JEDEC JEP 114A-2023：粒子冲击噪声检测指南

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"JEDEC JEP 114A-2023 指南是关于颗粒撞击噪声检测（PIND）测试、操作员培训和认证的标准文档，旨在为电子行业中防止和处理颗粒对设备造成的影响提供指导。这份文档修订自2013年的JEP114.01版，于2023年5月发布。它由JEDEC固态技术协会发布，并强调了标准在消除制造商与购买者之间的误解、促进互换性和产品改进以及帮助购买者快速选择正确产品方面的作用。JEDEC标准不考虑可能涉及的专利问题，不承担任何专利所有者的责任。" JEDEC JEP 114A-2023标准详细介绍了颗粒撞击噪声检测（PIND）测试的方法，这是电子组件和系统可靠性评估的重要部分。颗粒污染可能会导致电路短路、功能失效甚至设备损坏，尤其是在航空航天、汽车电子和半导体制造等高精度领域。PIND测试通过检测微小颗粒撞击电子元件产生的噪声来评估其抗污染能力。该标准涵盖以下关键知识点： 1. **颗粒影响噪声定义**：PIND是由于颗粒物撞击电子组件表面产生的机械振动转化为电信号的现象。这种噪声可能会影响设备的性能和稳定性。 2. **测试方法**：标准中详细描述了如何设置和执行PIND测试，包括粒子大小、速度、方向的模拟，以及噪声信号的捕捉和分析。 3. **操作员培训**：为了确保测试结果的准确性和一致性，操作员需要接受专业训练，理解PIND测试的基本原理、测试设备的使用以及如何解释和报告测试结果。 4. **认证流程**：JEP 114A规定了操作员和实验室的认证标准，确保所有参与PIND测试的人员和机构都达到行业认可的质量水平。 5. **互换性**：标准的实施有助于不同制造商的产品具有可比性，使得用户可以根据统一的测试结果选择合适的组件，提高系统的兼容性和可靠性。 6. **法律和专利考虑**：虽然JEDEC标准不考虑可能涉及的专利问题，但使用者应自行调查并尊重可能存在的知识产权。 7. **应用范围**：PIND测试不仅适用于新产品的开发，也适用于生产过程监控、维护和故障分析，以确保电子设备在整个生命周期中的稳定运行。 JEDEC JEP 114A-2023标准提供了一套全面的框架，用于确保电子设备在面对颗粒污染时的可靠性和耐久性。通过遵循这些指南，业界可以减少因颗粒污染导致的故障，提升产品质量，降低维护成本。

JEDEC Publication No. 114A

Page 1

GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING,

OPERATOR TRAINING AND CERTIFICATION

(From JEDEC Board Ballot JCB-23-12, formulated under the cognizance of JC-13 Committee on Government

Liaison.)

Introduction

All modern systems for military, space and satellite applications use many electronic components that

perform complex control, navigational and monitoring functions of the systems. Proper functioning of

these devices without interruptions is vital to the success of the missions and safety of the personnel and

equipment. Towards achieving this objective, electronic components are manufactured and tested in

accordance with the controls and requirements of applicable military standards, specifications and

drawings. One critical factor that can cause catastrophic device failure is loose particles within the

components.

The focus and importance of screening devices for particles occurred when a catastrophic system failure

in the Delta Launch Vehicle Program was traced to a loose bit of wire within an electronic component.

(1, 2, 3)

The significance of screening devices for particles was further elevated because of advances in the

manned space vehicle, satellite and missile programs. As a result, space-level devices (Class S) and Class

B devices that are used in flight and missile applications must be particle-free.

NASA, McDonnell Douglas and Texas Instruments developed and constantly improved techniques of

detecting particles audibly and visibly within device cavities. A finalized version of the audible technique

was adopted as a Particle Impact Noise Detection Test procedure "PIND" in MIL-STD-883, Test Method

2020. (4, 5, 6)

Despite progress in regard to testing concepts, PIND tester design, methods and media of attachment,

there still exists a lack of correlation between equipment, inconsistency in the test results and conditions,

lack of repeatability and false detections. (7, 8, 9, 10, 11) As a result, there is a general tendency by

manufacturers to question the reliability of the PIND test.

Still PIND testing remains the key measuring indicator for controlling and maintaining a reliable process

line relative to particle contamination. It is a useful tool to continuously refine and improve the assembly

process.

Even though a wealth of information and knowledge about PIND test resides with various users and

manufacturers, it is fragmented or communicated in the proceedings of various symposiums, NBS and

NASA report, but not in an organized complete document on the subject.

The main objective of this Publication is to disseminate and share the relevant information on PIND

testing to all interested parties. The concepts and materials presented here primarily deal with most of the

cause factors that affect the "Measurement Variability” pertinent to "PIND" and how to control them.

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JEDEC

JEDEC Publication No. 114A

Page 2

Scope

This publication is intended only as a guideline to test facilities in their efforts to establish and maintain

consistent PIND testing. Imposition of these suggestions, or any part thereof, is within the province of

each test facility as to its respective needs.

SECTION I reviews specific PIND requirements on electronic devices and manufacturer facilities to

satisfy customer needs and military specifications.

SECTION II discusses representative sources of particles that may be generated during device

manufacturing. However, it should be noted that the nature, type and sources of particles can vary widely

in different manufacturing facilities with different technologies, materials and processes and in no way is

limited to those mentioned here. (12, 13)

SECTION III covers most aspects of the PIND system including test principles, calibration and

maintenance, device attachment mediums and sources of interference and prevention methods.

SECTION IV covers operator education, training and certification. It is a guide to users for elimination of

false particle detection due to improper testing by operators.

SECTION V covers the methods of loose particle recovery and failure analysis of PIND failures. The

section includes process control measures for PIND testing and references made to product quality

verification is included. With measurement consistency and reliable PIND results achievable and in

control, manufacturers will be able to focus on the root causes of particles in the products and processes

and will be able to eliminate the defects to enhance the device quality.

SECTION VI covers a brief summary of this publication.

JEDEC acknowledges that these publication materials are derived from information from the list of

references, from participant companies’ internal documents and discussions from PIND Task Group

meetings of the JEDEC JC-13 (Government Liaison) and JC-13.5 (Government Liaison - Hybrid

Microcircuit Technology) Committees.

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根据JEDEC JEP 114A-2023标准，如何执行PIND测试来评估电子组件的抗污染能力？请详细描述测试流程和操作步骤。

如何根据JEDEC JEP 114A-2023标准执行PIND测试以评估电子组件的抗污染能力？请提供详细的测试流程和操作步骤。

根据JEDEC JEP 114A-2023标准，操作员应如何正确执行PIND测试来评估电子组件的抗污染能力，并确保测试结果的准确性和一致性？

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