Appendix 1: Definition of a Qualification Family 附录1: 质量认证用术语
The qualification of a particular process will be defined within, but not limited to, the categories listed below. The
supplier will provide a complete description of each process and material of significance. There must be valid and
obvious links between the data and the subject of qualification.
以下的术语解释供了解但不属于唯一性解释. 供应商有其相应的名词释义, 术语与内容当有有机联长系.
For devices to be categorized in a qualification family, they all must share the same major process and materials
elements as defined below. All devices using the same process and materials are to be categorized in the same
qualification family for that process and are qualified by association when one family member successfully
completes qualification with the exception of the device specific requirements of section 4.2. Prior qualification data
obtained from a device in a specific family may be extended to the qualification of subsequent devices in that family.
对于待归于一类的器件, 它们应当有以下列明的相似的工艺流程与原材料成分. 对同一类器件,除在4.2.章节中需要测试
人个别项目外,可参照通用数据. 个别测出的结果也可充入通用数据库.
For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this
appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the
possible permutations.
对多种因素待考核的器件, 应当选出条件最恶劣者作为考核批代表, 具体操作方法参照该附件的A1.3项,与Q100的2.3项.
A1.1
Fab Process
晶圆制程
Each process technology (e.g., CMOS, NMOS, Bipolar, etc.) must be considered and qualified separately.
No matter how similar, processes from one fundamental fab technology cannot be used for another. For
BiCMOS devices, data must be taken from the appropriate technology based on the circuit under
consideration.
充分考核黄素每一个操作工序(如: CMOS, NMOS, Bipolar等) 尽管采用多么相似的工艺,必须区分考核黄素各加工
单位的制作过程. 对于BiCMOS器件, 必须利用合适的流程保证数据采集的正确性.
Family requalification with the appropriate tests is required when the process or a material is changed (see
Table A1 for guidelines). The important attributes defining a qualification family are listed below:
(见表A1)对于工艺变更,用适当的试验项目来收集通用数据, 其中主要属性列举如下:
a. Wafer Fab Technology (e.g., CMOS, NMOS, Bipolar, etc.)
晶圆工艺 (如: CMOS, NMOS, Bipolar等)
b. Wafer Fab Process - consisting of the same attributes listed below:
晶圆制程- 共同属性如下:
Circuit element feature size (e.g., layout design rules, die shrinks, contacts, gates, isolations)
布线特征(如: layout design rules, die shrinks, contacts, gates, isolations)
Substrate (e.g., orientation, doping, epi, wafer size)
基板 (如: orientation, doping, epi, wafer size)
Number of masks (supplier must show justification for waiving this requirement)
掩膜数量(supplier must show justification for waiving this requirement)
Lithographic process (e.g., contact vs. projection, E-beam vs. X-ray, photoresist polarity)
刻蚀过程
(
如
: contact vs. projection, E-beam vs. X-ray, photoresist polarity)
Doping process (e.g., diffusion vs. ion implantation) 掺杂过程(e.g., diffusion vs. ion implantation)
Gate structure, material and process (e.g., polysilicon, metal, salicide, wet vs. dry etch)
出入口结构,材料与工艺(e.g., polysilicon, metal, salicide, wet vs. dry etch)
Polysilicon material, thickness range and number of levels
多晶硅
,
厚度及层数
Oxidation process and thickness range (for gate and field oxides) 氧化工艺怀厚度 (for gate and field oxides)
Interlayer dielectric material and thickness range 内层介电材料与厚度
Metallization material, thickness range and number of levels
金属层成份
,
厚度及层数
Passivation material and thickness range 钝化层成份厚度
Die backside preparation process and metallization 芯片背面处理与金属层保护
c.
Wafer Fab Site
晶圆加工地点
A1.2
Assembly Process - Plastic or Ceramic 组装批 – 塑封或陶瓷封装
The processes for plastic and ceramic package technologies must be considered and qualified separately.
For devices to be categorized in a qualification family, they all must share the same major process and
material elements as defined below. Family requalification with the appropriate tests is required when the
process or a material is changed. The supplier must submit technical justification to the user to support
the acceptance of generic data with pin (ball) counts, die sizes, substrate dimensions/material/thickness,
paddle sizes and die aspect ratios different than the device to be qualified.
塑料封装与陶瓷封装的考核应分开进行. 只有主要工艺相同者才能归于一类, 详情见下.除做恰当考核外,还需
用户确认封装技术指标与效果.
AEC - Q100 - REV-F
J u ly 18, 2003
Automotive Electronics Council
Component Technical Committee
Page 17 of 28