Data Sheet AD8628/AD8629/AD8630
ABSOLUTE MAXIMUM RATINGS
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Table 3.
Parameter Rating
Supply Voltage 6 V
Input Voltage GND – 0.3 V to V
S
+ 0.3 V
Differential Input Voltage
1
±5.0 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
ESD AD8628
HBM 8-Lead SOIC ±7000V
FICDM 8-Lead SOIC ±1500V
FICDM 5-Lead TSOT ±1000V
MM 8-Lead SOIC ±200V
ESD AD8629
HBM 8-Lead SOIC ±4000V
FICDM 8-Lead SOIC ±1000V
ESD AD8630
HBM 14-Lead SOIC ±5000V
FICDM 14-Lead SOIC ±1500V
FICDM 14-Lead TSSOP ±1500V
MM 14-Lead SOIC ±200V
1
Differential input voltage is limited to ±5 V or the supply voltage, whichever is
less.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL CHARACTERISTICS
θ
JA
is specified for worst-case conditions, that is, θ
JA
is specified for
the device soldered in a circuit board for surface-mount packages.
This was measured using a standard two-layer board.
Table 4.
Package Type θ
JA
θ
JC
Unit
5-Lead TSOT (UJ-5) 207 61 °C/W
5-Lead SOT-23 (RJ-5) 230 146 °C/W
8-Lead SOIC_N (R-8) 158 43 °C/W
8-Lead MSOP (RM-8) 190 44 °C/W
14-Lead SOIC_N (R-14) 105 43 °C/W
14-Lead TSSOP (RU-14) 148 23 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.