QCC3026蓝牙音频芯片：高性能低功耗TrueWireless耳机开发关键

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CSR3026是一款由高通公司推出的高端蓝牙音频系统级芯片（Bluetooth Audio System-on-Chip, SoC），专为真无线立体声耳机（Qualcomm True Wireless Stereo earbuds）设计。该芯片具有独特的三核心处理器架构，旨在提供高性能、低功耗的蓝牙5.0连接体验，确保设备具有出色的电池续航能力。主要特性包括： 1. **多核处理能力**：QCC3026搭载了三个独立核心，其中一个是120MHz的Qualcomm Kalimba音频数字信号处理器（DSP），用于高效处理音频数据，提供高质量的音频编解码和增强功能。 2. **音频开发平台**：芯片内建32MHz的开发者处理器，为应用程序开发者提供了灵活性，使其能够定制和扩展芯片的功能。 3. **存储支持**：具备可编程的灵活QSPI闪存，方便用户升级固件或存储自定义应用程序。 4. **高级音频算法**：内置先进的音频算法，确保音频质量和音质一致性，支持24-bit高分辨率音频接口。 5. **语音处理**：支持1到2个麦克风的Qualcomm cVc技术，提升通话质量，实现清晰的语音通话体验。 6. **通信接口**：芯片集成了串行接口，如UART（通用异步接收器/发送器）、Bit Serializer（I²C/SPI）以及USB 2.0接口，便于与外部设备通信。 7. **电源管理**：集成了一体化的电源管理单元，包含双开关模式电源供应器（SMPS）用于系统和数字电路，以及集成的锂离子电池充电器，保证了高效能的能源利用。 8. **物理连接**：拥有15个输入输出引脚（PIOs）、5个LED指示灯和PWM控制，以及紧凑的81球WLCSP封装（3.9798x4.0184x0.54mm，0.4mm间距）。 9. **音频输出**：包括立体声高质量ADC、Class-D耳塞驱动器，以及线性输入和双模拟麦克风输入接口，满足耳机的各种音频输出需求。 CSR3026是一款专为真无线耳机市场打造的高性能蓝牙音频SoC，通过其丰富的功能、高效能和兼容性，为用户提供流畅的无线音频体验，同时兼顾电池寿命和硬件扩展性。它在蓝牙5.0规格下运行，并集成了多项音频处理技术和接口，是现代无线耳机设计中的关键组件。

Tables

Table 1-1: QCC3026 WLCSP pin allocaons (Orientaon from top of device)......................................................................... 18

Table 1-2: QCC3026 WLCSP device terminal funcons (Radio)................................................................................................19

Table 1-3: QCC3026 WLCSP device terminal funcons (Clock)................................................................................................ 19

Table 1-4: QCC3026 WLCSP device terminal funcons (USB).................................................................................................. 20

Table 1-5: QCC3026 WLCSP device terminal funcons (QSPI)................................................................................................. 20

Table 1-6: QCC3026 WLCSP device terminal funcons (PIO)................................................................................................... 21

Table 1-7: QCC3026 WLCSP device terminal funcons (Audio)............................................................................................... 22

Table 1-8: QCC3026 WLCSP device terminal funcons (AIO/LED drivers)............................................................................... 23

Table 1-9: QCC3026 WLCSP device terminal funcons (SMPS)................................................................................................23

Table 1-10: QCC3026 WLCSP device terminal funcons (Power supplies and control)........................................................... 24

Table 1-11: QCC3026 WLCSP device terminal funcons (Ground)...........................................................................................25

Table 1-12: QCC3026 WLCSP device terminal funcons (Not connected)............................................................................... 25

Table 8-1: High-quality ADC analog gain vs. input impedance and input amplitude............................................................... 39

Table 8-2: Headset output driver mode................................................................................................................................... 40

Table 8-3: I²S/PCM master mode ming diagram symbols...................................................................................................... 41

Table 8-4: I²S/PCM slave mode ming diagram symbols......................................................................................................... 42

Table 8-5: Codec input use condions..................................................................................................................................... 43

Table 8-6: Codec output use condion.................................................................................................................................... 43

Table 8-7: QCC3026 WLCSP audio slots................................................................................................................................... 43

Table 9-1: Virtual PIO............................................................................................................................................................... 45

Table 9-2: LED controller paern............................................................................................................................................. 46

Table 9-3: LED_PWM to PIO to LED_PAD mapping.................................................................................................................. 47

Table 10-1: Transacon bridge PIO mulplex...........................................................................................................................48

Table 13-1: Parameters in Trickle charge..................................................................................................................................52

Table 13-2: Parameters in Pre-charge...................................................................................................................................... 53

Table 13-3: Parameters in Fast charge..................................................................................................................................... 53

Table 13-4: Parameters in Standby mode................................................................................................................................ 54

Table 16-1: Class-D DAC audio output..................................................................................................................................... 68

Table 16-2: High-quality (HQADC) single-ended audio input................................................................................................... 69

80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Figures

QCC3026 WLCSP funconal block diagram................................................................................................................................6

Figure 1-1: QCC3026 WLCSP package dimensions diagram..................................................................................................... 17

Figure 2-1: Bluetooth subsystem............................................................................................................................................. 27

Figure 3-1: Crystal oscillator..................................................................................................................................................... 29

Figure 4-1: QCC3026 WLCSP stac power states diagram....................................................................................................... 31

Figure 5-1: Host Interfaces subsystem..................................................................................................................................... 33

Figure 6-1: Applicaons subsystem..........................................................................................................................................34

Figure 7-1: QCC3026 WLCSP Audio subsystem........................................................................................................................ 36

Figure 8-1: QCC3026 WLCSP high-quality ADC input switch conguraon..............................................................................38

Figure 8-2: I²S/PCM master mode ming diagram.................................................................................................................. 41

Figure 8-3: I²S/PCM slave mode ming diagram......................................................................................................................42

Figure 11-1: Boot Manager...................................................................................................................................................... 49

Figure 12-1: System Manager.................................................................................................................................................. 50

Figure 13-1: PMU subsystem................................................................................................................................................... 51

Figure 13-2: Charge cycle states............................................................................................................................................... 52

Figure 13-3: Power regulaon..................................................................................................................................................55

Figure 14-1: QCC3026 WLCSP example applicaon schemac................................................................................................ 57

80-CF475-1 Rev. AD Confidential and Proprietary – Qualcomm Technologies International, Ltd.

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

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