Datasheet 9 Rev.1.00
2019-03-09
PROFET™ +24 V
BTT6100-2ERA
General Product Characteristics
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics
table.
4.3 Thermal Resistance
4.3.1 PCB Set-Up
Figure 4 2s2p PCB Cross Section
Maximum standby current
for whole device with load
I
S(OFF)_150
––10µAV
S
= 36 V
V
OUT
= 0 V
V
IN
floating
V
DEN
floating
T
J
= 150°C
P_4.2.10
Standby current for whole
device with load, diagnostic
active
I
S(OFF_DEN)
–0.6–mA
2)
V
S
= 36 V
V
OUT
= 0 V
V
IN
floating
V
DEN
= 5.5 V
P_4.2.8
1) Test at T
J
= -40°C only
2) Not subject to production test. Specified by design.
Table 5 Thermal Resistance
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Junction to case R
thJC
–2–K/W
1)
1) Not subject to production test. Specified by design.
P_4.3.1
Junction to ambient
All channels active
R
thJA
–27–K/W
1)2)
2) Specified R
thJA
value is according to JEDEC JESD51-2,-5,-7 at natural convection on FR4 2s2p board with 1 W power
dissipation equally dissipated for both channels at T
A
=105°C ; The product (chip + package) was simulated on a 76.4
x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu). Where applicable, a thermal via array
under the exposed pad contacts the first inner copper layer. Please refer to Figure 4.
P_4.3.2
Table 4 Functional Range T
J
= -40°C to 150°C; (unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
1.5mm
70µm
35µm
0.3mm
PCB 2 s2p .vsd
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