MT48LC2M32B2P6AIT 数据手册：3.3V SDRAM技术规格

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"MT48LC2M32B2P6AIT.PDF 是一份关于 SDRAM (Synchronous Dynamic Random Access Memory) 的数据手册，详细介绍了MT48LC2M32B2这款芯片的特性、功能和操作模式。这款芯片符合PC100标准，适用于高速同步系统。" MT48LC2M32B2是一款512Kx32x4 Banks的SDRAM芯片，具备以下关键特点： 1. 同步性：所有信号在系统时钟的正沿进行注册，确保与系统时钟完全同步，提高数据处理效率。 2. 内部流水线操作：允许在每个时钟周期内改变列地址，提高了访问速度。 3. 内部分组银行：通过内部银行结构隐藏行访问/预充操作，减少了等待时间。 4. 可编程突发长度：支持1、2、4、8或全页的突发传输，提供灵活的数据传输选择。 5. 自动预充：包括并发自动预充和自动刷新模式，简化了内存管理。 6. 自我刷新模式：在商业和工业级产品中，支持64ms内进行4096周期的刷新；在汽车级产品中，刷新周期缩短至16ms。 7. 低电压TTL兼容输入和输出：采用单3.3V±0.3V电源，兼容低电压逻辑系统。 8. CAS延迟支持：支持CAS（Column Address Strobe）延迟CL为1、2、3个时钟周期的不同应用场景。 9. 封装选项：包括86引脚TSOPII封装（400mil标准和无铅）、90球VFBGA封装（8mm x 13mm无铅）。 10. 工作周期时间：提供不同速度等级，如5ns（200MHz）、5.5ns（183MHz）、6ns（167MHz）等。 11. 工作温度范围：涵盖商业（0°C至+70°C）、工业（-40°C至+85°C）和汽车（-40°C至+105°C）三个级别。这个数据手册还可能包含了关于芯片的电气特性、引脚定义、操作和测试条件、电源需求以及热特性等相关信息，对于设计和使用该SDRAM芯片的硬件工程师来说，是至关重要的参考资料。

Figure 5: 90-Ball VFBGA (8mm x 13mm) – Package Codes B5

Ball A1 ID

1.00 MAX

Mold compound:

Epoxy novolac

Substrate material:

Plastic laminate

Solder ball material:

62% Sn, 36% Pb, 2% Ag or

96.5% Sn, 3%Ag, 0.5% Cu

13.00 ±0.10

Ball A1

Ball A9

Ball A1 ID

0.80 TYP

6.50 ±0.05

8.00 ±0.10

4.00 ±0.053.20 ±0.05

5.60 ±0.05

0.65 ±0.05

Seating plane

11.20 ±0.10

6.40

0.12 A

90X Ø0.45

Dimensions apply

to solder balls post

reflow. The pre-reflow

diameter is 0.42 on a

0.40 SMD ball pad.

0.80 TYP

Notes:

1. All dimensions are in millimeters.

2. Package width and length do not include mold protrusion; allowable mold protrusion is

0.25mm per side.

3. Recommended pad size for PCB is 0.33mm ±0.025mm.

64Mb: x32 SDRAM

Package Dimensions

PDF: 09005aef811ce1fe

64mb_x32_sdram.pdf - Rev. V 09/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Temperature and Thermal Impedance

It is imperative that the SDRAM device’s temperature specifications, shown in Temper-

ature Limits below, be maintained to ensure the junction temperature is in the proper

operating range to meet data sheet specifications. An important step in maintaining the

proper junction temperature is using the device’s thermal impedances correctly. The

thermal impedances are listed in Table 6 (page 16) for the applicable die revision and

packages being made available. These thermal impedance values vary according to the

density, package, and particular design used for each device.

Incorrectly using thermal impedances can produce significant errors. Read Micron

technical note TN-00-08, “Thermal Applications” prior to using the thermal impedan-

ces listed in Table 6 (page 16). To ensure the compatibility of current and future de-

signs, contact Micron Applications Engineering to confirm thermal impedance values.

The SDRAM device’s safe junction temperature range can be maintained when the T

specification is not exceeded. In applications where the device’s ambient temperature

is too high, use of forced air and/or heat sinks may be required to satisfy the case tem-

perature specifications.

Table 5: Temperature Limits

Parameter Symbol Min Max Unit Notes

Operating case temperature Commercial T

0 80 °C 1, 2, 3, 4

Industrial –40 90

Automotive –40 105

Junction temperature Commercial T

085°C3

Industrial –40 95

Automotive –40 110

Ambient temperature Commercial T

0 70 °C 3, 5

Industrial –40 85

Automotive –40 105

Peak reflow temperature T

PEAK

– 260 °C

Notes:

1. MAX operating case temperature T

is measured in the center of the package on the

top side of the device, as shown in Figure 6 (page 16) and Figure 7 (page 17).

2. Device functionality is not guaranteed if the device exceeds maximum T

during opera-

tion.

3. All temperature specifications must be satisfied.

4. The case temperature should be measured by gluing a thermocouple to the top-center

of the component. This should be done with a 1mm bead of conductive epoxy, as de-

fined by the JEDEC EIA/JESD51 standards. Take care to ensure that the thermocouple

bead is touching the case.

5. Operating ambient temperature surrounding the package.

64Mb: x32 SDRAM

Temperature and Thermal Impedance

PDF: 09005aef811ce1fe

64mb_x32_sdram.pdf - Rev. V 09/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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