AMIS-30522微步电机驱动器：集成保护与控制功能

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AMIS-30522是一款专为双极型步进电机设计的微步进电机驱动器，它结合了高集成度和灵活性。这款产品由50mA稳压器和一个用于外部微控制器的看门狗构成，旨在与微控制器通过I/O引脚和串行外围接口(SPI)进行连接，以实现精确的控制和通信。该驱动器的核心特性在于其内置的电流转换表，可以根据来自“NXT”输入引脚的时钟信号和“DIR”(方向)寄存器的状态或者外部输入决定下一步的微步进动作。这意味着用户可以灵活地调整电机的速度和负载，从而实现精细的定位控制。微步进功能允许从全步模式到1/32微步，这极大地提高了电机的精度和运动控制的灵活性。此外，AMIS-30522还内置了多重保护机制，包括过电流、欠压、过压保护，以及对线圈断路、短路和过热状态的诊断。这些保护措施确保了系统的稳定性和可靠性，减少了因电机故障可能导致的硬件损坏风险。在硬件开发过程中，使用AMIS-30522时，开发者需要熟悉SPI接口的通信协议，以及如何配置“DIR”寄存器来控制电机的方向。同时，由于芯片内部有看门狗电路，外部微控制器可以通过它实现对系统运行状态的监控，防止长时间无响应导致的系统停滞。值得注意的是，soiseek是一个专注于IC的专业搜索引擎，特别是针对中文资料，用户可以方便地查找并下载AMIS-30522的数据手册（datasheet），以便深入了解其具体参数和应用示例。在使用soiseek时，用户应了解版权信息，对于可能存在的翻译错误，应以原始英文资料为准。 AMIS-30522/NCV70521是一款适合需要高精度步进电机控制的项目，它提供了丰富的控制选项和保护功能，但同时也要求开发者具备一定的电子硬件和SPI接口设计知识。通过soiseek这样的专业平台，开发者可以轻松获取所需的技术支持和资源。

AMIS−30521, NCV70521

http://onsemi.com

PACKAGE THERMAL CHARACTERISTICS

The AMIS−30521/NCV70521 is available in an

NQFP−32 package. For cooling optimizations, the NQFP

has an exposed thermal pad which has to be soldered to the

PCB ground plane. The ground plane needs thermal vias to

conduct the heat to the bottom layer. Figure 3 gives an

example for good power distribution solutions.

For precise thermal cooling calculations the major

thermal resistances of the device are given. The thermal

media to which the power of the devices has to be given are:

• Static environmental air (via the case)

• PCB board copper area (via the exposed pad)

The thermal resistances are presented in Table 5: DC

Parameters.

The major thermal resistances of the device are the Rth

from the junction to the ambient (R

thja

) and the overall Rth

from the junction to exposed pad (R

thjp

). In Table 3 one can

find the values for the R

thja

simulated according to

JESD−51.

The R

thja

for 2S2P is simulated conform JEDEC JESD−51

as follows:

• A 4−layer printed circuit board with inner power planes

and outer (top and bottom) signal layers is used

• Board thickness is 1.46 mm (FR4 PCB material)

• The 2 signal layers: 70 mm thick copper with an area of

5500 mm

copper and 20% conductivity

• The 2 power internal planes: 36 mm thick copper with

an area of 5500 mm

copper and 90% conductivity

The R

thja

for 1S0P is simulated conform JEDEC JESD−51

as follows:

• A 1−layer printed circuit board with only 1 layer

• Board thickness is 1.46 mm (FR4 PCB material)

• The layer has a thickness of 70 mm copper with an area

of 5500 mm

copper and 20% conductivity

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎ

Figure 3. Example of NQFP−32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)

NQFP−32

ELECTRICAL SPECIFICATION

Recommended Operation Conditions

Operating ranges define the limits for functional

operation and parametric characteristics of the device. Note

that the functionality of the chip outside these operating

ranges is not guaranteed. Operating outside the

recommended operating ranges for extended periods of time

may affect device reliability.

Table 4. OPERATING RANGES

Symbol Parameter Min Max Unit

Analog DC supply +6 +30 V

Logic supply voltage 4.75 5.25 V

Junction temperature −40 +172 (Note 5) °C

5. No more than 100 cumulative hours in life time above T

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