"PCB坏点英语培训课程及教材介绍"

The PCB Defect English Training course was created by Zhang Jianli in January 2007 and includes a PowerPoint presentation titled "PCB Defect English Training Course.pptx" and an accompanying training manual. The course covers various aspects of the PCB manufacturing process, including process flow, defect introduction, and testing. The process flow section of the training covers the different stages of PCB manufacturing, including board cutting, inner layer processing, pressing, drilling, plated-through hole production, outer layer processing, wet film application, surface treatment, profiling, E-testing, packing, output, and legend printing. Each stage is explained in detail, providing an overview of the steps involved and the potential defects that can occur during the process. In the defect introduction section, specific defects that can occur during the manufacturing process are outlined. This includes defects related to board cutting, inner layer processing, pressing, drilling, plated-through hole production, outer layer processing, wet film application, surface treatment, profiling, E-testing, packing, and legend printing. The training materials provide information on how to identify these defects and address them in the manufacturing process. The training materials also cover testing processes, including T O P S E A R C H, which is most likely a mnemonic or acronym for a specific testing process. While the exact details of T O P S E A R C H are not mentioned, it is likely a standardized testing procedure used in the PCB manufacturing industry. Overall, the PCB Defect English Training course provides a comprehensive overview of the PCB manufacturing process, potential defects, and testing procedures. The materials are designed to help PCB manufacturers and quality control professionals understand the intricacies of PCB production and ensure the highest quality standards are met.