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首页ACPI 5.1规格详解:最新接口标准与技术要点
ACPI (Advanced Configuration and Power Interface) 5.1 Spec 规格书是关于一种用于高级系统配置和电源管理的标准文档,它在2014年7月进行了更新。这个版本的主要目标是为计算机硬件和操作系统提供一种统一的接口,以便于管理和优化系统的能耗、性能以及硬件配置。ACPI规范涵盖了广泛的硬件组件,包括处理器、内存、电池、显示器和其他可插拔设备,旨在实现电源状态的动态管理、系统唤醒和休眠功能。
该规格书的重要部分包括:
1. **概述与背景**:
- ACPI 5.1 是对先前版本(如3.0和4.0)的升级,旨在适应现代技术的发展,如更复杂的节能技术和多核处理器架构。
- 它强调了"预留"和"未定义"功能的处理,这些通常是留给硬件制造商或未来的扩展空间。
2. **内容结构**:
- 规格书详细列出了各种体系结构和数据结构,如处理器架构配置和电源管理请求的描述,以及与系统唤醒/睡眠过程相关的事件和操作。
- 包括了ACPI表(如PCI Express Configuration Table、Processor Local APIC Table等),它们存储了系统硬件的信息和配置。
3. **安全性与兼容性**:
- 提供了对安全措施的支持,例如防止恶意代码通过电源管理接口进行攻击,保护系统不受潜在威胁。
- 为了确保广泛的系统兼容性,文档强调了对不同厂商硬件的兼容性标准,避免不必要的冲突。
4. **法律责任声明**:
- 规格书中明确指出,提供的材料不构成对任何知识产权的许可,无论是明示的还是暗示的。
- 材料以"现状"(AS-IS)形式提供,意味着用户需要自行评估其适用性和可靠性,同时所有开发者和作者仅在法律允许范围内对材料的质量承担责任,排除了默示的保证,如适销性、特定用途适用性等。
5. **设计者注意事项**:
- 设计者在使用ACPI 5.1时需谨慎,因为某些功能可能被标记为"预留"或"未定义",意味着它们可能会在未来的规范中发生变化,不适合依赖。
ACPI 5.1 Spec 规格书是IT专业人员在设计和维护现代计算机系统时不可或缺的参考资料,它规定了硬件和软件之间的通信协议,有助于提升系统的能效、稳定性及用户体验。
viii
5.8 System Configuration Objects ...................................................................................... 259
5.8.1 _PIC Method ..................................................................................................... 259
6
Device Configuration ................................................................................. 261
6.1 Device Identification Objects......................................................................................... 261
6.1.1 _ADR (Address)................................................................................................ 262
6.1.2 _CID (Compatible ID)........................................................................................ 263
6.1.3 _CLS (Class Code) ........................................................................................... 264
6.1.4 _DDN (DOS Device Name)............................................................................... 264
6.1.5 _HID (Hardware ID) .......................................................................................... 265
6.1.6 _HRV (Hardware Revision)............................................................................... 265
6.1.7 _MLS (Multiple Language String)...................................................................... 266
6.1.8 _PLD (Physical Location of Device).................................................................. 267
6.1.9 _SUB................................................................................................................. 274
6.1.10 _STR (String) .................................................................................................. 275
6.1.11 _SUN (Slot User Number)............................................................................... 275
6.1.12 _UID (Unique ID)............................................................................................. 276
6.2 Device Configuration Objects ....................................................................................... 276
6.2.1 _CDM (Clock Domain) ...................................................................................... 277
6.2.2 _CRS (Current Resource Settings)................................................................... 278
6.2.3 _DIS (Disable)................................................................................................... 278
6.2.4 _DMA (Direct Memory Access)......................................................................... 278
6.2.5 _DSD (Device Specific Data)............................................................................ 281
6.2.6 _FIX (Fixed Register Resource Provider) ......................................................... 284
6.2.7 _GSB (Global System Interrupt Base) .............................................................. 285
6.2.8 _HPP (Hot Plug Parameters)............................................................................ 287
6.2.9 _HPX (Hot Plug Parameter Extensions) ........................................................... 290
6.2.10 _MAT (Multiple APIC Table Entry).................................................................. 294
6.2.11 _OSC (Operating System Capabilities)........................................................... 295
6.2.12 _PRS (Possible Resource Settings) ............................................................... 304
6.2.13 _PRT (PCI Routing Table) ............................................................................. 304
6.2.14 _PXM (Proximity) ............................................................................................ 306
6.2.15 _SLI (System Locality Information) ................................................................. 307
6.2.16 _SRS (Set Resource Settings)........................................................................ 310
6.2.17 _CCA (Cache Coherency Attribute)................................................................ 310
6.3 Device Insertion, Removal, and Status Objects............................................................ 312
6.3.1 _EDL (Eject Device List) ................................................................................... 314
6.3.2 _EJD (Ejection Dependent Device)................................................................... 315
6.3.3 _EJx (Eject)....................................................................................................... 316
6.3.4 _LCK (Lock) ...................................................................................................... 317
6.3.5 _OST (OSPM Status Indication) ....................................................................... 317
6.3.6 _RMV (Remove) ............................................................................................... 323
6.3.7 _STA (Status).................................................................................................... 323
6.4 Resource Data Types for ACPI..................................................................................... 324
6.4.1 ASL Macros for Resource Descriptors.............................................................. 324
6.4.2 Small Resource Data Type ............................................................................... 324
Advanced Configuration and Power Interface Specification
ix
6.4.3 Large Resource Data Type............................................................................... 331
6.5 Other Objects and Control Methods ............................................................................. 363
6.5.1 _INI (Init) ........................................................................................................... 363
6.5.2 _DCK (Dock)..................................................................................................... 364
6.5.3 _BDN (BIOS Dock Name)................................................................................. 364
6.5.4 _REG (Region).................................................................................................. 365
6.5.5 _BBN (Base Bus Number) ................................................................................ 367
6.5.6 _SEG (Segment)............................................................................................... 367
6.5.7 _GLK (Global Lock)........................................................................................... 368
6.5.8 _DEP (Operation Region Dependencies) ......................................................... 369
7
Power and Performance Management .....................................................371
7.1 Declaring a Power Resource Object............................................................................. 371
7.1.1 Defined Child Objects for a Power Resource.................................................... 372
7.1.2 _OFF................................................................................................................. 372
7.1.3 _ON................................................................................................................... 373
7.1.4 _STA (Status).................................................................................................... 373
7.2 Device Power Management Objects............................................................................. 373
7.2.1 _DSW (Device Sleep Wake)............................................................................. 375
7.2.2 _PS0 (Power State 0) ....................................................................................... 376
7.2.3 _PS1 (Power State 1) ....................................................................................... 376
7.2.4 _PS2 (Power State 2) ....................................................................................... 376
7.2.5 _PS3 (Power State 3) ....................................................................................... 376
7.2.6 _PSC (Power State Current)............................................................................. 377
7.2.7 _PSE (Power State for Enumeration) ............................................................... 377
7.2.8 _PR0 (Power Resources for D0)....................................................................... 377
7.2.9 _PR1 (Power Resources for D1)....................................................................... 378
7.2.10 _PR2 (Power Resources for D2)..................................................................... 378
7.2.11 _PR3 (Power Resources for D3hot)................................................................ 379
7.2.12 _PRE (Power Resources for Enumeration) .................................................... 379
7.2.13 _PRW (Power Resources for Wake)............................................................... 380
7.2.14 _PSW (Power State Wake)............................................................................. 381
7.2.15 _IRC (In Rush Current) ................................................................................... 382
7.2.16 _S1D (S1 Device State).................................................................................. 382
7.2.17 _S2D (S2 Device State).................................................................................. 383
7.2.18 _S3D (S3 Device State).................................................................................. 383
7.2.19 _S4D (S4 Device State).................................................................................. 384
7.2.20 _S0W (S0 Device Wake State)....................................................................... 385
7.2.21 _S1W (S1 Device Wake State)....................................................................... 385
7.2.22 _S2W (S2 Device Wake State)....................................................................... 385
7.2.23 _S3W (S3 Device Wake State)....................................................................... 386
7.2.24 _S4W (S4 Device Wake State)....................................................................... 386
7.3 OEM-Supplied System-Level Control Methods ............................................................ 386
7.3.1 \_PTS (Prepare To Sleep)................................................................................. 387
7.3.2 System \_Sx states ........................................................................................... 387
7.3.3 _SWS (System Wake Source).......................................................................... 393
x
7.3.4 \_TTS (Transition To State)............................................................................... 394
7.3.5 \_WAK (System Wake) ..................................................................................... 394
7.4 OSPM usage of _PTS, _TTS, and _WAK..................................................................... 395
8
Processor Configuration and Control ......................................................397
8.1 Processor Power States ............................................................................................... 397
8.1.1 Processor Power State C0................................................................................ 399
8.1.2 Processor Power State C1................................................................................ 401
8.1.3 Processor Power State C2................................................................................ 401
8.1.4 Processor Power State C3................................................................................ 401
8.1.5 Additional Processor Power States................................................................... 402
8.2 Flushing Caches ........................................................................................................... 403
8.3 Power, Performance, and Throttling State Dependencies............................................ 404
8.4 Declaring Processors................................................................................................. 405
8.4.1 _PDC (Processor Driver Capabilities)............................................................... 405
8.4.2 Processor Power State Control......................................................................... 407
8.4.3 Processor Throttling Controls............................................................................ 412
8.4.4 Processor Performance Control........................................................................ 419
8.4.5 Collaborative Processor Performance Control.................................................. 426
8.4.6 _PPE (Polling for Platform Errors) .................................................................... 443
8.5 Processor Aggregator Device....................................................................................... 443
8.5.1 Logical Processor Idling.................................................................................... 444
8.5.2 OSPM _OST Evaluation ................................................................................... 445
9
ACPI-Defined Devices and Device-Specific Objects.............................. 447
9.1 \_SI System Indicators.................................................................................................. 447
9.1.1 _SST (System Status)....................................................................................... 447
9.1.2 _MSG (Message).............................................................................................. 447
9.1.3 _BLT (Battery Level Threshold) ........................................................................ 448
9.2 Ambient Light Sensor Device........................................................................................ 448
9.2.1 Overview ........................................................................................................... 449
9.2.2 _ALI (Ambient Light Illuminance) ...................................................................... 449
9.2.3 _ALT (Ambient Light Temperature)................................................................... 450
9.2.4 _ALC (Ambient Light Color Chromaticity) ......................................................... 450
9.2.5 _ALR (Ambient Light Response)....................................................................... 451
9.2.6 _ALP (Ambient Light Polling) ............................................................................ 455
9.2.7 Ambient Light Sensor Events............................................................................ 455
9.2.8 Relationship to Backlight Control Methods ....................................................... 456
9.3 Battery Device............................................................................................................... 456
9.4 Control Method Lid Device............................................................................................ 456
9.4.1 _LID................................................................................................................... 456
9.5 Control Method Power and Sleep Button Devices........................................................ 457
9.6 Embedded Controller Device........................................................................................ 457
9.7 Generic Container Device............................................................................................. 457
9.8 ATA Controller Devices................................................................................................. 458
9.8.1 Objects for Both ATA and SATA Controllers..................................................... 458
Advanced Configuration and Power Interface Specification
xi
9.8.2 IDE Controller Device........................................................................................ 459
9.8.3 Serial ATA (SATA) Controller Device................................................................ 462
9.9 Floppy Controller Device Objects ................................................................................. 464
9.9.1 _FDE (Floppy Disk Enumerate) ........................................................................ 464
9.9.2 _FDI (Floppy Disk Information) ......................................................................... 465
9.9.3 _FDM (Floppy Disk Drive Mode)....................................................................... 466
9.10 GPE Block Device....................................................................................................... 466
9.10.1 Matching Control Methods for Events in a GPE Block Device........................ 467
9.11 Module Device ............................................................................................................ 468
9.12 Memory Devices ......................................................................................................... 471
9.12.1 Address Decoding........................................................................................... 471
9.12.2 Memory Bandwidth Monitoring and Reporting................................................ 471
9.12.3 _OSC Definition for Memory Device ............................................................... 473
9.12.4 Example: Memory Device ............................................................................... 474
9.13 _UPC (USB Port Capabilities) .................................................................................... 474
9.13.1 USB 2.0 Host Controllers and _UPC and _PLD ............................................. 478
9.14 Device Object Name Collision .................................................................................... 480
9.14.1 _DSM (Device Specific Method) ..................................................................... 480
9.15 PC/AT RTC/CMOS Devices ....................................................................................... 483
9.15.1 PC/AT-compatible RTC/CMOS Devices (PNP0B00)...................................... 483
9.15.3 Dallas Semiconductor-compatible RTC/CMOS Devices (PNP0B02) ............. 485
9.16 User Presence Detection Device................................................................................ 485
9.16.1 _UPD (User Presence Detect)........................................................................ 486
9.16.2 _UPP (User Presence Polling)........................................................................ 486
9.16.3 User Presence Sensor Events........................................................................ 487
9.17 I/O APIC Device.......................................................................................................... 487
9.18 Time and Alarm Device............................................................................................... 487
9.18.2 _GCP (Get Capability) .................................................................................... 491
9.18.3 _GRT (Get Real Time).................................................................................... 492
9.18.4 _SRT (Set Real Time)..................................................................................... 492
9.18.5 _GWS (Get Wake alarm status)...................................................................... 494
9.18.6 _CWS (Clear Wake alarm status)................................................................... 494
9.18.7 _STP (Set Expired Timer Wake Policy) .......................................................... 494
9.18.8 _STV (Set Timer Value).................................................................................. 495
9.18.9 _TIP (Expired Timer Wake Policy).................................................................. 495
9.18.10 _TIV (Timer Values)...................................................................................... 496
9.18.11 ACPI Wakeup Alarm Events ......................................................................... 496
9.18.12 Relationship to Real Time Clock Alarm ....................................................... 496
9.18.13 Time and Alarm device as a replacement to the RTC .................................. 496
9.18.14 Relationship to UEFI time source.................................................................. 496
9.18.15 Example ASL code ....................................................................................... 497
10
Power Source and Power Meter Devices .................................................503
10.1 Smart Battery Subsystems ......................................................................................... 503
10.1.1 ACPI Smart Battery Status Change Notification Requirements...................... 506
10.1.2 Smart Battery Objects..................................................................................... 507
xii
10.1.3 _SBS (Smart Battery Subsystem) .................................................................. 508
10.2 Control Method Batteries ............................................................................................ 510
10.2.1 Battery Events................................................................................................. 511
10.2.2 Battery Control Methods ................................................................................. 511
10.3 AC Adapters and Power Source Objects.................................................................... 524
10.3.1 _PSR (Power Source)..................................................................................... 524
10.3.2 _PCL (Power Consumer List) ......................................................................... 525
10.3.3 _PIF (Power Source Information).................................................................... 525
10.3.4 _PRL (Power Source Redundancy List) ......................................................... 526
10.4 Power Meters.............................................................................................................. 526
10.4.1 _PMC (Power Meter Capabilities)................................................................... 527
10.4.2 _PTP (Power Trip Points) ............................................................................... 528
10.4.3 _PMM (Power Meter Measurement)............................................................... 529
10.4.4 _PAI (Power Averaging Interval)..................................................................... 529
10.4.5 _GAI (Get Averaging Interval)......................................................................... 530
10.4.6 _SHL (Set Hardware Limit) ............................................................................. 530
10.4.7 _GHL (Get Hardware Limit) ............................................................................ 531
10.4.8 _PMD (Power Metered Devices)..................................................................... 531
10.5 Example: Power Source and Power Meter Namespace............................................. 531
11
Thermal Management.................................................................................533
11.1 Thermal Control .......................................................................................................... 533
11.1.1 Active, Passive, and Critical Policies .............................................................. 534
11.1.2 Dynamically Changing Cooling Temperature Trip Points ............................... 535
11.1.3 Detecting Temperature Changes.................................................................... 536
11.1.4 Active Cooling ................................................................................................ 538
11.1.5 Passive Cooling .............................................................................................. 539
11.1.6 Critical Shutdown ............................................................................................ 540
11.2 Cooling Preferences .................................................................................................. 541
11.2.1 Evaluating Thermal Device Lists..................................................................... 542
11.2.2 Evaluating Device Thermal Relationship Information ..................................... 543
11.3 Fan Device.................................................................................................................. 543
11.3.1 Fan Objects..................................................................................................... 544
11.4 Thermal Objects.......................................................................................................... 547
11.4.1 _ACx (Active Cooling)..................................................................................... 548
11.4.2 _ALx (Active List) ............................................................................................ 548
11.4.3 _ART (Active Cooling Relationship Table)...................................................... 549
11.4.4 _CRT (Critical Temperature)........................................................................... 552
11.4.5 _DTI (Device Temperature Indication)............................................................ 552
11.4.6 _HOT (Hot Temperature)................................................................................ 552
11.4.7 _NTT (Notification Temperature Threshold) ................................................... 553
11.4.8 _PSL (Passive List)......................................................................................... 553
11.4.9 _PSV (Passive)............................................................................................... 553
11.4.10 _RTV (Relative Temperature Values)........................................................... 554
11.4.11 _SCP (Set Cooling Policy) ............................................................................ 554
11.4.12 _TC1 (Thermal Constant 1) .......................................................................... 557
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