OrCAD Capture PDF教程：完整PCB设计指南

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"《使用OrCAD Capture和Layout进行全面PCB设计》" 该学习资料由Kraig Mitzner撰写，是关于OrCAD软件在PCB（印制电路板）设计中的全面指南。OrCAD是一款广泛应用于电子设计领域的集成开发环境，特别在电路设计、布线和模拟分析方面具有强大的功能。"Capture"模块通常用于捕获设计输入，如原理图，而"Layout"模块则负责将这些概念转化为物理布局。在这本书中，作者详细介绍了如何使用OrCAD Capture有效地导入和管理电路图，包括元件库的使用、线路连接、电源和信号处理等方面。用户可以学习到如何创建和编辑电路图，以及如何通过精确的图形交互工具进行设计。此外，书中还会讲解如何进行电路板层次设计，确保信号完整性，并且提供优化布线策略的建议。布局阶段是关键，书中会涵盖规则检查、走线技术、封装选择和设计规则遵守等内容，帮助设计师避免潜在的问题，比如电磁干扰（EMI）和热管理问题。此外，书还可能探讨自动化工具和技术，如焊盘尺寸计算、自动布线算法，以及如何利用OrCAD的高级特性如3D视图和仿真功能来验证设计性能。版权信息表明，这本书受到严格的版权保护，未经许可，不得任何形式的复制、存储或传播。获取使用权限可以通过联系Elsevier的科技版权部门或者在线平台完成，以尊重作者和出版商的权益。《使用OrCAD Capture和Layout进行全面PCB设计》是一本深入浅出的教程，旨在帮助读者掌握专业级的PCB设计流程，无论是初学者还是经验丰富的工程师都能从中受益匪浅，提升他们的设计效率和产品质量。对于电子设计专业人士来说，这是一本不可或缺的学习和参考资源。

Introduction to Complete PCB Design

Using OrCAD Capture and Layout

I did not write this book because I am an OrCAD guru. I wrote it because no up-to-date

references were available when I was trying to learn how to use the software. This book is the

one I wish I would have had. This book was born from notes I compiled as I learned (the hard

way) to use the software. The initial intent of the book was to describe how to use OrCAD

Layout speciﬁ cally. Along the way, though, I realized also that I (and many of the engineers I

talked to) had a lot to learn about the printed circuit board (PCB) design process itself. There

was a signiﬁ cant amount of information available on PCB design from both the electrical and

the manufacturing aspects, but there was not an easily accessible resource that covered those

subjects with how to use the software. That is the intent of this book.

Chapter 1 introduces the reader to the basics of PCB design. The chapter begins by introduc-

ing the concepts of computer-aided engineering, computer-aided design, and computer-aided

manufacturing. The chapter then explains how these tools are used to design and manufacture

multilayer PCBs. Many 3-D pictures are used to show the construction of PCBs. Topics such

as PCB cores and layer stack-up, apertures, D-codes, photolithography, layer registration,

plated through-holes, and Gerber ﬁ les are explained.

Chapter 2 leads new users of the software through a very simple design example. The purpose

of the example is to paint a “big picture” of the design ﬂ ow process. The example begins with

a blank schematic page and ends with the Gerber ﬁ les. The circuit is ridiculously simple so

that it is not a distraction to understanding the process itself. Along the way some of Layout’s

routing tools are brieﬂ y introduced along with some of the other tools, which sets the stage

for Chap. 3.

Chapter 3 provides an overview of the OrCAD project ﬁ les and structure and explains

Layout’s tool set in detail. The chapter revisits and explains some of the actions performed

and tools used during the example in Chap. 2. Gerber ﬁ les are also explained in detail.

Chapter 4 introduces some of the industry standards organizations related to the design and

fabrication of PCBs (e.g., IPC and JEDEC). PCB performance classes and producibility

levels are also described along with the basic ideas behind standard fabrication allowances.

These concepts are described here to help the reader realize some of the fabrication issues

up front to help minimize board failures and to identify some of the guides and standards

resources that are available for PCB design.

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Chapter 5 addresses the mechanical aspect of PCB design—design for manufacturability

(DFM). The chapter explains where parts should be placed on the board, how far apart, and in

what orientation from a manufacturing perspective. OrCAD Layout’s design rule checker is

then considered relative to the manufacturing concepts and IPC’s courtyard concepts. To aid

in understanding the design issues, manufacturing processes such as reﬂ ow and wave solder-

ing, pick-and-place assembly, and thermal management are discussed. The information is then

used as a guide in designing plated through-holes, surface-mount lands, and Layout footprints

in general. Tables summarize the information and serve as a design guide during footprint

design and PCB layout.

Chapter 6 addresses the electrical aspect of PCB design. There are several good references

available on signal integrity, electromagnetic interference, and electromagnetic compatibility.

Chapter 6 provides an overview of those topics and applies them directly to PCB design.

Topics such as loop inductance, ground bounce, ground planes, characteristic impedance,

reﬂ ections, and ringing are discussed. The idea of “the unseen schematic” (the PCB layout)

and its role in circuit operation on the PCB is introduced. Look-up tables and equations are

provided to determine required trace widths for current handling and impedance as well as

required trace spacing for high-voltage designs and high-frequency designs. Various layer

stack-up topographies for analog, digital, and mixed-signal applications are also described.

The design examples in Chap. 9 demonstrate how to apply the layer stack-ups described in

this chapter.

Chapter 7 explains how to construct Capture parts using the Capture Library Manager and

Part Editor and the PSpice Model Editor. Heterogeneous and homogeneous parts are devel-

oped in examples using four different methods. Different methods are used depending on

whether a part will be used for simple schematic entry, design projects intended for PCB

layout, PSpice simulations, or all of the above. The chapter also demonstrates how to attach

PSpice models to Capture’s schematic parts using PSpice models downloaded from the Inter-

net and basic PSpice models developed from functional Capture projects. The Capture parts

can then be used for both PSpice simulations and PCB layout as demonstrated in Chap. 9.

Detailed coverage of padstacks and footprints is covered in Chap. 8. The chapter intro-

duces the Layout Library Manager, Layout’s footprint naming conventions, and the basic

composition of a footprint. Then a detailed description of the padstack (as it relates to PCB

manufacturing described in Chaps. 1 and 5) is given, as it is the foundation of both footprint

design and PCB routing. Design examples are provided to demonstrate how to design discrete

through-hole and surface-mount devices and how to use the pad array generator to design

footprints for pin grid arrays and ball grid arrays with dogbone fanouts included with the

footprint.

Chapter 9 provides four PCB design examples that use the material covered in the previ-

ous eight chapters. The ﬁ rst example is a simple analog design using a single op-amp. The

design shows how to set up multiple plane layers for positive and negative power supplies

and ground. The design also demonstrates several key concepts in Capture, such as how to

connect global nets, how to assign footprints, how to perform design rule checks, how to

xvi

Introduction

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use the Capture part libraries, how to generate a bill of materials (BOM), and how to use

the BOM as an aid in the design process in Capture and Layout. The design also shows how

to perform important tasks in Layout such as how to load board technology ﬁ les, locate

speciﬁ c parts, and modify padstacks. Intertool communication (such as annotation and back

annotation) between Capture and Layout is also demonstrated. The second design is a mixed

digital/analog circuit. In addition to the tasks demonstrated in the ﬁ rst example, the design

also demonstrates how to set up and use split planes to isolate analog and digital power

supplies and grounds. Other tasks include using copper pours on routing layers to make

partial ground planes, using copper pours on plane layers to make nested power and ground

planes, and deﬁ ning anti-copper areas on plane and routing layers. The third example uses

the same mixed digital/analog circuit from the second example but demonstrates how to use

multiple page schematics and off-page connectors to add PSpice simulations to a Capture

project used for PCB layout, all within a single project design. It also demonstrates how

to construct multiple, separated power and ground planes and a shield plane to completely

isolate analog from digital circuitry. The use of guard rings and guard traces is also demon-

strated. The fourth example is a high-speed digital design, which demonstrates how to design

transmission lines, stitch multilayer ground planes, perform pin/gate swapping, place moated

ground areas for clock circuitry, and design a heat spreader.

Chapter 10 describes how to postprocess a PCB design and generate speciﬁ c Gerber ﬁ les.

Through an example it is shown how to relate the OrCAD Layout design perspective and layer

stack-up (including image polarity) to the board manufacturer’s perspective by submitting

Gerber ﬁ les to an actual board manufacturer via the Internet. The discussion also provides an

example fabrication quote. Nonstandard Gerber ﬁ les are brieﬂ y discussed as well as Gerber

ﬁ les that are generated for PCBs with nonplated mounting holes.

Chapter 11 introduces other tools that can be used with OrCAD Capture and Layout to

enhance the PCB design process. The chapter provides examples of how to use Microsoft

Excel with the bill of materials generated by Capture to create parts lists and various other

tracking documents that can be used during the PCB layout process to minimize design

errors. Other examples include how to use PSpice to simulate transmission lines to aid in

circuit design and PCB layout, how to use the SPECCTRA autorouter with Layout to route

high-density PCB designs faster and with less manual cleanup, how to use GerbTool to

panelize a board design, and how to use Layout to generate a .DXF ﬁ le that can be used by

a graphics program to construct a 3-D image of your board design. The IPC Land Pattern

Viewer is also introduced in this chapter.

Kraig Mitzner

completePCBbook@msn.com

xvii

Introduction

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