STM32F051x4/x6/x8微控制器数据手册：ARM Cortex-M0, 16-64KB Flash, 电源管理

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"STM32F051x4/STM32F051x6/STM32F051x8数据手册是STMicroelectronics公司推出的一系列基于ARM Cortex-M0内核的32位微控制器的数据手册。这些芯片提供16到64KB的Flash内存和8KB带硬件奇偶校验检查的SRAM，适用于各种嵌入式应用，具有丰富的外设接口，如定时器、ADC、DAC和通信接口，并支持2.0V至3.6V的工作电压范围。" STM32F051x4/x6/x8系列微控制器的关键特性包括： 1. **处理器核心**：采用ARM Cortex-M0 CPU，运行频率高达48MHz，提供高效的32位处理能力。 2. **存储器**：具备16KB到64KB的闪存（Flash）和8KB的SRAM，其中SRAM带有硬件奇偶校验功能，提高了数据存储的可靠性。 3. **错误检测与管理**：内置CRC（循环冗余校验）计算单元，增强数据完整性检查。还提供了电源管理和复位功能，如数字和I/O电源的上电/掉电复位（POR/PDR）、可编程电压检测器（PVD）。 4. **电源管理**：支持2.0V到3.6V的数字电源电压和2.4V到3.6V的模拟电源电压。具备低功耗模式，如睡眠、停止和待机模式，以及VBAT电源，用于RTC（实时时钟）和备份寄存器。 5. **时钟系统**：支持4MHz到32MHz的晶体振荡器，32kHz的RTC振荡器，8MHz的内部RC振荡器（可6倍频），以及40kHz的内部RC振荡器。 6. **I/O端口**：最多提供55个快速I/O，所有I/O都可以映射到外部中断向量。其中，多达36个I/O是5V耐受的，提高了系统兼容性。 7. **DMA控制器**：集成5通道DMA控制器，可以高效地在内存和外设间传输数据，减轻CPU负担。 8. **模拟功能**：包含一个12位的ADC（模数转换器），最快1.0μs转换速度，支持最多16个通道，转换范围为0到3.6V。此外，还有一个12位的DAC（数模转换器），用于输出模拟信号。 9. **其他外设**：除了上述功能，还有多个定时器、串行通信接口（如SPI、I2C、USART等），这些接口使得STM32F051x4/x6/x8适用于多种应用场景，如工业控制、物联网设备、消费电子等。这个数据手册详细介绍了STM32F051系列微控制器的电气特性、引脚配置、外设接口、工作条件和编程信息，是开发者进行产品设计和程序开发的重要参考资料。

Functional overview STM32F051x4 STM32F051x6 STM32F051x8

16/122 DocID022265 Rev 7

Figure 2. Clock tree

3.7 General-purpose inputs/outputs (GPIOs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as

input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the

GPIO pins are shared with digital or analog alternate functions.

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STM32F051x4 STM32F051x6 STM32F051x8 Functional overview

The I/O configuration can be locked if needed following a specific sequence in order to

avoid spurious writing to the I/Os registers.

3.8 Direct memory access controller (DMA)

The 5-channel general-purpose DMAs manage memory-to-memory, peripheral-to-memory

and memory-to-peripheral transfers.

The DMA supports circular buffer management, removing the need for user code

intervention when the controller reaches the end of the buffer.

Each channel is connected to dedicated hardware DMA requests, with support for software

trigger on each channel. Configuration is made by software and transfer sizes between

source and destination are independent.

DMA can be used with the main peripherals: SPIx, I2Sx, I2Cx, USARTx, all TIMx timers

(except TIM14), DAC and ADC.

3.9 Interrupts and events

3.9.1 Nested vectored interrupt controller (NVIC)

The STM32F0xx family embeds a nested vectored interrupt controller able to handle up to

32 maskable interrupt channels (not including the 16 interrupt lines of Cortex

-M0) and 4

priority levels.

• Closely coupled NVIC gives low latency interrupt processing

• Interrupt entry vector table address passed directly to the core

• Closely coupled NVIC core interface

• Allows early processing of interrupts

• Processing of late arriving higher priority interrupts

• Support for tail-chaining

• Processor state automatically saved

• Interrupt entry restored on interrupt exit with no instruction overhead

This hardware block provides flexible interrupt management features with minimal interrupt

latency.

3.9.2 Extended interrupt/event controller (EXTI)

The extended interrupt/event controller consists of 24 edge detector lines used to generate

interrupt/event requests and wake-up the system. Each line can be independently

configured to select the trigger event (rising edge, falling edge, both) and can be masked

independently. A pending register maintains the status of the interrupt requests. The EXTI

can detect an external line with a pulse width shorter than the internal clock period. Up to 55

GPIOs can be connected to the 16 external interrupt lines.

3.10 Analog-to-digital converter (ADC)

The 12-bit analog-to-digital converter has up to 16 external and 3 internal (temperature

Functional overview STM32F051x4 STM32F051x6 STM32F051x8

18/122 DocID022265 Rev 7

sensor, voltage reference, VBAT voltage measurement) channels and performs conversions

in single-shot or scan modes. In scan mode, automatic conversion is performed on a

selected group of analog inputs.

The ADC can be served by the DMA controller.

An analog watchdog feature allows very precise monitoring of the converted voltage of one,

some or all selected channels. An interrupt is generated when the converted voltage is

outside the programmed thresholds.

3.10.1 Temperature sensor

The temperature sensor (TS) generates a voltage V

SENSE

that varies linearly with

temperature.

The temperature sensor is internally connected to the ADC_IN16 input channel which is

used to convert the sensor output voltage into a digital value.

The sensor provides good linearity but it has to be calibrated to obtain good overall

accuracy of the temperature measurement. As the offset of the temperature sensor varies

from chip to chip due to process variation, the uncalibrated internal temperature sensor is

suitable for applications that detect temperature changes only.

To improve the accuracy of the temperature sensor measurement, each device is

individually factory-calibrated by ST. The temperature sensor factory calibration data are

stored by ST in the system memory area, accessible in read-only mode.

3.10.2 Internal voltage reference (V

REFINT

)

The internal voltage reference (V

REFINT

) provides a stable (bandgap) voltage output for the

ADC and comparators. V

REFINT

is internally connected to the ADC_IN17 input channel. The

precise voltage of V

REFINT

is individually measured for each part by ST during production

test and stored in the system memory area. It is accessible in read-only mode.

Table 3. Temperature sensor calibration values

Calibration value name Description Memory address

TS_CAL1

TS ADC raw data acquired at a

temperature of 30 °C (± 5 °C),

DDA

= 3.3 V (± 10 mV)

0x1FFF F7B8 - 0x1FFF F7B9

TS_CAL2

TS ADC raw data acquired at a

temperature of 110 °C (± 5 °C),

DDA

= 3.3 V (± 10 mV)

0x1FFF F7C2 - 0x1FFF F7C3

Table 4. Internal voltage reference calibration values

Calibration value name Description Memory address

VREFINT_CAL

Raw data acquired at a

temperature of 30 °C (± 5 °C),

DDA

= 3.3 V (± 10 mV)

0x1FFF F7BA - 0x1FFF F7BB

DocID022265 Rev 7 19/122

STM32F051x4 STM32F051x6 STM32F051x8 Functional overview

3.10.3 V

BAT

battery voltage monitoring

This embedded hardware feature allows the application to measure the V

BAT

battery voltage

using the internal ADC channel ADC_IN18. As the V

BAT

voltage may be higher than V

DDA

and thus outside the ADC input range, the V

BAT

pin is internally connected to a bridge

divider by 2. As a consequence, the converted digital value is half the V

BAT

voltage.

3.11 Digital-to-analog converter (DAC)

The 12-bit buffered DAC channels can be used to convert digital signals into analog voltage

signal outputs. The chosen design structure is composed of integrated resistor strings and

an amplifier in non-inverting configuration.

This digital Interface supports the following features:

• Left or right data alignment in 12-bit mode

• Synchronized update capability

• DMA capability

• External triggers for conversion

Five DAC trigger inputs are used in the device. The DAC is triggered through the timer

trigger outputs and the DAC interface is generating its own DMA requests.

3.12 Comparators (COMP)

The device embeds two fast rail-to-rail low-power comparators with programmable

reference voltage (internal or external), hysteresis and speed (low speed for low power) and

with selectable output polarity.

The reference voltage can be one of the following:

• External I/O

• DAC output pins

• Internal reference voltage or submultiple (1/4, 1/2, 3/4).Refer to Table 24: Embedded

internal reference voltage for the value and precision of the internal reference voltage.

Both comparators can wake up from STOP mode, generate interrupts and breaks for the

timers and can be also combined into a window comparator.

3.13 Touch sensing controller (TSC)

The STM32F051xx devices provide a simple solution for adding capacitive sensing

functionality to any application. These devices offer up to 18 capacitive sensing channels

distributed over 6 analog I/O groups.

Capacitive sensing technology is able to detect the presence of a finger near a sensor which

is protected from direct touch by a dielectric (glass, plastic...). The capacitive variation

introduced by the finger (or any conductive object) is measured using a proven

implementation based on a surface charge transfer acquisition principle. It consists in

charging the sensor capacitance and then transferring a part of the accumulated charges

into a sampling capacitor until the voltage across this capacitor has reached a specific

threshold. To limit the CPU bandwidth usage, this acquisition is directly managed by the

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