OMAP
™
4 mobile
applications platform
Product Bulletin
Texas Instruments’ (TI) OMAP
™
4 mobile
applications platform will redefine the mobile
phone of tomorrow with new, innovative user
experiences driven by PC-like web browsing,
1080p full HD video record and playback,
intuitive user interfaces, location-based
services and next-generation social networking
applications. The OMAP 4 platform includes
applications processors, a comprehensive
software suite, power management technology
and supporting components to bring next-
generation Smartphones and Mobile Internet
Devices (MIDs) to market quickly. The platform
is future proof, offering the programmability and
performance headroom to support new and
emerging applications and standards. Not only
will the OMAP 4 platform accelerate time to
market and reduce research and development
(R&D) time and costs for handset manufactur-
ers, but its flexibility and openness will enable
manufacturers to deliver innovative applications
at breakthrough mobile computing performance.
TI tests the OMAP 4 platform for real-world use
cases, accelerating time to market and enabling
stunning user experiences.
Overview
At the heart of the OMAP 4 platform is a power-
ful system-on-chip that includes the perfect bal-
ance of power efficiency and high performance.
The OMAP 4 processor balances processing
across four main engines: a programmable
multimedia engine based on TI’s C64x DSP and
power-efficient, multi-format hardware accel-
erators; general-purpose processing based on
the dual-core ARM
®
Cortex™-A9 MPCore™
supporting symmetric multiprocessing (SMP) and
capable of speeds of more than 1 GHz per core;
a high-performance programmable graphics
engine; and an Image Signal Processor (ISP) for
unparalleled video and imaging performance.
The OMAP 4 family includes two applications
• Highly-optimized mobile applications
platform including: applications
processors, multimedia software and
power management to drive Smartphones
and MIDs
• IVA 3 accelerator enables full HD 1080p,
multi-standard video encode/decode
• Integrated Image Signal Processor (ISP) for
faster, higher-quality image and video capture
with digital SLR-like 20-megapixel imaging
• Integrated POWERVR™ SGX540 graphics
accelerator drives next-generation, 3D
user interfaces with larger displays, life-like
graphics and intuitive touch screens
• Dual-core ARM
®
Cortex™-A9 MPCore
™
with SMP for higher mobile computing
performance and PC-like, no compromise
web browsing experience
• Support for leading mobile operating systems
including Symbian™, Microsoft
®
Windows
Mobile
®
, Linux
®
(Android, LiMo)
• Comprehensive software suite supporting
all major mobile OSes that is fully integrated
and tested for real-world use cases to
reduce development time and costs
Key Features
TI’s new OMAP 4 platform supports development of planned features for the Smartphones and MIDs of tomorrow with
tremendous performance and programmability to support new applications yet to be imagined.
processors, both based on the dual-core
Cortex-A9 MPCore general purpose proces-
sors: the OMAP4430 operates at up to 720
MHz, while the OMAP4440 operates at up to
1 GHz. Both processors offer the full variety of
subsystems and applications discussed below to
deliver hardware and software system solutions
that scale across customer roadmaps optimizing
time to market, flexibility and R&D efficiency.
• Programmability and performance
headroom to support new and emerging
applications and standards
• Pre-integrated connectivity solutions from
TI’s portfolio of WiLink
™
, BlueLink
™
and
NaviLink
™
mobile connectivity solutions
and pre-validated modem interface
software to connect with any external
modem
• Industry-leading power management and
SmartReflex
™
2 technologies delivers
more than 10 hours of 1080p HD video
playback, 4+ hours of 1080p HD video
recording and 140+ hours of CD quality
audio playback
• Designed in mobile 45-nm CMOS
process technology for less power
consumption and increased device
performance
• M-Shield
™
capability enhanced with
ARM TrustZone™ support ensures
mobile security
• Packaging: 12 mm x 12 mm, 0.4 mm
pitch PoP (Package-on-Package)