M.2规格1.1版：2016年PCIe接口详细设计与PCB布局指南

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M.2 Specification Rev1.1 TS 03072016 是由PCI-SIG（PCI Express Special Interest Group）发布的一份规范文档，它详细定义了M.2接口的标准规格。M.2接口是一种广泛应用于现代计算机主板上的高速存储接口，主要用于固态硬盘（SSD）和其他扩展卡的连接，以其紧凑的尺寸和高效的数据传输能力而闻名。该文档的核心内容涵盖了以下几个方面： 1. **机械尺寸**：M.2接口定义了不同类型的插槽，包括M.2规格128pin（Type 1）、228pin（Type 2）、2210pin（M-Key，用于传统SATA接口的替代）以及2232pin（B-Key，用于NVMe SSD的高性能连接）。这些尺寸决定了接口的物理形态和适配器的设计要求。 2. **信号定义**：文档明确了数据线的排列方式、针脚功能以及电气特性，这对于电路设计至关重要，确保数据在接口间准确无误地传输。这包括了数据线速率（如PCIe Gen3 x4等），以及控制信号如CMD、地址、数据线等。 3. **电气需求**：M.2接口对电压、电流、噪声容限等电气参数有明确标准，保证了与其他硬件组件的兼容性，并确保了系统的稳定运行。 4. **平台对接信息**：提供了关于M.2插槽与主板上其他组件（如电源、时钟、中断线路等）如何正确连接的指导，这对于制造商设计主板和用户选择合适设备时必不可少。 5. **PCB布局关键说明**：文档中可能包含了关于如何在印刷电路板（PCB）上设计和布局M.2接口的建议，包括信号走线、防干扰措施和热管理策略。 6. **版权与免责声明**：PCI-SIG明确声明，该文档仅供合法使用，并且不承担因使用或错误信息导致的责任。任何关于规格的问题或PCI-SIG成员资格的问题，用户都可以通过指定的联系方式查询最新的修订版。 M.2 Specification Rev1.1 TS 03072016是工程师、系统设计师和硬件开发者的重要参考资料，它提供了构建现代高性能计算平台所需的关键技术细节和规范要求。遵循这份文档，可以确保产品的互操作性和性能优化。

PCI Express M.2 Specification

PCI Express M.2 Specification | 16

Revision 1.1, March 7, 2016

List of Tables

Table 1. Optional Module Configurations............................................................................................. 27

Table 2. General Tolerance ................................................................................................................. 28

Table 3. Key Location/Pin Block Dimensions for Keys A - F ............................................................... 42

Table 4. Key Location/Pin Block Dimensions for Keys G - M .............................................................. 42

Table 5. RF Connector Physical Characteristics ................................................................................. 65

Table 6. RF Connector Mechanical Requirements .............................................................................. 65

Table 7. RF Connector Electrical Requirements ................................................................................. 66

Table 8. RF Connector Environmental Requirements ......................................................................... 66

Table 9. Recommended Antenna Function Allocation Table............................................................... 67

Table 10. Connector/Module Type Supported Matrix ............................................................................ 70

Table 11. Connector Physical Requirements......................................................................................... 71

Table 12. Connector Environmental Requirements ............................................................................... 72

Table 13. Connector Electrical Requirements ....................................................................................... 72

Table 14. Stand-off Height Descriptor Table.......................................................................................... 94

Table 15. Socket 1 System Interface Signals and Voltage Table ........................................................ 102

Table 16. Power-up CLKREQ# Timings .............................................................................................. 109

Table 17. Power-up Timing Variables .................................................................................................. 111

Table 18. DP_MLDIR Pin Termination ................................................................................................. 113

Table 19. SDIO Reset and Power-up Timing....................................................................................... 114

Table 20. Simple Indicator Protocol for LED States ............................................................................ 120

Table 21. Radio Operational States ..................................................................................................... 121

Table 22. SDIO Based Module Solution Pinouts (Module Key E) ....................................................... 123

Table 23. Display Port Based Module Solution Pinouts (Module Key A) ............................................ 124

Table 24. Socket 1 Module Pinouts (Module Key A-E) ........................................................................ 125

Table 25. Socket 2 System Interface Signal Table .............................................................................. 129

Table 26. GPIO Pin Function Assignment per Port Configuration ....................................................... 138

Table 27. Audio Pin Mode and Function Assignment .......................................................................... 140

Table 28. Antenna Control Pin Mode and Function Assignment ......................................................... 141

Table 29. Socket 2 Module Configuration ............................................................................................ 143

Table 30. Socket 2 Key B SSIC-based WWAN Module Pinouts ......................................................... 145

Table 31. Socket 2 Key B USB3.0-based WWAN Module Pinout ....................................................... 146

Table 32. Socket 2 Key B PCIe-based WWAN Module Pinout ........................................................... 147

Table 33. Socket 2 Key B-M SATA-based SSD Module Pinout .......................................................... 148

Table 34. Socket 2 Key B-M PCIe-based SSD Module Pinout............................................................ 149

Table 35. Socket 2 Key C WWAN Module Pinout ............................................................................... 150

PCI Express M.2 Specification

PCI Express M.2 Specification | 17

Revision 1.1, March 7, 2016

Table 36. Socket 3 System Interface Signal Table .............................................................................. 151

Table 37. Socket 3 SATA-based Module Pinouts (Module Key M) ..................................................... 154

Table 38. Socket 3 PCIe-based Module Pinouts (Module Key M)....................................................... 155

Table 39. BGA SSD System Interface Signal Table ............................................................................ 156

Table 40. DC Specification for 3.3 V Logic Signaling .......................................................................... 163

Table 41. DC Specification for 1.8 V Logic Signaling .......................................................................... 164

Table 42. Power Ramp Timing ............................................................................................................ 166

Table 43. Power Rail Slew Rate .......................................................................................................... 167

Table 44. Key Regulated Power Rail Parameters ............................................................................... 168

Table 45. Key VBAT Power Rail Parameters ...................................................................................... 168

Table 46. Power Rating Table for M.2 Modules with Connectors........................................................ 169

Table 47. Mechanical Key Assignments .............................................................................................. 171

Table 48. Socket 1 Versions ................................................................................................................ 172

Table 49. Display Port Based Socket 1 Pinout Diagram (Mechanical Key A) On Platform ................ 174

Table 50. SDIO Based Socket 1 Pinout Diagram (Mechanical Key E) On Platform ........................... 176

Table 51. Socket 2 Module Configuration Table .................................................................................. 178

Table 52. Socket 2 Pinouts Diagram (Mechanical Key B) On Platform ............................................... 180

Table 53. Socket 2 Pinout Diagram (Mechanical Key C) on Platform ................................................. 182

Table 54. Socket 3 SSD Pinout (Mechanical Key M) On Platform ...................................................... 183

Table 55. Signal Integrity Requirements and Test Procedures for M.2 ............................................... 193

Table 56. Example of Prepared Wire with Plug, Unit: mΩ ................................................................... 205

Table 57. Contact Resistance for the Sample Wires/Plugs, Unit: mΩ ................................................. 206

Table 58. Assumptions for Typical Components and Dissipation........................................................ 207

Table 59. Maximum Dissipation for WWAN Modules .......................................................................... 208

Table 60. Generic Assumptions for Package Designations and Types Expected to

Populate Modules ................................................................................................................ 208

Table 61. Assumptions for Generic System Environments ................................................................. 209

Table 62. Slot Definitions, Systems with Fans ..................................................................................... 210

Table 63. Slot Definitions, Systems without Fans ................................................................................ 210

Table 64. Example Use Case Applicable to Modules for Notebooks .................................................. 213

Table 65. Thermal Design Power Response – Notebook Category .................................................... 217

Table 66. Skin Temperature Limit Assumptions, Notebook ................................................................. 217

Table 67. Skin Temperature Effect of Module Position ....................................................................... 218

Table 68. Use Cases Applicable to Modules for Thin Platform Notebook with Fan ........................... 218

Table 69. Thermal Design Power Response – Thin Platform Notebook with Fan Category ............... 223

Table 70. Skin temperature limit assumptions, Thin platform notebook with Fan ............................... 223

Table 71. Use Cases Applicable to Modules for Tablet without Fan ................................................... 224

Table 72. Thermal Design Power Response—Tablet Category .......................................................... 227

Table 73. Skin Temperature Limit Assumptions, Tablet without Fan .................................................. 228

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