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as

input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the

GPIO pins are shared with digital or analog alternate functions.

The I/O configuration can be locked if needed following a specific sequence in order to

avoid spurious writing to the I/Os registers.

3.8 Direct memory access controller (DMA)

The 5-channel general-purpose DMAs manage memory-to-memory, peripheral-to-memory

and memory-to-peripheral transfers.

The DMA supports circular buffer management, removing the need for user code

intervention when the controller reaches the end of the buffer.

Each channel is connected to dedicated hardware DMA requests, with support for software

trigger on each channel. Configuration is made by software and transfer sizes between

source and destination are independent.

DMA can be used with the main peripherals: SPI, I2C, USART, all TIMx timers (except

TIM14) and ADC.

3.9 Interrupts and events

3.9.1 Nested vectored interrupt controller (NVIC)

The STM32F0xx family embeds a nested vectored interrupt controller able to handle up to

32 maskable interrupt channels (not including the 16 interrupt lines of Cortex™-M0) and 4

priority levels.

 Closely coupled NVIC gives low latency interrupt processing

 Interrupt entry vector table address passed directly to the core

 Closely coupled NVIC core interface

 Allows early processing of interrupts

 Processing of late arriving higher priority interrupts

 Support for tail-chaining

 Processor state automatically saved

 Interrupt entry restored on interrupt exit with no instruction overhead

This hardware block provides flexible interrupt management features with minimal interrupt

latency.

3.9.2 Extended interrupt/event controller (EXTI)

The extended interrupt/event controller consists of 24 edge detector lines used to generate

interrupt/event requests and wake-up the system. Each line can be independently

configured to select the trigger event (rising edge, falling edge, both) and can be masked

independently. A pending register maintains the status of the interrupt requests. The EXTI

can detect an external line with a pulse width shorter than the internal clock period. Up to 55

GPIOs can be connected to the 16 external interrupt lines.

DocID024849 Rev 1 17/88

STM32F030x4 STM32F030x6 STM32F030x8 Functional overview

3.10 Analog to digital converter (ADC)

The 12-bit analog to digital converter has up to 16 external and 2 internal (temperature

sensor/voltage reference measurement) channels and performs conversions in single-shot

or scan modes. In scan mode, automatic conversion is performed on a selected group of

analog inputs.

The ADC can be served by the DMA controller.

An analog watchdog feature allows very precise monitoring of the converted voltage of one,

some or all selected channels. An interrupt is generated when the converted voltage is

outside the programmed thresholds.

3.10.1 Temperature sensor

The temperature sensor (TS) generates a voltage V

SENSE

that varies linearly with

temperature.

The temperature sensor is internally connected to the ADC_IN16 input channel which is

used to convert the sensor output voltage into a digital value.

The sensor provides good linearity but it has to be calibrated to obtain good overall

accuracy of the temperature measurement. As the offset of the temperature sensor varies

from chip to chip due to process variation, the uncalibrated internal temperature sensor is

suitable for applications that detect temperature changes only.

To improve the accuracy of the temperature sensor measurement, each device is

individually factory-calibrated by ST. The temperature sensor factory calibration data are

stored by ST in the system memory area, accessible in read-only mode.

3.10.2 Internal voltage reference (V

REFINT

)

The internal voltage reference (V

REFINT

) provides a stable (bandgap) voltage output for the

ADC. V

REFINT

is internally connected to the ADC_IN17 input channel. The precise voltage

of V

REFINT

is individually measured for each part by ST during production test and stored in

the system memory area. It is accessible in read-only mode.

Table 3. Temperature sensor calibration values

Calibration value name Description Memory address

TS_CAL1

TS ADC raw data acquired at

temperature of 30 °C,

DDA

= 3.3 V

0x1FFF F7B8 - 0x1FFF F7B9

TS_CAL2

TS ADC raw data acquired at

temperature of 110 °C

DDA

= 3.3 V

0x1FFF F7C2 - 0x1FFF F7C3

Table 4. Internal voltage reference calibration values

Calibration value name Description Memory address

VREFINT_CAL

Raw data acquired at

temperature of 30 °C

DDA

= 3.3 V

0x1FFF F7BA - 0x1FFF F7BB

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