13
bq76920, bq76930, bq76940
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ZHCSCE2F –OCTOBER 2013–REVISED NOVEMBER 2015
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产品主页链接: bq76920 bq76930 bq76940
Electrical Specifications版权 © 2013–2015, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining R
θJA
, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining R
θJA
, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
6.4 Thermal Information
Over-operating free-air temperature range (unless otherwise noted)
THERMAL METRIC
(1)
TSSOP
UNIT
bq76920xy
20 PINS (PW)
bq76930xy
30 PINS (DBT)
bq76940xy
44 PINS (DBT)
R
θJA, High K
Junction-to-ambient thermal resistance
(2)
93.7 86.5 70.1
°C/W
R
θJC(top)
Junction-to-case(top) thermal resistance
(3)
28.7 19.4 17.5
R
θJB
Junction-to-board thermal resistance
(4)
44.6 41.3 33.9
ψ
JT
Junction-to-top characterization parameter
(5)
1.3 0.5 0.5
ψ
JB
Junction-to-board characterization parameter
(6)
44.1 40.6 33.4
R
θJC(bottom)
Junction-to-case(bottom) thermal resistance
(7)
n/a n/a n/a
6.5 Electrical Characteristics
Typical conditions are measured at 25ºC with nominal BAT voltages of 18 V (bq76920), 36 V (bq76930), or 48 V (bq76940)
with V
CELL
= 4 V. Min and max values include full recommended operating condition temperature range from –40ºC to +85ºC.
Certain characteristics may be shown at different voltage or temperature ranges, as clarified in the Test Condition sections.
PARAMETER DESCRIPTION TEST CONDITION MIN TYP MAX UNIT
SUPPLY CURRENTS
I
DD
NORMAL mode: ADC off,
CC off
Sum of ICC_BAT and ICC_REGSRC
currents
40 60
µA
NORMAL mode: ADC on,
CC off
60 90
NORMAL mode: ADC off,
CC on
110 165
NORMAL mode: ADC on,
CC on
130 195
I
CC_BAT
NORMAL mode: ADC off
Into BAT pin
30 45
NORMAL mode: ADC on 50 75
I
CC_REGSRC
NORMAL mode: CC off
Into REGSRC pin
10 15
NORMAL mode: CC on 80 120
I
SHIP
SHIP/SHUTDOWN mode
Device in full shutdown, only
VSTUP/BG and BOOT detector on
0.6 1.8