IEC 61193-3:2013 - 印刷板与层压板质量审计抽样计划

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"IEC 61193-3:2013 是一份国际电工委员会（International Electrotechnical Commission, IEC）制定的质量评估系统标准，专注于印刷板和层压板生产过程中的抽样计划选择和使用。这份标准详细规定了在属性检查基础上的抽样计划，为确保产品质量提供了指导。它涵盖了抽样计划的选择标准，以及如何在印刷电路板和层压板的最终产品及制造过程审核中实施这些计划。" 这篇标准的核心内容包括以下几个关键知识点： 1. **抽样计划**：IEC 61193-3 提供了基于属性的抽样计划，这些计划旨在检查产品的形式、适合性和功能特性。抽样计划是质量控制的重要工具，帮助制造商在大规模生产中检测潜在的问题。 2. **分类原则**：标准根据产品特性的不同重要性进行分类，允许采用不同的抽样策略来适应单一属性或一组属性的检查。这种灵活性使得标准能够适应各种复杂的生产环境和质量要求。 3. **过程审核**：标准不仅关注最终产品的质量，还强调了过程审计的重要性。通过对制造过程的持续监控，可以及时发现并纠正质量问题，防止缺陷产品流入市场。 4. **适用范围**：适用于印刷板和层压板制造行业的质量保证体系，确保了行业内的一致性和标准化，从而提高整体产品质量。 5. **实施程序**：标准详细描述了如何选择合适的抽样计划，并给出了实施步骤，为制造商提供了一个清晰的操作指南，以确保符合标准要求。 6. **国际化标准**：IEC 61193-3 是一份国际通用的标准，这意味着它在全球范围内具有广泛的认可度，对于促进国际贸易和提升产品质量具有重要意义。通过遵循这份标准，制造商能够建立有效的质量控制系统，减少不合格产品的产生，同时增强客户对产品可靠性的信心。这份标准的详细内容，包括具体的抽样方案和实施细节，可在138页的完整英文版中找到，对于从事电子制造和相关质量控制的专业人员来说，是不可或缺的参考资料。

Table 2 - Risk management index values (Associated AQ Limits)

0,010 0,

5 0,025 0,040 0,065 0,10 0,15 0,25 0,40 0,65 1,0 1

2,5

Lot size

Sample size

2-8

• • • • • • • • • • • •

9 -

• • • • • • • • • •

13 8 5

- 25

•

20 13 8 5

- 50

• • • • • • • •

32 20

8 5

- 90

• •

•

• •

•

32 20 13 8 7

- 150

•

125 80

32 20 13 12

151 - 280

• • • •

200 125 80

32 20 20 19 13

281 - 500

• •

•

315 200 125 80

48 47

501

- 1 200

•

800 500

315 200 125

73 47 34

201

- 3,200

1 250 800 500 315 200 125 120

116

73 53

201

- 10 000

1 250 800 500 315 200 192 189 116 86 68

38 29

001

000

1 250

800 500

315

300

294 189 135 108 77

001

- 150 000

1 250 800 500

490 476 294

218

170

123 96

150 001 - 500 000

1 250 800 750 715 476 345 270 200 156 119 90

500 001 and over

1 250

1 200

1 112 715

435

303

244

189 143

102 64

Remarks:

The symbol • indicates "inspect the entire lot".

the l

is smaller than the sample si

, the enti

lot should be inspected.

If samples contain no defect

the entire lot is accepted.

the sample contai

one or more defects, the entire lot is

jected.

4,0 6

3 2

3 3

5 5

6 5

7 6

15 11

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61193-3 © IEC:2013

Because

the zero accept number, the idea of combining lots under the c = 0 plans may arise

because of the zero accept number. Aside from experience, which has shown that,

fact,

considerable savings can be derived, one should consider the following:

• if the quality is very bad, acceptance numbers greater than zero will not be of much help;

• to allow acceptance numbers greater than zero

the plan, one is in effect authorizing an

inspector to accept parts which may not

usable;

• the zero acceptance number forces a review

any defectives by quality assurance

personnel

order to enable proper withdrawal of the defectives;

• if zero defects are to be achieved, it should be obvious that defectives should not knowingly

allowed to be shipped.

The c = O plans were essentially designed to be equal or greater

consumer and average

outgoing quality limit protection. Within a particular column of the details shown in Table 2

representing the index value, the operating characteristic curves actually differ for the most

part between c = O and c > O plans, especially as the lot size increases. The reason for this

common feature, in addition to satisfying the statistical relationship, is that it is generally

consider

more practical to obtain greater protection on larger lot sizes. Table 3 provides

guidance to selection of sample sizes and comes from the standards developed for printed

circuit board and laminate characteristic requirements. Table

A.1

of Annex A provides a

consensus sampling plan from IEC 62326-4 that identifies the different product characteristics,

the number of samples that should be taken for performance levels

and C, and the risk

management index va

e to be used from Table 2.

Table 3 - Sample size selection guideline

Defects

Attributes

Critical

Major Minor

Critical 0, 1

1,0

2,5

Major 1,0 2,5

4,0

Minor 2,5

4,0

6,5

The use of constant sample sizes often results in a combination of over-inspection and under-

inspection. For a broad range of lot sizes

general, however,

order to develop

inspection

strategy,

evaluation should

made as to the attribute classification (critical, major, minor).

This listing of comparisons should identify the risk management index value shown

the

Table 2 and should allow the c = 0 plans to be used when

a) manufactured parts are expected to completely conform to specification requirements,

b) less inspection is desired

less critical characteristics,

c) sampling

performed because 100 % inspection on all attributes of all units of products is

impractical,

d) inspections are not a

owed to knowingly accept non-conforming products,

e) auditing

required for assurance of process validation, potential transit damage,

certification of suppliers, or inventory verification.

5 Classification of attributes

5.1

General

Attributes are classified as part of the process

for

individual and/or grouped attributes

for

inspection.

selection of sampling plans applied to

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61193-3 © IEC:2013

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5.2 Classification assignment

Classification

individual attributes associated with specified requirements is assigned

according to importance or seriousness. Any failure to conform to the ultimate form , fit,

function, and intended use

the product unit is usually understood as being non-conforming to

the requirements. Attributes are classified as one

the following:

a) critical;

ior;

c) minor.

The

rket segment, or intended end use of a product unit will influence the attribute

classification. Example: an identical attribute which

may

be considered as "critical" in the

aircraft market segment

may

be considered "major" or even "minor" in the consumer

rket

segment.

Tab

le 4 shows basic "End use environments" as an aid for attribute classification.

Table 4 - Worst-case use environments

Temperature ranges

Approximate

Tmln

Tmax

Typical

accept-

Cycles/

acceptance

Use category years

year

failure

oc oc

h service

risk

0/4,

Consumer 0 +60 35

365 1 to 3 1

2) Computers +15 +60 20 2

1 460

5 0, 1

lecom - 40

+85 35

365

7 to 20 0,01

Commercial

+95 20

365 20 0,001

aircraft

Industrial -

+95

20 12 185 10 0, 1

Automotive

12 100

passe

er &

12 60

compartment

6) Military

-55

+95

& 60

100

0, 1

Grou

12 265

ship

Space

+95

3 to 100 1 8 760

5 to 30

0,001

leo 12 365

Geo

8) Military

Avionics

+95

40 2

365

10 0,01

a 60 2 365

365

& 20 1 365

9) Automotive

-55

+125 60

1 100

0, 1

Under Hood & 100 1 300

& 140 2

& = in addition.

represents the maximum temperature swing, but does not include power dissipation effects.

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61193-3 © IEC:2013

Sometimes the contractual agreements between consumer and producer indicate performance

acceptance to an approved standard. IEC 62326-4 is

example of a standard that uses c = 0

sampling plans. This standard specifies performance requirements in a table for multilayer

printed boards used

electronic equipment.

Table 1 in IEC 62326-4 has established the sampling criteria for each attribute or requirement

stated

the standard. These are identified as a risk management factor (RMF) as opposed to

the old AOL identifications. This was done to highlight the recommendation that certain sample

sizes "based on the risk management factor" required that the number selected is sufficient to

provide protection on critical attributes through using lower percentage non-conforming parts in

the sample being evaluated (see Annex A).

Assignment of classification to individual attributes is the responsibility of the user/customer.

Annex A shows

example of acceptance characteristics for three levels of product

performance.

5.3 Classification and adjustment of sampling plan criteria

Selection of a sampling plan for an attribute should normally be based upon classification.

However, manufacturing process and procedure variability which affects the conformance to

the requirements of a particular attribute should be considered. If, a known process once set-

up, produces consistent results, piece-to-piece within a lot or batch with little to no variability, it

is logical and cost effective to deviate from the strict implementation of a given sampling plan.

In this situation it is possible to apply a non-statistical audit by selecting a lesser RMF sampling

plan.

5.4 Process control

Sampling plan application

for

the electronics industry is best utilized by the assignment of

separate sampling decisions based on the critical impact for each characteristic specified. For

different product categories, plans are applied to such products as shown, but

not

limited to:

a) electronic components IEC61193-1

b) electromechanical parts IEC 61193-1

c) mechanical parts

IEC 61193-1

product printed boards (printed circuits, printed wiring) IEC 61193-3

component printed boards (printed circuits, printed wiring) IEC 61193-2

hybrid circuits

IEC 61193-2

electronic single-chip modules IEC 61193-2

h) electronic multi-chip modules IEC 61193-2

i) electronic assemblies IEC 61193-41

j) electronic backplanes

IEC61193-3

The sampling risk levels would be applicable to the characteristics of units of a product

category where the characteristics are critical to the reliability, customer satisfaction,

product liability potential. A more lenient plan can be applied to characteristics that are

norma

y less critical to function

attributes that are identified as minor within a particul

product category. In addition, the more lenient plans may also be appropriate where there is a

known consistency of tooling and automatic processing.

1 Under consideration.

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6 Defects and process deviation indicator (PDI) evaluation

6.1

General

Many performance standards list typical defects that are unacceptable and require disposition,

e.g., rework, repair. The manufacturer is responsible for identifying other areas of risk and

treating those additional concerns. Such items should

documented

the assembly drawing.

Other than the unacceptable defects listed, anomalies and variances from within 'acceptable'

limits are considered as process deviation indicators and shall be monitored when their

occurrence is observed. Usually, disposition of process deviations revealed by POis is not

required.

6.2 Process control and process improvement requirements

As the industry matures, inspection at the end of the process is not acceptable to

many

customers. They require the use

process control methodologies in the implementation and

evaluation

processes used to produce electrical and electronic assemblies. Subject to

agreement by the user, the manufacturer/assembler

may

be exempted from performing

specific quality conformance inspection. Thus, sampling by attributes is not a desirable

technique even with c = 0 inspection plans, since the practice implies

that

quality of the product

is inspected at completion of all the work. Nevertheless, this practice helps the systematic

process control of the path as shown in Figure 3.

Qua

lity control inspection technique

at product completion (lot inspection)

End-product

eva

luation

for control and capability

In-process product evaluation

for control and capability

Process parameter evalutation

for control and capability

Continual process improvement

and optimizati

/EC

163113

Figure 3 - Systematic path for implementing process control

7 Inspection plans

7.1

General

The

following paragraphs define procedures for implementation and operation of inspection by

attributes using c = O sampling plans.

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