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首页ASM9260T芯片数据手册:ARM9单片机的强大解决方案
ASM9260T芯片数据手册:ARM9单片机的强大解决方案
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更新于2024-07-21
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ASM9260T数据手册
ASM9260T是一款高性能的32位ARM9单片机,内置32MB SD RAM、10个串口(ISO7816)、两路USB OTG、I2C、I2S、SPI、CAN、以太网MAC等多种接口,能够满足各种应用场景的需求。下面是对ASM9260T数据手册的详细知识点概述:
1. 概述
ASM9260T是一款基于ARM9处理器的单片机,采用3D SIP工艺,内置32MB SD RAM,具有高性能、低功耗的特点。
2. 特性
ASM9260T具有以下特性:
* 高性能的32位ARM9处理器
* 内置32MB SD RAM
* 10个串口(ISO7816)
* 两路USB OTG
* I2C、I2S、SPI、CAN、以太网MAC等多种接口
* 24位LCD驱动(1024*1024)支持OSD、CAMIF接口
* 内置MotorPWM和QEI
3. 应用领域
ASM9260T广泛应用于:
* 嵌入式系统
* 工业控制系统
* 网络设备
* 消费电子产品
* 汽车电子系统
4. 订购信息
ASM9260T的订购信息包括器件选型汇总、简易方框图、结构概述等。
5. ARM9处理器
ASM9260T基于ARM9处理器,具有高性能、低功耗的特点。ARM9处理器的配置选项包括:
* ARM9处理器架构
* ARM9处理器的特性
* ARM9处理器的应用场景
6. 片上静态RAM
ASM9260T内置32MB SD RAM,提供了高性能的存储空间。
7. 系统架构图
ASM9260T的系统架构图展示了其内部结构,包括处理器、存储器、接口等部分。
8. 管脚信息
ASM9260T的管脚信息包括管脚描述、管脚配置等。
9. 外部总线接口
ASM9260T提供了多种外部总线接口,包括EMI接口模块、NandFlash控制器模块、10/100兆MAC控制器模块等。
10. EMI接口模块
ASM9260T的EMI接口模块提供了基本功能、基本配置等。
11. NandFlash控制器模块
ASM9260T的NandFlash控制器模块提供了基本功能、基本配置等。
12. 10/100兆MAC控制器模块
ASM9260T的10/100兆MAC控制器模块提供了基本功能、基本配置等。
13. USB控制器模块
ASM9260T的USB控制器模块提供了基本功能、基本配置、USB可编程I/O(PIO)目标接口、USBDMA接口等。
14. LCD控制器模块
ASM9260T的LCD控制器模块提供了基本功能、基本配置、LCD控制器的主要特征等。
15. USART模块
ASM9260T的USART模块提供了基本功能、基本配置等。
16. I2C模块
ASM9260T的I2C模块提供了基本功能、基本配置等。
17. I2S模块
ASM9260T的I2S模块提供了基本功能、基本配置等。
ASM9260T是一款功能强大、性能高效的单片机,广泛应用于各种应用场景。
AlphaScale Technologies.Inc
http://www.alphascale.com 单芯片 32bit ARM9,采用 3D SIP 工艺内置 32MB SDRAM
芯片数据手册
©2012 AlphaScale Technologies,Inc.
xv
ASM9260T-SIP176
20.6.11 MCPWM 霍尔寄存器 (MCHALL-0x800A0078)....................................543
20.6.12 MCPWM 霍尔映射寄存器 (MCHALLS-0x800A007C).........................544
20.6.13 MCPWM 速度比较寄存器 (MCVELCMP-0x800A0080)...................... 545
20.6.14 MCPWM 速度实测值寄存器 (MCVELVAL-0x800A0084).................. 545
20.6.15 MCPWM 速度阈值寄存器 (MCVELTH-0x800A0088)......................... 546
20.6.16 MCPWM 输入状态寄存器 (MCMCIST-0x800A008C)..........................546
20.7 PWM 操 作................................................................................................................. 546
20.7.1 脉宽调制............................................................................................................546
20.7.2 映射寄存器和同时更新....................................................................................550
20.7.3 捕获事件............................................................................................................551
20.7.4 外部事件计数(计数模式)........................................................................... 551
20.7.5 三相 DC 模式.................................................................................................... 551
20.7.6 带霍尔传感器的三相无刷直流电机模式....................................................... 552
20.7.7 中断....................................................................................................................555
第二十一章
32
位定时计数器
.................................................................................557
21.
模块描述
............................................................................................................ 557
21.1.1 模块简介............................................................................................................557
21.1.2 模块特性............................................................................................................557
21.2 基本配置....................................................................................................................... 558
21.3 管脚配置....................................................................................................................... 558
21.4 可编程寄存器描述....................................................................................................... 559
21.4.1 TMR32B*IR 寄存器.......................................................................................... 562
21.4.2 TMR32B*TCR 寄存器...................................................................................... 562
21.4.3 TMR32B*DIR 寄存器....................................................................................... 563
21.4.4 TMR32B*TC0/1/2/3 寄存器..............................................................................564
21.4.5 TMR32B*PR 寄存器......................................................................................... 564
21.4.6 TMR32B*PC 寄存器......................................................................................... 564
21.4.7 TMR32B*MCR 寄存器..................................................................................... 564
21.4.8 TMR32B*MR0/1/2/3 寄存器............................................................................ 565
21.4.9 TMR32B*CCR 寄存器...................................................................................... 565
21.4.10 TMR32B*CR0/1/2/3 寄存器........................................................................... 566
21.4.11 TMR32B*EMR 寄存器................................................................................... 566
21.4.12 TMR32B*PWMTH0/1/2/3 寄存器................................................................. 568
21.4.13 TMR32B*CTCR 寄存器................................................................................. 568
21.4.14 TMR32B*PWMC 寄存器................................................................................569
21.5 操 作....................................................................................................................... 570
21.5.1 计数器模式........................................................................................................571
21.5.2 定时器模式........................................................................................................571
21.5.3 单边沿控制的 PWM 输出................................................................................572
21.5.4 单脉冲输出........................................................................................................572
21.5.5 捕获操作............................................................................................................573
21.5.6 匹配操作............................................................................................................573
第二十二章
SPI
和
QSPI
模块
............................................................................... 575
22. SPI
模块概述
.......................................................................................................575
AlphaScale Technologies.Inc
http://www.alphascale.com 单芯片 32bit ARM9,采用 3D SIP 工艺内置 32MB SDRAM
芯片数据手册
©2012 AlphaScale Technologies,Inc.
xvi
ASM9260T-SIP176
22.1 SPI 模块简介................................................................................................................. 575
22.2 SPI 模块特性................................................................................................................. 575
22.3 SPI 管脚配置................................................................................................................. 575
22.4 SPI 可编程寄存器描述................................................................................................. 576
22.4.1 SPI 控制寄存器 0(HW_SPI_CTRL0)..........................................................576
22.4.2 SPI 控制寄存器 1(HW_SPI_CTRL1)..........................................................577
22.4.3 SPI 时序控制寄存器(HW_SPI_TIMING).................................................. 579
22.4.4 SPI 数据寄存器(HW_SPI_DATA)...............................................................579
22.4.5 SPI 状态寄存器(HW_SPI_STATUS)...........................................................579
22.4.6 SPI 调试寄存器(HW_SPI_DEBUG0)......................................................... 580
22.4.7 SPI 传输数据量寄存器(HW_SPI_XFER)...................................................581
22.5 SPI 功能描述................................................................................................................. 581
22.6 QSPI 模块概述.............................................................................................................. 583
22.6.1 QSPI 模块简介...................................................................................................583
22.6.2 QSPI 模块特性...................................................................................................583
22.7 QSPI 可编程寄存器描述.............................................................................................. 583
22.7.1 QSPI 控制寄存器 0(HW_QSPI_CTRL0)....................................................583
22.7.2 QSPI 控制寄存器 1(HW_QSPI_CTRL1)....................................................584
22.7.3 QSPI 命令寄存器(HW_QSPI_CMD).......................................................... 586
22.7.4 QSPI 时序控制寄存器(HW_QSPI_TIMING).............................................586
22.7.5 QSPI 数据寄存器(HW_QSPI_DATA).........................................................587
22.7.6 QSPI 状态寄存器(HW_QSPI_STATUS).....................................................587
21.5.7 QSPI 调试寄存器(HW_QSPI_DEBUG0)................................................... 588
22.7.7 QSPI 传输数据量寄存器(HW_QSPI_XFER).............................................589
22.8 功能描述....................................................................................................................... 589
22.8.1 SPI 模块结构框图..............................................................................................589
22.8.2 SPI 帧格式..........................................................................................................590
22.8.3 Quad-SPI 帧格式................................................................................................594
第二十三章
SD
卡模块
........................................................................................... 595
23.
模块概述
............................................................................................................ 595
23.1 模块特性....................................................................................................................... 595
23.2 管脚描述....................................................................................................................... 595
23.3 比特率生成................................................................................................................... 595
23.4 功能描述....................................................................................................................... 596
23.4.1 SD/SDIO/SSP 格式............................................................................................ 596
23.4.2 MS 模式..............................................................................................................600
23.5 可编程寄存器............................................................................................................... 603
23.5.1 控制寄存器 0.....................................................................................................603
23.5.2 SD/MMC 和 MS 命令寄存器 0.........................................................................605
23.5.3 SD/MMC 命令寄存器 1.................................................................................... 606
23.5.4 SD/MMC 和 MS 比较参考寄存器................................................................... 608
23.5.5 SD/MMC 和 MS 比较掩码寄存器................................................................... 608
23.5.6 SSP 时序控制寄存器.........................................................................................608
23.5.7 SSP 控制寄存器 1..............................................................................................609
AlphaScale Technologies.Inc
http://www.alphascale.com 单芯片 32bit ARM9,采用 3D SIP 工艺内置 32MB SDRAM
芯片数据手册
©2012 AlphaScale Technologies,Inc.
xvii
ASM9260T-SIP176
23.5.8 SSP 数据寄存器.................................................................................................612
23.5.9 SD/MMC 卡响应寄存器 0................................................................................ 612
23.5.10 SD/MMC 卡响应寄存器 1.............................................................................. 613
23.5.11 SD/MMC 卡响应寄存器 2.............................................................................. 613
23.5.12 SD/MMC 卡响应寄存器 3.............................................................................. 613
23.5.13 SSP 状态寄存器...............................................................................................613
23.5.14 SSP 调试寄存器...............................................................................................615
23.5.15 XFER_COUNT 寄存器................................................................................... 616
第二十四章
CAMIF
接口模块
.................................................................................617
24.
模块描述
............................................................................................................ 617
24.1 简 介........................................................................................................................... 617
24.2 特 性........................................................................................................................... 617
24.3 管脚描述....................................................................................................................... 617
24.4 DCMI 时钟.....................................................................................................................617
24.5 DCMI 功能概述.............................................................................................................618
24.5.1 DMA 接口.......................................................................................................... 619
24.5.2 DCMI 物理接口................................................................................................. 619
24.5.3 同步方式............................................................................................................621
24.5.4 采样模式............................................................................................................624
24.5.5 截屏模式............................................................................................................625
24.5.6 JPEG 格式...........................................................................................................626
24.5.7 FIFO.................................................................................................................... 626
24.6 数据格式....................................................................................................................... 626
24.6.1 数据格式支持....................................................................................................626
24.6.2 单色格式(Monochrome)................................................................................... 627
24.6.3 RGB.....................................................................................................................627
24.6.4 YCbCr................................................................................................................. 627
24.7 DCMI 中断.....................................................................................................................628
24.8 可编程寄存器描述....................................................................................................... 628
24.8.1 控制寄存器(DCMI_CR)................................................................................... 629
24.8.2 状态寄存器(DCMI_SR)....................................................................................631
24.8.3 原始中断状态寄存器(DCMI_RIS).................................................................. 631
24.8.4 中断使能寄存器(DCMI_IER)..........................................................................632
24.8.5 屏蔽中断状态寄存器(DCMI_MIS)................................................................. 633
24.8.6 中断清零寄存器(DCMI_ICR)..........................................................................634
24.8.7 嵌入同步码寄存器(DCMI_ESCR).................................................................. 634
24.8.8 嵌入同步码屏蔽寄存器(DCMI_ESUR)..........................................................635
24.8.9 截取窗口起始点寄存器(DCMI_CWSTRT).................................................... 636
24.8.10 截取窗口大小寄存器(DCMI_CWSIZE)....................................................... 636
24.8.11 数据寄存器(DCMI_DR).................................................................................637
第二十五章
RTC
定时器模块
.................................................................................638
25.
概 述
.............................................................................................................. 638
25.1 模块特性....................................................................................................................... 638
25.2 RTC 模块设计框图....................................................................................................... 638
AlphaScale Technologies.Inc
http://www.alphascale.com 单芯片 32bit ARM9,采用 3D SIP 工艺内置 32MB SDRAM
芯片数据手册
©2012 AlphaScale Technologies,Inc.
xviii
ASM9260T-SIP176
25.3 接口信号定义............................................................................................................... 639
25.4 寄存器设计................................................................................................................... 640
25.4.1 中断位置寄存器(ILR—0X800A0000)............................................................ 640
25.4.2 时钟控制寄存器(CCR—0X800A0008)..................................................... 640
25.4.3 计数器增量中断寄存器(CIIR—0X800A000C).........................................640
25.4.4 报警屏蔽寄存器(AMR—0X800A0010).................................................... 641
25.4.5 完整时间寄存器 0(CTIME0—0X800A0014)............................................641
25.4.6 完整时间寄存器 1(CTIME1—0X800A0018)............................................642
25.4.7 完整时间寄存器 2(CTIME2—0X800A001C)........................................... 642
25.4.8 时间计时器组....................................................................................................642
25.4.9 校准寄存器(CALIBRATION—0X800A0040)...........................................643
25.4.10 通用寄存器..................................................................................................... 644
25.4.11 报警寄存器组..................................................................................................644
25.4.12 ALARM 寄存器(ALARM—0X800A0080).............................................. 645
25.5 RTC 使用流程............................................................................................................... 645
第二十六章 低分辨率
ADC
和触摸屏接口
............................................................647
26.
概 要
.............................................................................................................. 647
26.1 性能参数....................................................................................................................... 648
26.2 调度转换....................................................................................................................... 648
26.3 时钟和复位时行为....................................................................................................... 648
26.4 可编程寄存器............................................................................................................... 649
26.4.1 LRADC 控制寄存器 0.......................................................................................649
26.4.2 LRADC 控制寄存器 1.......................................................................................650
26.4.3 LRADC 控制寄存器 2.......................................................................................653
26.4.4 LRADC 控制寄存器 3.......................................................................................655
26.4.5 LRADC 控制寄存器 4.......................................................................................658
26.4.6 LRADC 状态寄存器..........................................................................................659
26.4.7 LRADC0 结果寄存器........................................................................................660
26.4.8 LRADC1 结果寄存器........................................................................................662
26.4.9 LRADC2 结果寄存器........................................................................................663
26.4.10 LRADC3 结果寄存器......................................................................................664
26.4.11 LRADC4 结果寄存器......................................................................................666
26.4.12 LRADC5 结果寄存器......................................................................................667
26.4.13 LRADC6 结果寄存器......................................................................................668
26.4.14 LRADC7 结果寄存器......................................................................................669
26.4.15 LRADC 调试寄存器 0.....................................................................................671
26.4.16 LRADC 调试寄存器 1.....................................................................................671
26.4.17 LRADC 电池转换寄存器................................................................................672
第二十七章 数模转换器
(DAC)...............................................................................674
27.
基本配置
............................................................................................................ 674
27.1 特 性........................................................................................................................... 674
27.2 寄存器描述................................................................................................................... 674
27.2.1 DAC_CTRL 寄存器...........................................................................................674
27.2.2 DAC_DATA0 寄存器.........................................................................................675
AlphaScale Technologies.Inc
http://www.alphascale.com 单芯片 32bit ARM9,采用 3D SIP 工艺内置 32MB SDRAM
芯片数据手册
©2012 AlphaScale Technologies,Inc.
xix
ASM9260T-SIP176
27.2.3 DAC_CNT0 寄存器........................................................................................... 675
27.3 操 作........................................................................................................................... 676
27.3.1 最简操作............................................................................................................676
27.3.2 超时计数器........................................................................................................676
27.3.3 双缓冲................................................................................................................676
第二十八章
LED
内存位赋值模块
(LED_RPCONV)........................................... 677
28.
概 述
................................................................................................................ 677
28.1 基本配置....................................................................................................................... 677
28.2 特 性........................................................................................................................... 677
28.3 基本操作....................................................................................................................... 677
28.4 寄存器描述................................................................................................................... 678
28.4.1 HW_LEDRPCONV_CTRL 寄存器.................................................................. 679
28.4.2 HW_LEDRPCONV_BITNUM 寄存器.............................................................679
28.4.3 HW_LEDRPCONV_SRCDATA 寄存器...........................................................679
28.4.4 HW_LEDRPCONV_DSTDATA 寄存器...........................................................680
28.4.5 HW_LEDRPCONV_RXDATA 寄存器.............................................................680
28.4.6 HE_LEDRPCONV_STATUS 寄存器................................................................680
第二十九章
LED
内存位翻转模块
(LED_BUPSET).............................................682
29.
概 述
................................................................................................................ 682
29.1 基本配置....................................................................................................................... 682
29.2 特 性........................................................................................................................... 682
29.3 基本操作....................................................................................................................... 682
29.4 寄存器描述................................................................................................................... 684
29.4.1 HW_BUPSET_CTRL 寄存器............................................................................684
29.4.2 HW_LEDBUPSET_SRCDATA 寄存器............................................................685
29.4.3 HW_LEDBUPSET_DSTDATA 寄存器............................................................685
第三十章
LED
内存行列转换模块
(LED_DCONV).............................................. 686
30.1 概 述
...................................................................................................... 686
30.2 基本配置
................................................................................................ 686
30.3 特 性
.................................................................................................... 686
30.4 基本操作
................................................................................................ 687
30.5 寄存器描述
............................................................................................ 690
30.5.1 LED_DCONV
控制寄存器
....................................................... 690
30.5.2 LED_DCONV
数据寄存器
....................................................... 690
第三十一章 电器特性
.............................................................................................. 692
第三十二章 封装尺寸信息
...................................................................................... 696
版本信息
.................................................................................................................... 696
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