"JEDEC标准JESD22-B116B：焊线剪切测试方法更新版（2017年）"

The JESD22-B116B.pdf document is a standard wire bond shear test method published by the JEDEC Solid State Technology Association in April 2017. This document is a revision of the JESD22-B116A standard from August 2009. The purpose of this test method is to provide guidelines for conducting wire bond shear tests in order to assess the quality and reliability of wire bonding in electronic components. The wire bond shear test method outlined in the JESD22-B116B.pdf document is crucial for the electronics industry as it ensures the integrity of wire bond connections in various electronic devices. By following the guidelines set forth in this standard, manufacturers can assess the strength of wire bond connections and identify any potential weaknesses that could lead to failures in the field. It is important to note that JEDEC standards and publications, including the JESD22-B116B.pdf document, undergo a rigorous review and approval process by the JEDEC Board of Directors and legal counsel. This ensures that the information and guidelines provided in these standards are accurate, reliable, and up-to-date. Overall, the JESD22-B116B.pdf document plays a critical role in ensuring the quality and reliability of wire bond connections in electronic components. By following the guidelines outlined in this standard, manufacturers can improve the performance and longevity of their electronic devices, ultimately benefiting consumers and the electronics industry as a whole.