没有合适的资源?快使用搜索试试~ 我知道了~
首页BD3702音频处理器:集成创新与特性概览
BD3702音频处理器:集成创新与特性概览
需积分: 50 8 下载量 25 浏览量
更新于2024-09-09
收藏 169KB PDF 举报
BD3702是一款专为车载音响设计的音频处理器集成电路产品,型号为BD3702FV,它属于半导体结构。该芯片的主要特点是高度集成,旨在优化音频信号处理性能,降低噪声并简化系统组件数量。 首先,BD3702FV采用先进的开关电路技术,能够有效减少输入增益控制、静音、主音量、渐变音量、低音、中音、高音以及音量平衡等环节的切换噪声,提供精细的1/4步调整,以实现更平滑的音质体验。 其次,内置了地线隔离放大器输入,特别适合外部立体声输入,这增强了信号的纯净度和稳定性。它还配备了可选择单端/差分输入的选择器,可以根据实际需求灵活配置输入类型,增加系统的灵活性。 针对便携式音频设备的输入,BD3702FV内置了输入增益控制器,进一步减少了音量切换时的噪声,确保了音质的一致性和低干扰。 此外,这款音频处理器集成了3段均衡器滤波器,包括低通滤波器用于处理低音效果,以及一个可调节Q值、中心频率(f3)的均衡器和低音滤波器的低频截止频率(fco)。用户可以通过I2C总线轻松控制这些参数,实现自定义的音频调校。 在音量控制上,BD3702FV提供了高达±20dB的动态范围和1dB步进的精细增益调整,无论是对于音乐的整体平衡还是特定频率的强调,都能满足专业级的要求。 最后,其设计还包括一个内置的音量补偿功能(loudness),允许用户调整高频和低频的增益,以补偿不同环境下的听觉感知,确保音频始终如一地引人入胜。 总体来说,BD3702FV是一款强大的音频处理解决方案,通过其高级功能和高度集成特性,能显著提升汽车音响系统的性能,减少复杂性,并为用户提供卓越的音质体验。
资源详情
资源推荐
PRODUCTS TYPE PAGE
SEMICONDUCTOR IC BD3702FV 1/4
DESIGN CHECK APPROVAL
DATE: 25/Nov/2008 SPECIFICATION No. TSZ02201-BD3702FV-1-2
REV. B
ROHM CO.,LTD.
TSZ22111・04
S t r u c t u r e
: Silicon Monolithic Integrated Circuit
Product : Sound Processor for car audio
T y p e :
BD3702FV
P a c k a g e : S S O P - B 2 8
●Feature
1. Reduce switching noise of input gain control, mute, main volume, fader volume, bass, middle, treble, loudness,
mixing by using advanced switch circuit [Possible to control all steps]
2. Built-in ground isolation amplifier inputs, ideal for external stereo input.
3. Built-in differential input selector that can make various combination of single-ended / differential input.
4. Built-in input gain controller reduce switching noise for volume of a portable audio input.
5. Decrease the number of external components by built-in 3-band equalizer filter, LPF for subwoofer, loudness filter.
And, possible to control Q, Gv, fo of 3-band equalizer and fc of LPF, fo, Gv of loudness by I
2
C BUS control freely.
6. It is possible for the bass, middle, treble to the gain adjustment quantity of ±20dB and 1 dB step gain adjustment.
7. It is equipped with output terminals of Subwoofer. Moreover, the stereo signal of the front and rear also can be
output by the I
2
C BUS control.
8. Built-in mixing input and mixing attenuation.
9. Bi-CMOS process is suitable for the design of low current and low energy. And it provides more quality for
small-scale
regulator and heat in a set.
10. Package is SSOP-B28. Putting input-terminals together and output-terminals together can make
PCB layout easier and can makes area of PCB smaller.
11. It is possible to control by 3.3V / 5V for I
2
C BUS.
●Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Limits Unit
Power supply Voltage VCC 10.0 V
Input voltage VIN VCC+0.3~GND-0.3 V
Power Dissipation Pd 1063 ※1 mW
Storage Temperature Tastg -55~+150 ℃
※1 At Ta=25°C or higher, this value is decreaced to 8.5mW/°C
When Rohm standard board is mounted.
Rohm standard board: Size:70×70×1.6(mm
3
)
material:FR4 glass-epoxy substrate (copper foil area: not more than 3%).
●Operating Range
Parameter Symbol Min. Typ. Max. Unit
Power supply Voltage VCC 7.0 - 9.5 V
Temperature Topr -40 - +85 ℃
※Design against radiation-proof isn’t made.
Status of this document
The Japanese version of this document is the formal specification. A customer may use this translation only for a reference to help
reading the formal version. If there are any differences in translation version of this document, formal version takes priority.
Application example
・ ROHM cannot provide adequate confirmation of patents.
・ The product described in this specification is designed to be used with ordinary electronic equipment or device (such as audio-visual equipment,
office-automation equipment, communications devices, electrical appliances, and electronic toys.)
Should you intend to use this product with equipment or devices which require an extremely high level of reliability and the malfunction of which
would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers,
fuel controllers and other safety device), please be sure to consult with our sales representative in advance.
・ ROHM assumes no responsibility for use of any circuits described herein, conveys no license under any patent or other right, and makes no
representations that the circuits are free from patent infringement.
下载后可阅读完整内容,剩余4页未读,立即下载
chuhongning
- 粉丝: 0
- 资源: 6
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
最新资源
- Ansys Comsol实现力磁耦合仿真及其在电磁无损检测中的应用
- 西门子数控系统调试与配置实战案例教程
- ELM多输出拟合预测模型:简易Matlab实现指南
- 一维光子晶体的Comsol能带拓扑分析研究
- Borland-5技术资料压缩包分享
- Borland 6 技术资料分享包
- UE5压缩包处理技巧与D文件介绍
- 机器学习笔记:深入探讨中心极限定理
- ProE使用技巧及文件管理方法分享
- 增量式百度图片爬虫程序修复版发布
- Emlog屏蔽用户IP黑名单插件:自定义跳转与评论限制
- 安装Prometheus 2.2.1所需镜像及配置指南
- WinRARChan主题包:个性化你的压缩软件
- Neo4j关系数据映射转换测试样例集
- 安装heapster-grafana-amd64-v5-0-4所需镜像介绍
- DVB-C语言深度解析TS流
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功