TLSR8278-E: Telink多标准无线SoC技术规格

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"TLSR8278-E是Telink公司的一款多功能无线SoC（系统级芯片），适用于蓝牙低功耗（BLE）、IEEE802.15.4、Zigbee、RF4CE等多种无线通信标准。该芯片集成了高性能的微控制器、内存、各种工作模式、唤醒源、射频收发器、时钟、定时器、中断、接口、PWM、音频、QDEC、MDEC、ADC、温度传感器、低功耗比较器、AES加密、PKE、TRNG、PTA等功能。此数据手册详细介绍了TLSR8278的关键特性、工作模式、主要模块、电气规格以及应用情况。" TLSR8278-E是一款由Telink Semiconductor推出的多标准无线SoC，其核心特性包括： 1. **蓝牙低功耗（BLE）和IEEE802.15.4支持**：TLSR8278能够同时支持BLE协议和IEEE802.15.4标准，这使得它在物联网(IoT)和智能家居等领域具有广泛应用，可以用于构建BLE Mesh网络或Zigbee网络。 2. **集成微控制器（MCU）**：内置的MCU提供了强大的处理能力，可处理复杂的协议栈和应用逻辑，支持高效的数据处理和控制功能。 3. **内存**：芯片内置的内存为应用程序和数据存储提供了空间，确保了系统的快速响应和稳定运行。 4. **多种工作模式**：TLSR8278具备多种节能工作模式，如深度睡眠模式，以适应不同应用场景的低功耗需求。 5. **唤醒源**：支持多种唤醒源，能够快速从低功耗模式恢复到活动状态，提高能效。 6. **射频收发器**：高灵敏度和高输出功率的射频收发器，确保了无线通信的可靠性和距离。 7. **时钟和定时器**：精确的时钟系统和多种定时器，为实时操作和事件调度提供支持。 8. **接口支持**：包括UART、SPI、I2C等常见接口，方便与外部设备连接。 9. **模拟和数字外设**：如PWM（脉宽调制）、QDEC（Quadrature Decoder）、MDEC（Motor Decode）、ADC（模数转换器）等，可用于控制电机、处理传感器信号等。 10. **安全特性**：AES加密、PKE（Public Key Encryption）和TRNG（True Random Number Generator）等安全功能，保障数据传输的安全性。 11. **环境感知**：集成温度传感器和低功耗比较器，能够监测环境条件并做出相应反应。 12. **PTA（Programmable Timed Access）**：允许用户自定义访问时序，优化通信效率。此芯片适用于需要无线连接和低功耗操作的各种物联网设备，如智能传感器、智能家居设备、可穿戴设备等。由于其多标准兼容性，TLSR8278-E可以灵活地适应不断变化的无线通信标准和市场需求。

Datasheet for Telink TLSR8278

DS-TLSR8278-E7 12 Ver 0.8.3

Table 2-6 Characteristics of Initial Power-Up/Power-Down Sequence .................................................... 41

Table 2-7 Analog Registers for Wakeup ............................................................................................. 44

Table 2-8 Digital Register for Wakeup ............................................................................................... 45

Table 3-1 External RF Transceiver Control Example ............................................................................. 47

Table 3-2 Packet Format in Standard 1 Mbps BLE Modea ..................................................................... 47

Table 3-3 Packet Format in Standard 2 Mbps BLE Mode....................................................................... 47

Table 3-4 Packet Format in Standard 500 kbps/125 kbps BLE Mode...................................................... 48

Table 3-5 Packet Format in 802.15.4 Mode........................................................................................ 48

Table 3-6 Packet Format in Proprietary Mode ..................................................................................... 48

Table 4-1 Clock Register Table ......................................................................................................... 52

Table 5-1 Register Configuration for Timer0 ~ Timer2.......................................................................... 54

Table 5-2 Register Table for System Timer......................................................................................... 59

Table 6-1 Register Table for Interrupt System ..................................................................................... 61

Table 7-1 GPIO PAD Function Mux .................................................................................................... 65

Table 7-2 GPIO Setting.................................................................................................................... 66

Table 7-3 Select Multiplexed SPI/I2C ................................................................................................. 69

Table 7-4 GPIO IRQ Table ................................................................................................................ 71

Table 7-5 Analog Registers for Pull-Up/Pull-Down Resistor Control ....................................................... 73

Table 7-6 Register Configuration for I2C ............................................................................................ 76

Table 7-7 Register Configuration for SPI............................................................................................ 80

Table 7-8 SPI Master Mode .............................................................................................................. 81

Table 7-9 SPI Slave Mode ................................................................................................................ 82

Table 7-10 Register Configuration for UART ....................................................................................... 84

Table 8-1 Register Table for PWM ..................................................................................................... 88

Table 9-1 CODEC Frequency Table .................................................................................................. 101

Table 9-2 Audio Data Flow Direction ............................................................................................... 104

Table 9-3 Audio Input Registers...................................................................................................... 107

Table 9-4 Register Configuration Related to Audio Output Path ........................................................... 116

Table 10-1 Input Pin Selection ......................................................................................................... 118

Datasheet for Telink TLSR8278

DS-TLSR8278-E7 13 Ver 0.8.3

Table 10-2 Timing ........................................................................................................................ 122

Table 10-3 Register Table for QDEC ................................................................................................ 123

Table 11-1 Analog Registers for MDEC .............................................................................................. 126

Table 12-1 Overall Register Setting.................................................................................................. 129

Table 12-2 Register Table Related to SAR ADC ................................................................................. 130

Table 13-1 Analog Register for Temperature Sensor........................................................................... 134

Table 14-1 Analog Register Table Related to Low Power Comparator ................................................... 136

Table 15-1 Register Table Related to AES......................................................................................... 139

Table 16-1 Dual Port RAM Address Map............................................................................................ 142

Table 16-2 Register Map ................................................................................................................ 143

Table 17-1 Register Map................................................................................................................. 149

Table 18-1 Register Configuration for t1/t2 ....................................................................................... 157

Table 19-1 Absolute Maximum Ratings............................................................................................. 158

Table 19-2 Recommended Operating Conditions ............................................................................... 158

Table 19-3 DC Characteristics ......................................................................................................... 159

Table 19-4 Digital Inputs/Outputs Characteristics............................................................................... 159

Table 19-5 RF Performance Characteristics ....................................................................................... 159

Table 19-6 USB Characteristics ....................................................................................................... 163

Table 19-7 RSSI Characteristics ....................................................................................................... 163

Table 19-8 Crystal Characteristics.................................................................................................... 163

Table 19-9 RC Oscillator Characteristics ........................................................................................... 164

Table 19-10 ADC Characteristics...................................................................................................... 164

Table 19-11 SPI Characteristics........................................................................................................ 165

Table 19-12 I2C Characteristics ....................................................................................................... 165

Table 19-13 Flash Memory Characteristics ........................................................................................ 166

Table 19-14 HBM/CDM Results........................................................................................................ 167

Table 19-15 Latch-Up I-Test Result ................................................................................................. 167

Table 19-16 Latch-Up Vsupply Over Voltage Test Result..................................................................... 167

Table 20-1 BOM Table of TLSR8278F1KET48.................................................................................... 169

Datasheet for Telink TLSR8278

DS-TLSR8278-E7 14 Ver 0.8.3

1 Overview

The TLSR8278 is Telink-developed Bluetooth LE + IEEE 802.15.4 multi-standard wireless SoC solution with

internal Flash and audio support, which combines the features and functions needed for all 2.4 GHz IoT

standards into a single SoC. It's completely RoHS-compliant and 100% lead (Pb)-free.

The TLSR8278 combines the radio frequency (RF), digital processing, protocols stack

software and profiles for

multiple standards into a single SoC. The chip supports standards and industrial alliance specifications

including Bluetooth Low Energy (up to Bluetooth 5.1), BLE Mesh, Zigbee, RF4CE, ANT and 2.4 GHz proprietary

standard. The TLSR8278's embedded FLASH enables dynamic stack and profile configuration, and the final

end product functionality is configurable via software, providi

ng ultimate flexibility. The TLSR8278 also has

hardware OTA upgrades support and multiple boot switching, allowing convenient product feature roll outs

and upgrades.

The TLSR8278 supports concurrent multi-standards. For some use cases, the TLSR8278 can "concurrently" run

two standards, for example, stacks such as BLE and 802.15.4 can run concurrently with one application state

but dual radio communicat

ion channels for interacting with different devices. The end product working in this

mode can maintain active Bluetooth Smart connections to smart phones or other BLE devices while control

and communicate with 802.15.4 or other 2.4 GHz devices at the same time. In this case, it's compatible with

Bluetooth standard, supports BLE specification up to Bluetooth 5.1, allows easy connectivity with Bluetoot

Smart Ready mobile phones, tablets, laptops, which supports BLE slave and master mode operation, including

broadcast, encryption, connection updates, and channel map updates. At the same time, it also supports IEEE

802.15.4 standard and Zigbee-compliant platform, and is perfect for creating interoperable solution for use

within the home combined with leading Zigbee/RF4CE software stack. This feature

enables products to bridge

the smartphone and home automation world with a single chip and no requirement for an external hub.

The TLSR8278 integrates hardware acceleration to support the complicated security operations without the

requirement for an external DSP, thereby significantly reducing the product eBOM.

The TLSR8278 supports single-channel analog microphone or dual-channel digital microphon

e, and stereo

audio output with enhanced voice performance for voice search and other such applications. The TLSR8278

also includes a full range of on-chip peripherals for interfacing with external components such as LEDs,

sensors, touch controllers, keyboards, and motors. This makes it an ideal single-chip solution for IoT (Internet

of Things) and HID (Human Interface Devices) applications such as we

arable devices, smart lighting, smart

home devices, advanced remote controls, and wireless toys.

The TLSR8278 series is compliant with worldwide radio frequency regulations, including ETSI EN 300 328 and

EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan).

1.1 Block Diagram

The TLSR8278 is designed to offer high integration, ultra-low power application capabilities. The system's

block diagra

m is as shown in Figure 1-1.

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