ORCAD PCB设计完全指南

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"ORCAD PCB 设计 - 完整的PCB设计流程指南，由Kraig Mitzner撰写，由Newnes（Elsevier的印记）出版。本书详细介绍了使用ORCAD Capture和Layout进行PCB设计的全过程。" ORCAD是一款广泛应用于电子设计自动化领域的软件，特别在PCB（印制电路板）设计方面表现突出。ORCAD PCB设计包括两个主要部分：ORCAD Capture和ORCAD Layout。 **ORCAD Capture** 是ORCAD工具集的一部分，主要用于电路原理图的绘制和管理。它允许设计者创建、编辑和组织电路图，包括元器件库管理、网络表生成等功能。Capture提供了一个直观的界面，使得用户可以方便地放置、连接和调整电路元件，从而形成完整的电路原理图。此外，Capture还能生成网络表，这是连接原理图与布局的关键步骤，用于指导后续的PCB布局和布线工作。 **ORCAD Layout** 则是PCB布局和布线的工具，它接收来自Capture的网络表，将电路原理图转化为实际的物理PCB设计。在Layout中，设计师可以进行元件的布局优化，考虑电路性能、空间限制和热管理等因素。同时，Layout提供了强大的自动布线功能，但通常也需要手动干预以满足特定的设计规则和约束，如最小线宽、间距、过孔等。此外，Layout还支持3D视图，以便在设计过程中检查元件之间的物理冲突和潜在的装配问题。在《Complete PCB Design Using ORCAD Capture and Layout》这本书中，作者Kraig Mitzner详细讲解了如何高效使用这两款工具进行PCB设计。他涵盖了从初步的概念设计到最终的生产准备的整个流程，包括元件选择、规则设置、信号完整性分析、电源完整性分析以及设计审查。书中还可能涉及了错误检查、DRC（设计规则检查）和ERC（电气规则检查）的重要性，这些都是确保PCB设计质量和可靠性的关键步骤。版权信息提醒读者，未经许可，不得复制或以任何形式传播此书的内容。若需使用本书的部分内容，应事先向出版社申请权限。此外，通过Elsevier的网站，用户也可以在线完成权限请求。 ORCAD PCB设计是一门涉及多方面知识的复杂工艺，这本书提供了一个全面的指南，对于希望深入学习和提升PCB设计技能的专业人士来说，是一份宝贵的资源。

Introduction to Complete PCB Design

Using OrCAD Capture and Layout

I did not write this book because I am an OrCAD guru. I wrote it because no up-to-date

references were available when I was trying to learn how to use the software. This book is the

one I wish I would have had. This book was born from notes I compiled as I learned (the hard

way) to use the software. The initial intent of the book was to describe how to use OrCAD

Layout speciﬁ cally. Along the way, though, I realized also that I (and many of the engineers I

talked to) had a lot to learn about the printed circuit board (PCB) design process itself. There

was a signiﬁ cant amount of information available on PCB design from both the electrical and

the manufacturing aspects, but there was not an easily accessible resource that covered those

subjects with how to use the software. That is the intent of this book.

Chapter 1 introduces the reader to the basics of PCB design. The chapter begins by introduc-

ing the concepts of computer-aided engineering, computer-aided design, and computer-aided

manufacturing. The chapter then explains how these tools are used to design and manufacture

multilayer PCBs. Many 3-D pictures are used to show the construction of PCBs. Topics such

as PCB cores and layer stack-up, apertures, D-codes, photolithography, layer registration,

plated through-holes, and Gerber ﬁ les are explained.

Chapter 2 leads new users of the software through a very simple design example. The purpose

of the example is to paint a “big picture” of the design ﬂ ow process. The example begins with

a blank schematic page and ends with the Gerber ﬁ les. The circuit is ridiculously simple so

that it is not a distraction to understanding the process itself. Along the way some of Layout’s

routing tools are brieﬂ y introduced along with some of the other tools, which sets the stage

for Chap. 3.

Chapter 3 provides an overview of the OrCAD project ﬁ les and structure and explains

Layout’s tool set in detail. The chapter revisits and explains some of the actions performed

and tools used during the example in Chap. 2. Gerber ﬁ les are also explained in detail.

Chapter 4 introduces some of the industry standards organizations related to the design and

fabrication of PCBs (e.g., IPC and JEDEC). PCB performance classes and producibility

levels are also described along with the basic ideas behind standard fabrication allowances.

These concepts are described here to help the reader realize some of the fabrication issues

up front to help minimize board failures and to identify some of the guides and standards

resources that are available for PCB design.

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Chapter 5 addresses the mechanical aspect of PCB design—design for manufacturability

(DFM). The chapter explains where parts should be placed on the board, how far apart, and in

what orientation from a manufacturing perspective. OrCAD Layout’s design rule checker is

then considered relative to the manufacturing concepts and IPC’s courtyard concepts. To aid

in understanding the design issues, manufacturing processes such as reﬂ ow and wave solder-

ing, pick-and-place assembly, and thermal management are discussed. The information is then

used as a guide in designing plated through-holes, surface-mount lands, and Layout footprints

in general. Tables summarize the information and serve as a design guide during footprint

design and PCB layout.

Chapter 6 addresses the electrical aspect of PCB design. There are several good references

available on signal integrity, electromagnetic interference, and electromagnetic compatibility.

Chapter 6 provides an overview of those topics and applies them directly to PCB design.

Topics such as loop inductance, ground bounce, ground planes, characteristic impedance,

reﬂ ections, and ringing are discussed. The idea of “the unseen schematic” (the PCB layout)

and its role in circuit operation on the PCB is introduced. Look-up tables and equations are

provided to determine required trace widths for current handling and impedance as well as

required trace spacing for high-voltage designs and high-frequency designs. Various layer

stack-up topographies for analog, digital, and mixed-signal applications are also described.

The design examples in Chap. 9 demonstrate how to apply the layer stack-ups described in

this chapter.

Chapter 7 explains how to construct Capture parts using the Capture Library Manager and

Part Editor and the PSpice Model Editor. Heterogeneous and homogeneous parts are devel-

oped in examples using four different methods. Different methods are used depending on

whether a part will be used for simple schematic entry, design projects intended for PCB

layout, PSpice simulations, or all of the above. The chapter also demonstrates how to attach

PSpice models to Capture’s schematic parts using PSpice models downloaded from the Inter-

net and basic PSpice models developed from functional Capture projects. The Capture parts

can then be used for both PSpice simulations and PCB layout as demonstrated in Chap. 9.

Detailed coverage of padstacks and footprints is covered in Chap. 8. The chapter intro-

duces the Layout Library Manager, Layout’s footprint naming conventions, and the basic

composition of a footprint. Then a detailed description of the padstack (as it relates to PCB

manufacturing described in Chaps. 1 and 5) is given, as it is the foundation of both footprint

design and PCB routing. Design examples are provided to demonstrate how to design discrete

through-hole and surface-mount devices and how to use the pad array generator to design

footprints for pin grid arrays and ball grid arrays with dogbone fanouts included with the

footprint.

Chapter 9 provides four PCB design examples that use the material covered in the previ-

ous eight chapters. The ﬁ rst example is a simple analog design using a single op-amp. The

design shows how to set up multiple plane layers for positive and negative power supplies

and ground. The design also demonstrates several key concepts in Capture, such as how to

connect global nets, how to assign footprints, how to perform design rule checks, how to

xvi

Introduction

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use the Capture part libraries, how to generate a bill of materials (BOM), and how to use

the BOM as an aid in the design process in Capture and Layout. The design also shows how

to perform important tasks in Layout such as how to load board technology ﬁ les, locate

speciﬁ c parts, and modify padstacks. Intertool communication (such as annotation and back

annotation) between Capture and Layout is also demonstrated. The second design is a mixed

digital/analog circuit. In addition to the tasks demonstrated in the ﬁ rst example, the design

also demonstrates how to set up and use split planes to isolate analog and digital power

supplies and grounds. Other tasks include using copper pours on routing layers to make

partial ground planes, using copper pours on plane layers to make nested power and ground

planes, and deﬁ ning anti-copper areas on plane and routing layers. The third example uses

the same mixed digital/analog circuit from the second example but demonstrates how to use

multiple page schematics and off-page connectors to add PSpice simulations to a Capture

project used for PCB layout, all within a single project design. It also demonstrates how

to construct multiple, separated power and ground planes and a shield plane to completely

isolate analog from digital circuitry. The use of guard rings and guard traces is also demon-

strated. The fourth example is a high-speed digital design, which demonstrates how to design

transmission lines, stitch multilayer ground planes, perform pin/gate swapping, place moated

ground areas for clock circuitry, and design a heat spreader.

Chapter 10 describes how to postprocess a PCB design and generate speciﬁ c Gerber ﬁ les.

Through an example it is shown how to relate the OrCAD Layout design perspective and layer

stack-up (including image polarity) to the board manufacturer’s perspective by submitting

Gerber ﬁ les to an actual board manufacturer via the Internet. The discussion also provides an

example fabrication quote. Nonstandard Gerber ﬁ les are brieﬂ y discussed as well as Gerber

ﬁ les that are generated for PCBs with nonplated mounting holes.

Chapter 11 introduces other tools that can be used with OrCAD Capture and Layout to

enhance the PCB design process. The chapter provides examples of how to use Microsoft

Excel with the bill of materials generated by Capture to create parts lists and various other

tracking documents that can be used during the PCB layout process to minimize design

errors. Other examples include how to use PSpice to simulate transmission lines to aid in

circuit design and PCB layout, how to use the SPECCTRA autorouter with Layout to route

high-density PCB designs faster and with less manual cleanup, how to use GerbTool to

panelize a board design, and how to use Layout to generate a .DXF ﬁ le that can be used by

a graphics program to construct a 3-D image of your board design. The IPC Land Pattern

Viewer is also introduced in this chapter.

Kraig Mitzner

completePCBbook@msn.com

xvii

Introduction

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