高通QCC3026蓝牙音频SoC技术规格与应用

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"高通QCC3026是一款高性能蓝牙音频系统级芯片(SoC)，专为实现高质量无线立体声耳机设计。该芯片具备三核处理器架构，以实现高效性能并降低功耗，从而延长电池寿命。QCC3026被广泛应用于Qualcomm TrueWireless™立体声耳塞产品中，它符合蓝牙v5.0规范，提供丰富的功能集以满足现代无线音频设备的需求。" 详细说明： 1. **三核处理器架构**：QCC3026采用了创新的三核设计，包括一个120MHz的Qualcomm Kalimba™音频数字信号处理器(DSP)、一个32MHz的应用开发者处理器以及一个固件处理器，这三者协同工作，为复杂的音频处理和系统管理提供了强大支持。 2. **蓝牙v5.0兼容**：QCC3026芯片是按照蓝牙v5.0规范设计的，这意味着它支持更远的传输距离、更高的数据传输速率以及更低的功耗，提升了无线音频设备的使用体验。 3. **Kalimba™音频DSP**：此DSP专为音频处理优化，能处理各种高级音频算法，提供高质量的音乐播放效果。 4. **灵活的QSPI闪存可编程平台**：这使得QCC3026能够适应不同的软件更新和定制需求，允许用户根据应用需求进行编程和配置。 5. **24位高精度音频接口**：芯片内置的高分辨率音频接口确保了无损音质的传输，对于音乐爱好者来说，这是至关重要的。 6. **cVc™耳机语音处理**：QCC3026支持1或2个麦克风的Qualcomm cVc™技术，提供清晰的通话质量，通过噪声消除和回声抑制功能优化了通话体验。 7. **多种串行接口**：包括UART、Bit Serializer (用于I²C/SPI) 和USB2.0，这些接口使得设备可以与各种外围设备进行通信和连接。 8. **集成电源管理系统(PMU)**：双开关模式电源(SMPS)为系统和数字电路供电，同时集成锂离子电池充电器，确保高效且安全的电池管理。 9. **GPIO和LED控制**：15个通用输入/输出(PIO)引脚和5个带有脉宽调制(PWM)的LED引脚，便于设备的扩展和自定义功能，如状态指示灯等。 10. **封装形式**：QCC3026采用81球3.9798x4.0184x0.54mm的WLCSP封装，0.4mm焊球间距，适合小型化无线设备设计。高通QCC3026是一款集成度高、功能强大的蓝牙音频SoC，适用于需要高品质无线音频体验的各类消费电子设备，尤其在真无线耳塞市场中表现出色。其低功耗特性、丰富的接口选项以及先进的音频处理能力，使其成为无线音频设备制造商的理想选择。

Tables

Table 1-1: QCC3026 WLCSP pin allocaons (Orientaon from top of device)......................................................................... 18

Table 1-2: QCC3026 WLCSP device terminal funcons (Radio)................................................................................................19

Table 1-3: QCC3026 WLCSP device terminal funcons (Clock)................................................................................................ 19

Table 1-4: QCC3026 WLCSP device terminal funcons (USB).................................................................................................. 20

Table 1-5: QCC3026 WLCSP device terminal funcons (QSPI)................................................................................................. 20

Table 1-6: QCC3026 WLCSP device terminal funcons (PIO)................................................................................................... 21

Table 1-7: QCC3026 WLCSP device terminal funcons (Audio)............................................................................................... 22

Table 1-8: QCC3026 WLCSP device terminal funcons (AIO/LED drivers)............................................................................... 23

Table 1-9: QCC3026 WLCSP device terminal funcons (SMPS)................................................................................................23

Table 1-10: QCC3026 WLCSP device terminal funcons (Power supplies and control)........................................................... 24

Table 1-11: QCC3026 WLCSP device terminal funcons (Ground)...........................................................................................25

Table 1-12: QCC3026 WLCSP device terminal funcons (Not connected)............................................................................... 25

Table 8-1: High-quality ADC analog gain vs. input impedance and input amplitude............................................................... 39

Table 8-2: Headset output driver mode................................................................................................................................... 40

Table 8-3: I²S/PCM master mode ming diagram symbols...................................................................................................... 41

Table 8-4: I²S/PCM slave mode ming diagram symbols......................................................................................................... 42

Table 8-5: Codec input use condions..................................................................................................................................... 43

Table 8-6: Codec output use condion.................................................................................................................................... 43

Table 8-7: QCC3026 WLCSP audio slots................................................................................................................................... 43

Table 9-1: Virtual PIO............................................................................................................................................................... 45

Table 9-2: LED controller paern............................................................................................................................................. 46

Table 9-3: LED_PWM to PIO to LED_PAD mapping.................................................................................................................. 47

Table 10-1: Transacon bridge PIO mulplex...........................................................................................................................48

Table 13-1: Parameters in Trickle charge..................................................................................................................................52

Table 13-2: Parameters in Pre-charge...................................................................................................................................... 53

Table 13-3: Parameters in Fast charge..................................................................................................................................... 53

Table 13-4: Parameters in Standby mode................................................................................................................................ 54

Table 16-1: Class-D DAC audio output..................................................................................................................................... 68

Table 16-2: High-quality (HQADC) single-ended audio input................................................................................................... 69

80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Figures

QCC3026 WLCSP funconal block diagram................................................................................................................................6

Figure 1-1: QCC3026 WLCSP package dimensions diagram..................................................................................................... 17

Figure 2-1: Bluetooth subsystem............................................................................................................................................. 27

Figure 3-1: Crystal oscillator..................................................................................................................................................... 29

Figure 4-1: QCC3026 WLCSP stac power states diagram....................................................................................................... 31

Figure 5-1: Host Interfaces subsystem..................................................................................................................................... 33

Figure 6-1: Applicaons subsystem..........................................................................................................................................34

Figure 7-1: QCC3026 WLCSP Audio subsystem........................................................................................................................ 36

Figure 8-1: QCC3026 WLCSP high-quality ADC input switch conguraon..............................................................................38

Figure 8-2: I²S/PCM master mode ming diagram.................................................................................................................. 41

Figure 8-3: I²S/PCM slave mode ming diagram......................................................................................................................42

Figure 11-1: Boot Manager...................................................................................................................................................... 49

Figure 12-1: System Manager.................................................................................................................................................. 50

Figure 13-1: PMU subsystem................................................................................................................................................... 51

Figure 13-2: Charge cycle states............................................................................................................................................... 52

Figure 13-3: Power regulaon..................................................................................................................................................55

Figure 14-1: QCC3026 WLCSP example applicaon schemac................................................................................................ 57

80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

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