STM32L151xE/L152xE：超低功耗32位MCU，详细规格与特性

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STM32L151xESTM32L152xE是一款已投入全面生产的超低功耗32位微控制器，基于ARM架构的Cortex-M3内核，特别适用于能源效率要求极高的应用。这款MCU具有以下主要特性： 1. **卓越的能耗表现**: - 支持1.65V至3.6V宽电压供电范围，适应各种工作环境。 - 工作温度范围宽广，从-40°C到105°C，确保在极端条件下稳定运行。 - 多种低功耗模式下表现出色：典型睡眠模式下电流仅为290nA（3个唤醒引脚），增加RTC后升至1.11μA；停机模式（16个唤醒线）低至560nA或1.4μA（带RTC）。 - 低功耗运行模式可进一步降低至4.6μA，而进入低功耗睡眠模式时仅消耗11μA。 - 高性能模式下的电流消耗为195μA/MHz，同时具有极低的I/O漏电流，唤醒时间仅为8μs。 2. **高性能处理器**: - 基于ARM Cortex-M3，最高工作频率可达32MHz。 - 具有1.25 DMIPS/MHz的处理能力（Dhrystone 2.1基准测试）。 - 内置内存保护单元，确保代码和数据的安全性。 3. **丰富的外设功能**: - 提供多达34个电容感应通道，支持多种传感器输入。 - 包含CRC计算单元，以及96位唯一的设备标识，增强数据完整性。 - 强大的复位和供电管理功能，包括低功耗、安全的棕色-out复位（BOR）和超低功耗上电/掉电复位（POR/PDR）选项，以及可编程电压检测器（PVD）。 4. **钟源选择**: - 支持1到24MHz的外部晶振，用于主时钟。 - 内置32kHz晶体振荡器用于RTC，并具备校准功能。 - 16MHz内部振荡器出厂预调至±1%精度，为精确计时提供保障。 STM32L151xESTM32L152xE凭借其出色的低功耗特性、高效处理能力和丰富的外设功能，是工业控制、物联网、电池供电设备和便携式应用的理想选择。其广泛的工作电压和温度适应性，以及灵活的电源管理方案，使其成为在不同应用场景中实现高效能和长时间待机的首选解决方案。

Functional overview STM32L151xE STM32L152xE

16/134 DocID025433 Rev 8

DDA

= 2.0 to 2.4 V

Conversion time up

to 500 Ksps

Functional

(2)

Range 1, Range 2

or Range 3

Full speed operation

DDA

= 2.4 to 3.6 V

Conversion time up

to 1 Msps

Functional

(2)

Range 1, Range 2

or Range 3

Full speed operation

1. CPU frequency changes from initial to final must respect “F

CPU

initial < 4*F

CPU

final” to limit V

CORE

drop due to current

consumption peak when frequency increases. It must also respect 5 µs delay between two changes. For example to switch

from 4.2 MHz to 32 MHz, the user can switch from 4.2 MHz to 16 MHz, wait 5 µs, then switch from 16 MHz to 32 MHz.

2. Should be USB compliant from I/O voltage standpoint, the minimum V

is 3.0 V.

Table 3. Functionalities depending on the operating power supply range (continued)

Functionalities depending on the operating power supply range

Operating power supply

range

DAC and ADC

operation

USB

Dynamic voltage

scaling range

I/O operation

Table 4. CPU frequency range depending on dynamic voltage scaling

CPU frequency range Dynamic voltage scaling range

16 MHz to 32 MHz (1ws)

32 kHz to 16 MHz (0ws)

Range 1

8 MHz to 16 MHz (1ws)

32 kHz to 8 MHz (0ws)

Range 2

2.1MHz to 4.2 MHz (1ws)

32 kHz to 2.1 MHz (0ws)

Range 3

DocID025433 Rev 8 19/134

STM32L151xE STM32L152xE Functional overview

The memory protection unit (MPU) improves system reliability by defining the memory

attributes (such as read/write access permissions) for different memory regions. It provides

up to eight different regions and an optional predefined background region.

Owing to its embedded ARM core, the STM32L151xE and STM32L152xE devices are

compatible with all ARM tools and software.

Nested vectored interrupt controller (NVIC)

The ultra-low-power STM32L151xE and STM32L152xE devices embed a nested vectored

interrupt controller able to handle up to 56 maskable interrupt channels (not including the 16

interrupt lines of ARM

Cortex

-M3) and 16 priority levels.

• Closely coupled NVIC gives low-latency interrupt processing

• Interrupt entry vector table address passed directly to the core

• Closely coupled NVIC core interface

• Allows early processing of interrupts

• Processing of late arriving, higher-priority interrupts

• Support for tail-chaining

• Processor state automatically saved

• Interrupt entry restored on interrupt exit with no instruction overhead

This hardware block provides flexible interrupt management features with minimal interrupt

latency.

3.3 Reset and supply management

3.3.1 Power supply schemes

• V

= 1.65 to 3.6 V: external power supply for I/Os and the internal regulator. Provided

externally through V

pins.

• V

SSA

, V

DDA

= 1.65 to 3.6 V: external analog power supplies for ADC, reset blocks, RCs

and PLL (minimum voltage to be applied to V

DDA

is 1.8 V when the ADC is used). V

DDA

and V

SSA

must be connected to V

and V

, respectively.

3.3.2 Power supply supervisor

The device has an integrated ZEROPOWER power-on reset (POR)/power-down reset

(PDR) that can be coupled with a brownout reset (BOR) circuitry.

The device exists in two versions:

• The version with BOR activated at power-on operates between 1.8 V and 3.6 V.

• The other version without BOR operates between 1.65 V and 3.6 V.

After the V

threshold is reached (1.65 V or 1.8 V depending on the BOR which is active or

not at power-on), the option byte loading process starts, either to confirm or modify default

thresholds, or to disable the BOR permanently: in this case, the V

min value becomes

1.65 V (whatever the version, BOR active or not, at power-on).

When BOR is active at power-on, it ensures proper operation starting from 1.8 V whatever

the power ramp-up phase before it reaches 1.8 V. When BOR is not active at power-up, the

Functional overview STM32L151xE STM32L152xE

20/134 DocID025433 Rev 8

power ramp-up should guarantee that 1.65 V is reached on V

at least 1 ms after it exits

the POR area.

Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To

reduce the power consumption in Stop mode, it is possible to automatically switch off the

internal reference voltage (V

REFINT

) in Stop mode. The device remains in reset mode when

is below a specified threshold, V

POR/PDR

or V

BOR

, without the need for any external

reset circuit.

Note: The start-up time at power-on is typically 3.3 ms when BOR is active at power-up, the start-

up time at power-on can be decreased down to 1

ms typically for devices with BOR inactive

at power-up.

The device features an embedded programmable voltage detector (PVD) that monitors the

DDA

power supply and compares it to the V

PVD

threshold. This PVD offers 7 different

levels between 1.85

V and 3.05 V, chosen by software, with a step around 200 mV. An

interrupt can be generated when V

DDA

drops below the V

PVD

threshold and/or when

DDA

is higher than the V

PVD

threshold. The interrupt service routine can then generate

a warning message and/or put the MCU into a safe state. The PVD is enabled by software.

3.3.3 Voltage regulator

The regulator has three operation modes: main (MR), low-power (LPR) and power down.

• MR is used in Run mode (nominal regulation)

• LPR is used in the Low-power run, Low-power sleep and Stop modes

• Power down is used in Standby mode. The regulator output is high impedance, the

kernel circuitry is powered down, inducing zero consumption but the contents of the

registers and RAM are lost except for the standby circuitry (wakeup logic, IWDG, RTC,

LSI, LSE crystal 32K osc, RCC_CSR).

3.3.4 Boot modes

At startup, boot pins are used to select one of three boot options:

• Boot from Flash memory

• Boot from System memory

• Boot from embedded RAM

The boot from Flash usually boots at the beginning of the Flash (bank 1). An additional boot

mechanism is available through user option byte, to allow booting from bank 2 when bank 2

contains valid code. This dual boot capability can be used to easily implement a secure field

software update mechanism.

The boot loader is located in System memory. It is used to reprogram the Flash memory by

using USART1, USART2 or USB. See Application note “STM32 microcontroller system

memory boot mode” (AN2606) for details.

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