TI-TUSB217A-Q1: 高速USB信号调节器AEC-Q100汽车应用

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TI-TUSB217A-Q1是一款专为汽车应用设计的高性能USB 2.0信号调节器，符合AEC-Q100标准，确保在严苛的汽车环境下的可靠性和稳定性。该设备具有以下关键特性： 1. 温度适应性：工作温度范围广泛，覆盖-40°C至105°C，满足汽车内部高温和低温环境的需求。 2. 电源灵活性：支持2.3V至6.5V的宽电源电压范围，适合不同应用场景下的电源需求。 3. 低功耗：在USB断开和关断状态下，能实现极低的功耗，有助于延长电池寿命和节能。 4. 信号调节：内置USB 2.0高速信号调节功能，兼容USB 2.0、OTG 2.0和BC 1.2标准，支持低速、全速和高速数据传输。 5. 接口控制：集成BC 1.2充电控制器，能够自动调整DCP和CDP引脚，适应不同的充电需求。同时支持菊花链连接，适用于高损耗应用。 6. 信号增强：可通过外部电阻实现信号增强，包括边缘升压和直流升压，以及多种RX均衡设置，以补偿电缆损耗和 ISI抖动。 7. 电缆兼容性：支持长达10米的电缆长度，甚至可以连接两枚TUSB217A-Q1，以扩大信号覆盖范围。 8. 易用性：设计为主机/器件无关，简化了系统集成，并能帮助系统通过USB 2.0高速近端眼图合规性测试。 9. 封装选项：TUSB217A-Q1采用X2QFN(12RWB)封装，尺寸小巧，便于集成到各种尺寸的电路板上，更多封装选项可在数据表中查询。这款芯片在汽车信息娱乐系统、仪表组、汽车音响主机、有源电缆、电缆扩展器和背板等应用中表现出色，通过其专利设计和预均衡功能，有效提升信号质量和抗干扰能力，确保系统的高效稳定运行。

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage range VCC

–0.3

7 V

Voltage range USB data DxP, DxM

–0.3

5.5 V

Voltage range on BOOST pin BOOST -0.3 1.98 V

Voltage range other pins RX_SEN, DCP/CDP,SDA,SCL, RSTN -0.3 5.5 V

Storage temperature, T

stg

–65

150 °C

Maximum junction temperature, T

J (max)

125 °C

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002

(1)

±2000

Charged-device model (CDM), per AEC Q100-011

(2)

±750

(1) AEC Q100-002 HBM ESD Classification Level 2

(2) AEC Q100- 011 CDM ESD Classification Level C4A

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Supply voltage 2.3 5 6.5 V

Operating free-air temperature (AEC-Q100)

–40

105 °C

Junction temperature (AEC-Q100) 115 °C

I2C_BUS

I2C Bus Voltage 1.62 3.6 V

DxP, DxM Voltage range USB data 0 3.6 V

BOOST Voltage range BOOST pin 0 1.98 V

DIGITAL Voltage range other pins (SCL, SDA, RSTN, DCP/CDP) 0 3.6 V

RX_SEN Voltage range RX_SEN pin 0 5.0 V

7.4 Thermal Information

THERMAL METRIC

(1)

RWB (X2QFN)

UNIT

12 PINS

θJA

Junction-to-ambient thermal resistance 137.4 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 62 °C/W

θJB

Junction-to-board thermal resistance 67.2 °C/W

Junction-to-top characterization parameter 1.9 °C/W

Junction-to-board characterization parameter 67.3 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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7.5 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

(1)

MAX UNIT

POWER

ACTIVE_HS

High Speed Active Current

USB channel = HS mode. 480 Mbps

traffic. V

supply stable, with Boost =

Max

22 36 mA

IDLE_HS

High Speed Idle Current

USB channel = HS mode, no traffic.

supply stable, Boost = Max

22 36 mA

HS_SUPSPEND

High Speed Suspend Current

USB channel = HS Suspend mode.

supply stable

0.75 1.4 mA

Full-Speed Current

USB channel = FS mode, 12 Mbps traffic,

supply stable

0.75 1.4 mA

DISCONN

Disconnect Power

Host side application. No device

attachment.

0.80 1.4 mA

SHUTDN

Shutdown Power RSTN driven low, V

supply stable 60 115 µA

CONTROL PIN LEAKAGE

LKG_FS

Pin failsafe leakage current for

SDA, RSTN

= 0 V, pin at V

IH, max

10 15 µA

LKG_FS

Pin failsafe leakage current for

RX_SEN

= 0 V, pin at V

IH, max

6 15 µA

LKG_FS

Pin failsafe leakage current for

SCL

= 0 V, pin at V

IH, max

70 nA

INPUT RSTN

High level input voltage 1.5 3.6 V

Low-level input voltage 0 0.5 V

High level input current V

= 3.6 V, R

enabled ±15 µA

Low level input current V

= 0V, R

enabled ±20 µA

INPUT DIGITAL

High level input voltage (DCP/

CDP)

1.5 3.6 V

Low-level input voltage (DCP/

CDP)

0 0.5 V

Low level input current V

= 0V ±20 µA

High level input current V

= 3.6 V ±15 µA

INPUT RX_SEN (3-level input, for mid level leave pin floating)

IH(Max)

Maximum High level input

voltage

VCC = 2.3V to 6.5V 5.0 V

IH(Min)

Minimum High level input voltage

VCC > 4.5V 3.3 V

VCC = 2.3V to 4.5V (% of VCC) 75 %

Low level input voltage

VCC > 4.5V 0.75 V

VCC = 2.3V to 4.5V (% of VCC) 15 %

INPUT BOOST

BOOST_LVL0

External pulldown resistor for

BOOST Level 0

160

BOOST_LVL1

External pulldown resistor for

BOOST Level 1

1.5 1.8 2

kΩ

BOOST_LVL2

External pulldown resistor for

BOOST Level 2

3.4 3.6 3.96

kΩ

BOOST_LVL3

External pulldown resistor for

BOOST Level 3 to remove upper

limit for resistor value, can be left

open

7.5

kΩ

OUTPUTS CD, ENA_HS

High level output voltage for CD

and ENA_HS

= –50 µA, VCC >= 3.0V

2.5 V

High level output voltage for CD

= –25 µA, VCC = 2.3V

1.7 V

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