Freescale i.MX53xD 处理器数据手册

数据手册

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"IMX53CEC数据手册是Freescale Semiconductor公司关于i.MX53xD系列多媒体应用处理器的数据手册，主要介绍了该处理器的技术规格、封装信息和应用领域等。" 本文档详细阐述了Freescale Semiconductor的i.MX53xD系列处理器，它基于ARMCortex™-A8内核，是一款专为低功耗高性能处理设计的先进应用处理器。这个系列属于面向多媒体应用的不断扩展的产品家族。 i.MX53xD处理器的核心是能够运行在高达1.2GHz时钟频率的ARMCortex™-A8内核，支持DDR2/LVDDR2-800、LPDDR2-800或DDR3-800内存，这使得它在各种高性能计算任务中表现出色。该设备适用于多种应用场景，如： 1. 平板电脑：i.MX53xD处理器的高效性能适合用于打造高性能的平板设备。 2. 智能设备：在智能穿戴、智能家居等领域，该处理器可以提供流畅的操作体验。 3. 网本和Web平板：对于需要快速网络连接和较长电池续航的轻薄设备，i.MX53xD是理想选择。 4. Nettops（互联网桌面设备）：提供强大计算能力的桌面级互联网设备。 5. 薄型客户端：适合于需要高效能但体积紧凑的终端设备。 6. 媒体手机：对于多媒体播放和高速网络浏览需求的智能手机。 7. 互联网显示器：在智能显示屏中，提供丰富的多媒体功能和交互体验。 8. 高端移动互联网设备（MID）：为高端MID设备提供强大的运算能力。封装信息方面，i.MX53xD提供两种封装选择：塑料封装的TEPBGA-219x19mm，引脚间距为0.8mm，以及FC-PBGA12x12mmPoP封装，引脚间距为0.4mm。订购信息可以在文档第4页的表格中找到。 IMX53CEC数据手册是开发基于i.MX53xD处理器产品的工程师和技术人员的重要参考资料，涵盖了处理器的关键技术参数、性能特性和应用范围，有助于理解和设计相关产品。这份数据手册的详细内容和丰富信息对理解Freescale Semiconductor的这款先进处理器具有重要意义。

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i.MX53xD Applications Processors for Consumer Products, Rev. 6

16 Freescale Semiconductor

Modules List

USB USB Controller Connectivity

Peripherals

USB supports USB2.0 480 MHz, and contains:

• One high-speed OTG sub-block with integrated HS USB PHY

• One high-speed host sub-block with integrated HS USB PHY

• Two identical high-speed Host modules

The high-speed OTG module, which is internally connected to the HS USB

PHY, is equipped with transceiver-less logic to enable on-board USB

connectivity without USB transceivers

All the USB ports are equipped with standard digital interfaces (ULPI, HS

IC-USB) and transceiver-less logic to enable onboard USB connectivity

without USB transceivers.

VPU Video Processing

Unit

Multimedia

Peripherals

A high-performing video processing unit (VPU) version 3, which covers

many SD-level video decoders and SD-level encoders as a multi-standard

video codec engine as well as several important video processing such as

rotation and mirroring.

VPU Features:

• MPEG-2 decode, Mail-High profile, up to 1080i/p resolution, 40 Mbps bit

rate

• MPEG4/XviD decode, SP/ASP profile, up to 1080 i/p resolution, 40 Mbps

bit rate

• H.263 decode, P0/P3 profile, up to 16CIF resolution, 20 Mbps bit rate

• H.264 decode, BP/MP/HP profile, up to 1080 i/p resolution, 40 Mbps bit

rate

• VC1 decode, SP/MP/AP profile, up to 1080 i/p resolution, 40 Mbps bit

rate

• RV10 decode, 8/9/2010 profile, up to 1080 i/p resolution, 40 Mbps bit rate

• DivX decode, 3/4/5/6 profile, up to 1080 i/p resolution, 40 Mbps bit rate

• MJPEG decode, Baseline profile, up to 8192 x 8192 resolution,

40 Mpixel/s bit rate for 4:4:4 format

• MPEG4 encode, Simple profile, up to 720p resolution, 12 Mbps bit rate

• H.263 encode, P0/P3 profile, up to 4CIF resolution, 8 Mbps bit rate

• H.264 encode, Baseline profile, up to 720p resolution, 14 Mbps bit rate

• MJPEG encode, Baseline profile, up to 8192 x 8192 resolution,

80 Mpixel/s bit rate for 4:2:2 format

WDOG-1 Watch Dog Timer

Peripherals

The watch dog timer supports two comparison points during each counting

period. Each of the comparison points is configurable to evoke an interrupt

to the ARM core, and a second point evokes an external event on the

WDOG line.

WDOG-2

(TZ)

Watch Dog

(TrustZone)

Timer

Peripherals

The TrustZone watchdog (TZ WDOG) timer module protects against

TrustZone starvation by providing a method of escaping normal mode and

forcing a switch to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. This situation should be

avoided, as it can compromise the system’s security. Once the TZ WDOG

module is activated, it must be serviced by TZ software on a periodic basis.

If servicing does not take place, the timer times out. Upon a time-out, the TZ

WDOG asserts a TZ mapped interrupt that forces switching to the TZ mode.

If it is still not served, the TZ WDOG asserts a security violation signal to the

CSU. The TZ WDOG module cannot be programmed or deactivated by a

normal mode SW.

Table 3. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name Subsystem Brief Description

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 6

Freescale Semiconductor 19

4.1.2.2 PoP Package Thermal Resistance

Table 7 provides the PoP package thermal resistance data.

Junction to Board

—R

θJB

6°C/W

Junction to Case

—R

θJC

4°C/W

Junction to Package Top (natural convection)

— Ψ

4°C/W

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

Table 7. PoP Package Thermal Resistance Data

Calculated for just the i.MX53xD package, without the top mounted memory package.

Rating Board Symbol

designed

Center

Array of

Pillars

used for

Ground

Unit

Junction to Ambient (natural convection)

2, 3

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Single layer board

(1s)

θJA

45 45 °C/W

Junction to Ambient (natural convection)

2, 3, 4

Per JEDEC JESD51-6 with the board horizontal.

Four layer board

(2s2p)

θJA

23 22 °C/W

Junction to Ambient (at 200 ft/min)

2, 4

Single layer board

(1s)

θJMA

36 35 °C/W

Junction to Ambient (at 200 ft/min)

2, 4

Four layer board

(2s2p)

θJMA

19 18 °C/W

Junction to Board

—R

θJB

8.4 7.2 °C/W

Junction to Case

—R

θJC

<0.1 <0.1 °C/W

Junction to Package Top (natural convection)

— Ψ

22°C/W

Table 6. TEPBGA-2 Package Thermal Resistance Data (continued)

Rating Board Symbol Value Unit

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