MIL-PRF-55110J：2020版印刷电路板规格取代旧版本

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MIL-PRF-55110J 是一份军事工业标准（Military Specification, Mil）文档，用于规范印刷电路板（Printed Wiring Board, PCB）的性能规格，特别是对于刚性（Rigid）类型的PCB。这份标准取代了之前版本MIL-PRF-55110H，并通过增补第3修正案进行修订，发布日期为2020年5月16日，它在1997年12月31日后不再适用于新设计，推荐使用MIL-PRF-31032。 1. **范围**： - 该规范定义了印刷电路板的基本要求，包括适用领域（1.1节），分类依据（1.2节），如类型、基本材料和封装（如1.2.1和1.2.2），以及对PCB的详细描述。 2. **文档与合规性**： - 为了符合此次修订，所有相关的文档更新和工艺转换应在2020年8月17日前完成（参见3.8条款）。建议用户通过ASSIST在线数据库（<https://assist.dla.mil>）验证联系信息的有效性，以确保及时获取最新资料。 3. **政府文档**： - 规范引用了通用指导原则和其他政府文档（2.2节），具体引用号需查看2.2.1部分，这些文档是支持本标准实施的重要参考。 4. **历史版本与过渡期**： - MIL-PRF-55110J是在MIL-PRF-55110H的基础上进行修订的，如果新的设计项目在1997年12月31日后启动，必须遵循MIL-PRF-31032的要求，因为MIL-PRF-55110J被标记为“inactive”。 5. **测量单位**： - 该标准采用英寸磅（Inch-Pound）系统进行测量，这是电子和机械工程中常见的单位体系。 6. **内容结构**： - 规范详细罗列了章节和段落，例如性能规格、基础规格说明、适用文档列表等，确保设计和制造过程能够满足严格的军事质量标准。 MIL-PRF-55110J是关于刚性印刷电路板的专业指南，对于从事相关领域设计和生产的企业或工程师来说，理解并遵循该标准对于保证产品符合军事级别的可靠性和耐用性至关重要。同时，注意及时更新文档和遵守截止日期以确保合规性。

MIL−PRF−55110J

This specification is approved for use by all Departments and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification establishes the performance and qualification requirements for rigid single-sided,

double-sided, and multilayered printed wiring boards with or without plated through holes (see 6.1). Verification is

accomplished through the use of MIL−PRF−31032 and its associated specification sheets. Detail requirements,

specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the

applicable master drawing.

1.2 Classification. Printed wiring boards are classified by 1.2.1 and 1.2.2 and 1.2.3.

1.2.1 Type. The printed wiring boards covered by this specification are of the following types:

Type 1 − Singled-sided printed wiring board (see 6.4.6.1).

Type 2 − Double−sided printed wiring board (see 6.4.6.2) with or without plated-through holes.

Type 3 − Multilayer printed wiring board with plated holes (see 6.4.6.3).

Type 4 − Multilayer printed wiring board with plated holes and blind or buried via holes (see 6.4.6.4).

1.2.2 Base material. The printed wiring board base material type should be identified by the applicable base

material specification sheet or by the legacy base material type designator as required by the master drawing (see

3.1.1).

1.2.3 Wrap plating (surface and knee continuous copper plating). The wrap plating grade designation is defined

by the amount of plated-through hole surface and knee continuous copper plating thickness remaining after surface

processing. The grades are as follows:

A − Printed boards of this grade have 80 percent or more of the specified plating thickness in the wrap

area after surface processing.

B − Printed boards of this grade have 50 percent or more of the specified plating thickness in the wrap

area after surface processing.

C − Printed boards of this grade have 20 percent or more of the specified plating thickness in the wrap

area after surface processing.

Unless otherwise specified, the default grade of wrap copper plating is grade A for printed board designs that will not

undergo planarization and grade B for designs that require planarization.

1.3 Description of this specification. The main body contains general provisions and is supplemented by detailed

appendices. Appendix B details the quality management approach using a technical review board concept along with

a Qualified Manufacturer List (QML) product assurance program addressed in MIL−PRF−31032, to supplement the

generic verification criteria provided in this specification. Appendix D is optional and can be used when producing

printed wiring boards designed to superseded design standards (see 6.6.2). Appendix D may also be used as a

guide in developing a test plan for legacy or existing designs based on the tests and inspections of legacy revisions.

Appendix E contains the qualification requirements. Appendices A, C, F, G and H have been deleted.

MIL−PRF−55110J

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3 and 4

of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of documents cited in sections

3 and 4 of this

specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL−PRF−31032 − Printed Circuit Board/Printed Wiring Board, General Specification for.

(Copies of these documents are online at https://quicksearch.dla.mil.)

2.3 Non-Government publications. The following documents form a part of this document to the extent specified

herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

IPC − ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)

IPC−T−50 − Terms and Definitions for Interconnecting and Packaging Electronic Circuits.

(Copies of these documents are available online at https://www.ipc.org.)

(Non-Government standards and other publications are normally available from the organizations that prepare or

distribute the documents. These documents also may be available in or through libraries or other informational

services.)

2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the

text of this document and the references cited herein, the text of this document takes precedence. Nothing in this

document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 General requirements. The manufacturer of printed wiring boards, in compliance with this specification, shall

have and use production facilities, verification facilities, and product assurance procedures adequate to assure

successful compliance with the provisions of this specification and the associated master drawing. Adequacy of a

printed board manufacturer to meet the requirements of this specification shall be determined by the Government

qualifying activity (DLA Land and Maritime, code VQE). Only printed wiring boards which are verified and meet all

the applicable performance requirements contained herein and the design, construction, and material requirement of

the associated master drawing shall be certified as compliant and delivered.

3.1.1 Master drawing. Printed wiring boards delivered under this specification shall be of the material, design, and

construction specified on the applicable master drawing.

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