STM32L151x6/8/B-A与STM32L152x6/8/B-A：超低功耗Cortex-M3微控制器

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STM32L151x6/8/B-A和STM32L152x6/8/B-A是基于ARM Cortex-M3架构的超低功耗微控制器，专为极低功耗应用设计。这些设备在业界以其卓越的能效著称，适合电池供电设备、物联网(IoT)和嵌入式系统。 1. **核心处理器**: - 这些微控制器搭载了32位的ARM Cortex-M3 CPU，可运行速度范围从32kHz到32MHz，具有1.25 DMIPS/MHz的性能，支持Dhrystone 2.1基准测试，确保了高效的计算能力。 - 内置内存保护单元，提供代码安全性和系统稳定性。 2. **电源管理和休眠模式**: - STM32L151x6/8/B-A系列支持多种工作模式，包括： - 省电模式（Standby）：在仅唤醒3个引脚的情况下，电流消耗低至0.28 µA，如果启用RTC功能，电流增加到1.11 µA。 - 停止模式（Stop）：具有16个唤醒线，停止模式下电流为0.44 µA（不带RTC）或1.38 µA（带RTC），非常适合长时间待机。 - 低功耗运行模式：185 µA/MHz的功耗，适合轻负载操作。 - 超低功耗模式：即使在关断状态下，I/O泄漏电流也非常低，小于8 µs的唤醒时间。 3. **安全复位与供电管理**: - 设备提供了高级的棕色-out (BOR) 保护，可以设置五个不同的阈值以确保在电源波动时系统的稳定重启。 - 同时，它们还具备低功耗上电/掉电复位(POR/PDR) 功能，以及可编程电压检测器(PVD)，有助于优化电源管理策略。 4. **时钟源选项**: - 提供1到24 MHz的外部晶体振荡器，以及用于RTC的32 kHz振荡器，带有校准功能。 - 内置高性能16 MHz工厂预调整的RC振荡器，精度为±1%。 - 低功耗内部振荡器支持从37 kHz到4.2 MHz的多速选择，包括65 kHz至4.2 MHz的低功耗模式。 - 配备PLL（锁相环路）模块，允许CPU时钟的扩展和调整，以适应各种应用场景。 5. **外设接口**: - 微控制器拥有高达83个高速I/O端口（73个对5V电压有耐受性），全部可以映射到16个外部中断向量，为传感器输入、通信和控制提供丰富的接口。这些特性使得STM32L151x6/8/B-A和STM32L152x6/8/B-A成为能源效率极高且功能强大的嵌入式解决方案，适用于对电池寿命要求严格的工业、消费电子和物联网应用。通过其灵活的电源管理、高效处理能力和广泛的I/O选项，这些微控制器能够实现低功耗设计的同时，保持高性能和可靠性。

Functional overview STM32L151x6/8/B-A STM32L152x6/8/B-A

16/129 DocID024330 Rev 4

= 2.0 to 2.4 V

Conversion time

up to 500 Ksps

Functional

(2)

Range 1,

Range 2 or

Range 3

Full speed operation

= 2.4 to 3.6 V

Conversion time

up to 1 Msps

Functional

(2)

Range 1,

Range 2 or

Range 3

Full speed operation

1. CPU frequency changes from initial to final must respect "F

CPU

initial < 4*F

CPU

final" to limit V

CORE

drop

due to current consumption peak when frequency increases. It must also respect 5 µs delay between two

changes. For example to switch from 4.2 MHz to 32 MHz, you can switch from 4.2 MHz to 16 MHz, wait

5 µs, then switch from 16 MHz to 32 MHz.

2. Should be USB-compliant from I/O voltage standpoint, the minimum V

is 3.0 V.

Table 4. CPU frequency range depending on dynamic voltage scaling

CPU frequency range Dynamic voltage scaling range

16 MHz to 32 MHz (1ws)

32 kHz to 16 MHz (0ws)

Range 1

8 MHz to 16 MHz (1ws)

32 kHz to 8 MHz (0ws)

Range 2

2.1 MHz to 4.2 MHz (1ws)

32 kHz to 2.1 MHz (0ws)

Range 3

Table 3. Functionalities depending on the operating power supply range (continued)

Operating power

supply range

Functionalities depending on the operating power supply range

DAC and ADC

operation

USB

Dynamic voltage

scaling range

I/O operation

Functional overview STM32L151x6/8/B-A STM32L152x6/8/B-A

18/129 DocID024330 Rev 4

3.2 ARM

Cortex

-M3 core with MPU

The ARM

Cortex

-M3 processor is the industry leading processor for embedded systems.

It has been developed to provide a low-cost platform that meets the needs of MCU

implementation, with a reduced pin count and low-power consumption, while delivering

outstanding computational performance and an advanced system response to interrupts.

The ARM

Cortex

-M3 32-bit RISC processor features exceptional code-efficiency,

delivering the high-performance expected from an ARM core in the memory size usually

associated with 8- and 16-bit devices.

The memory protection unit (MPU) improves system reliability by defining the memory

attributes (such as read/write access permissions) for different memory regions. It provides

up to eight different regions and an optional predefined background region.

Owing to its embedded ARM core, the STM32L151x6/8/B-A and STM32L152x6/8/B-A

devices are compatible with all ARM tools and software.

DAC Y Y Y Y Y - - -

Temperature

sensor

YYYYY---

Comparators Y Y Y Y Y Y - -

16-bit Timers Y Y Y Y - - - -

IWDG Y Y Y Y Y Y Y Y

WWDG Y Y Y Y - - - -

Touch sensing Y - - - - - - -

Systick Timer Y Y Y Y - - - -

GPIOs Y Y Y Y Y Y - 3 pins

Wakeup time to

Run mode

0 µs 0.4 µs 3 µs 46 µs < 8 µs 58 µs

Consumption

=1.8V to 3.6V

(Typ)

Down to

185 µA/MHz

(from Flash)

Down to

36.9 µA/MHz

(from Flash)

Down to

10.9 µA

Down to

5.5 µA

0.43 µA (No

RTC) V

=1.8 V

0.27 µA (No

RTC) V

=1.8 V

1.13 µA (with

RTC) V

=1.8 V

0.87 µA (with

RTC) V

=1.8 V

0.44 µA (No

RTC) V

=3.0 V

0.28 µA (No

RTC) V

=3.0 V

1.38 µA (with

RTC) V

=3.0 V

1.11 µA (with

RTC) V

=3.0 V

1. The startup on communication line wakes the CPU which was made possible by an EXTI, this induces a delay before

entering run mode.

Table 5. Working mode-dependent functionalities (from Run/active down to standby) (continued)

Ips Run/Active Sleep

Low-

power

Run

Low-

power

Sleep

Stop Standby

Wakeup

capability

Wakeup

capability

DocID024330 Rev 4 19/129

STM32L151x6/8/B-A STM32L152x6/8/B-A Functional overview

Nested vectored interrupt controller (NVIC)

The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices embed a

nested vectored interrupt controller able to handle up to 45 maskable interrupt channels (not

including the 16 interrupt lines of Cortex-M3) and 16 priority levels.

• Closely coupled NVIC gives low-latency interrupt processing

• Interrupt entry vector table address passed directly to the core

• Closely coupled NVIC core interface

• Allows early processing of interrupts

• Processing of late arriving, higher-priority interrupts

• Support for tail-chaining

• Processor state automatically saved

• Interrupt entry restored on interrupt exit with no instruction overhead

This hardware block provides flexible interrupt management features with minimal interrupt

latency.

3.3 Reset and supply management

3.3.1 Power supply schemes

• V

= 1.65 to 3.6 V: external power supply for I/Os and the internal regulator.

Provided externally through V

pins.

• V

SSA

, V

DDA

= 1.65 to 3.6 V: external analog power supplies for ADC, reset blocks, RCs

and PLL (minimum voltage to be applied to V

DDA

is 1.8 V when the ADC is used).

DDA

and V

SSA

must be connected to V

and V

, respectively.

3.3.2 Power supply supervisor

The device has an integrated ZEROPOWER power-on reset (POR)/power-down reset

(PDR) that can be coupled with a brownout reset (BOR) circuitry.

The device exists in two versions:

• The version with BOR activated at power-on operates between 1.8 V and 3.6 V.

• The other version without BOR operates between 1.65 V and 3.6 V.

After the V

threshold is reached (1.65 V or 1.8 V depending on the BOR which is active or

not at power-on), the option byte loading process starts, either to confirm or modify default

thresholds, or to disable the BOR permanently: in this case, the V

min value becomes

1.65 V (whatever the version, BOR active or not, at power-on).

When BOR is active at power-on, it ensures proper operation starting from 1.8 V whatever

the power ramp-up phase before it reaches 1.8 V. When BOR is not active at power-up, the

power ramp-up should guarantee that 1.65

V is reached on V

at least 1 ms after it exits

the POR area.

Functional overview STM32L151x6/8/B-A STM32L152x6/8/B-A

20/129 DocID024330 Rev 4

Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To

reduce the power consumption in Stop mode, it is possible to automatically switch off the

internal reference voltage (V

REFINT

) in Stop mode. The device remains in reset mode when

is below a specified threshold, V

POR/PDR

or V

BOR

, without the need for any external

reset circuit.

Note: The start-up time at power-on is typically 3.3 ms when BOR is active at power-up, the start-

up time at power-on can be decreased down to 1

ms typically for devices with BOR inactive

at power-up.

The device features an embedded programmable voltage detector (PVD) that monitors the

DDA

power supply and compares it to the V

PVD

threshold. This PVD offers 7 different

levels between 1.85

V and 3.05 V, chosen by software, with a step around 200 mV. An

interrupt can be generated when V

DDA

drops below the V

PVD

threshold and/or when

DDA

is higher than the V

PVD

threshold. The interrupt service routine can then generate

a warning message and/or put the MCU into a safe state. The PVD is enabled by software.

3.3.3 Voltage regulator

The regulator has three operation modes: main (MR), low-power (LPR) and power down.

• MR is used in Run mode (nominal regulation)

• LPR is used in the Low-power run, Low-power sleep and Stop modes

• Power down is used in Standby mode. The regulator output is high impedance, the

kernel circuitry is powered down, inducing zero consumption but the contents of the

registers and RAM are lost are lost except for the standby circuitry (wakeup logic,

IWDG, RTC, LSI, LSE crystal 32K osc, RCC_CSR).

3.3.4 Boot modes

At startup, boot pins are used to select one of three boot options:

• Boot from Flash memory

• Boot from System Memory

• Boot from embedded RAM

The boot loader is located in System Memory. It is used to reprogram the Flash memory by

using USART1 or USART2. See the application note “STM32 microcontroller system

memory boot mode” (AN2606) for details.

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