4
LMH0302
ZHCSAK2H –APRIL 2007–REVISED JUNE 2016
www.ti.com.cn
Copyright © 2007–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage –0.5 3.6 V
Input voltage (all inputs) –0.3 V
CC
+ 0.3 V
Output current 28 mA
Lead temperature, soldering (4 s) 260 °C
Junction temperature, T
J
125 °C
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±4500
VCharged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±2000
Machine model (MM) ±250
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage (V
CC
– V
EE
) 3.13 3.3 3.46 V
Operating junction temperature 100 °C
Operating free air temperature, T
A
–40 25 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
LMH0302
UNITRUM (WQFN)
16 PINS
R
θJA
Junction-to-ambient thermal resistance 47.8 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 47.2 °C/W
R
θJB
Junction-to-board thermal resistance 25.6 °C/W
ψ
JT
Junction-to-top characterization parameter 1.7 °C/W
ψ
JB
Junction-to-board characterization parameter 25.7 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 14.5 °C/W
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to V
EE
= 0 V.
(2) Typical values are stated for V
CC
= 3.3 V and T
A
= 25°C.
6.5 Electrical Characteristics – DC
Over supply voltage and operating free-air temperature range (unless otherwise noted)
(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CMIN
Input common mode voltage SDI, SDI 1.1 + V
SDI
/2 V
CC
– V
SDI
/2 V
V
SDI
Input voltage swing Differential, SDI, SDI 100 2200 mV
P−P
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