Zynq-7000 SoC PCB设计指南：UG933修订历史与布局要点

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本资源为《Zynq-7000 SoC PCB设计指南》(UG933, v1.13.1)，发布日期为2019年3月14日，由Xilinx公司提供。该文档是针对Xilinx Zynq-7000系统级芯片(SoC)的详细PCB设计手册，旨在帮助设计师在实际项目中优化电路板布局和元器件选择，确保系统性能和稳定性。 Zynq-7000是一款集成处理系统，它集成了ARM处理器和可编程逻辑(FPGA)于一个芯片，因此对PCB设计的要求较高，需要考虑处理器和FPGA之间的接口、电源管理、时钟信号以及信号完整性等因素。文档包含了丰富的技术细节，如： 1. **修订历史**：记录了文档从初始版本1.0到v1.13.1的更新历程，涉及格式修正、内容增补和错误更正，显示了Xilinx持续关注文档的完善性和准确性。 2. **表3-1和3-2**：可能包含不同Zynq-7000设备或封装的规格信息，这些数据对于选择正确的组件至关重要。此外，表3-3中添加了680微法(FuF)电容规格，强调了电源滤波和信号质量的重要性。 3. **VCCPAUX和VCCPLL**：指南详细介绍了PS辅助逻辑供电(VCCPAUX)和PS PLL供电(VCCPLL)的相关参数，包括推荐的电压范围、连接方式变化（从下拉电阻改为上拉电阻），以及注意事项，这涉及到电源管理的精确控制。 4. **DDR供电电压**：文档对PS_DDR_VREF0和PS_DDR_VREF1引脚的DDR参考电压进行了修改，这是确保内存工作稳定的关键，可能涉及电压设置的建议和注意事项。 5. **信号完整性**：通过图示，如Figure5-3和5-5，展示了MIO(主要输入/输出)接口的Cke引脚的更改，可能涉及信号传输速度和噪声抑制的设计策略。此文档为Zynq-7000 SoC的PCB设计者提供了详尽的指导，涵盖了元器件选择、电源管理、接口规范以及信号完整性等关键设计要素，是进行高效和高质量PCB设计的重要参考资料。设计人员在实际项目中应遵循其中的规则和建议，以实现系统的最佳性能和可靠性。

Zynq-7000 PCB Design Guide 14

UG933 (v1.13.1) March 14, 2019 www.xilinx.com

Chapter 3: Power Distribution System

the quantity per I/O bank. Device performance at full utilization is equivalent across all

devices when using these recommended networks.

Tab l e 3- 1 and Ta b le 3-2 do not provide the decoupling networks required for the GTX and

GTP transceiver power supplies. For this information, refer to UG476, 7 Series FPGAs

GTX/GTH Transceivers User Guide and UG482, 7 Series FPGAs GTP Transceivers User Guide.

RECOMMENDED: Refer to XMP277, 7 Series Schematic Review Recommendations, for a comprehensive

checklist for schematic review which complements this document.

Required PCB Capacitor Quantities

Tab l e 3- 1 lists the PCB decoupling capacitor guidelines per V

supply rail for Zynq-7000

SoC devices.

Table 3-1: Required PCB Capacitor Quantities per Device (PL)

Package Device

CCINT

CCBRAM

CCAUX

CCAUX_IO

CCO

per Bank

(3)(4)

Bank 0

680

µF

330

µF

100

µF

4.7

µF

0.47

µF

100

µF

4.7

µF

0.47

µF

4.7

µF

0.47

µF

4.7

µF

0.47

µF

47 µF

100 µF

4.7

µF

0.47

µF

CLG225 Z-7007S 0 0 1 1 2 NA NA NA NA 1 1 1 NA NA NA 1 2 4 1

CLG400 Z-7007S 0 0 1 1 2 0 1 1 1 1 1 1 NA NA NA 1 2 4 1

CLG225 Z-7010 0 0 1 1 2 NA NA NA NA 1 1 1 NA NA NA 1 2 4 1

CLG400 Z-7010 0 0 1 1 2 0 1 1 1 1 1 1 NA NA NA 1 2 4 1

CLG485 Z-7012S 0 1 0 2 4 1 0 1 1 1 1 2 NA NA NA 1 2 4 1

CLG400 Z-7014S 0 1 0 2 4 1 0 1 1 1 1 1 NA NA NA 1 2 4 1

CLG484 Z-7014S 0 1 0 2 4 1 0 1 1 1 1 2 NA NA NA 1 2 4 1

CLG485 Z-7015 0 1 0 2 4 1 0 1 1 1 1 2 NA NA NA 1 2 4 1

CLG400 Z-7020 0 1 0 2 4 1 0 1 1 1 1 1 NA NA NA 1 2 4 1

CLG484 Z-7020 0 1 0 2 4 1 0 1 1 1 1 2 NA NA NA 1 2 4 1

SBG485/

SBV485

Z-7030

010101 01 2 100NANANA 1 0 0 1

FBG484/

FBV484/

RB484

Z-703001010101 2 100NANANA 1 0 0 1

FBG676/

FBV676

Z-7030

010101 01 2 100 1 0 0 1 0 0 1

FFG676/

FFV676/

RF676

Z-703001010101 2 100 1 0 0 1 0 0 1

FBG676/

FBV676

Z-703520021024 1 001 0 0 1 0 0 1 1

FFG676/

FFV676/

RF676

Z-703520021024 1 001 0 0 1 0 0 1 1

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Zynq-7000 PCB Design Guide 17

UG933 (v1.13.1) March 14, 2019 www.xilinx.com

Chapter 3: Power Distribution System

requires analysis of the resulting power distribution system impedance to ensure that no

resonant impedance spikes result.

PCB Bulk Capacitors

The purpose of the bulk capacitors is to cover the low-frequency range between where the

voltage regulator stops working and where the on-package ceramic capacitors start

working. As specified in Table 3-1 and Ta b l e 3 - 2 , all SoC supplies require bulk capacitors.

The tantalum and niobium oxide capacitors specified in Tabl e 3- 3 were selected for their

values and controlled ESR values. They are also ROHS compliant. If another manufacturer's

tantalum, niobium oxide, or ceramic capacitors are used, ensure they meet the

specifications of Tab l e 3- 3 and are properly evaluated via simulation, s-parameter

extraction, or bench testing.

Table 3-3: PCB Capacitor Specifications

Ideal

Value

Range

(1)

Body

Size

(2)

Type

ESL

Maximum

ESR Range

(3)

Voltage

Rating

(4)

Suggested

Part Number

680 µF C > 680 µF 2917/D

/7343

2-Terminal

Tant a lum

2.1 nH 5 mΩ < ESR < 40 mΩ 2.5V T530X687M006ATE018

330 µF C > 330 µF 2917/D

/7343

2-Terminal

Tant a lum

2.0 nH 5 mΩ < ESR < 40 mΩ 2.5V T525D337M006ATE025

330 µF C > 330 µF 2917/D

/7343

2-Terminal

Niobium

Oxide

2.0 nH 5 mΩ < ESR < 40 mΩ 2.5V NOSD337M002#0035

100 µF C > 100 µF 1210 2-Terminal

Tant a lum,

Ceramic

X7R, X7U, or

X5R

1 nH 1 mΩ < ESR < 40 mΩ 2.5V GRM32EE70G107ME19

47 µF C > 47 µF 1210 2-Terminal

Ceramic X7R

or X5R

1 nH 1 mΩ < ESR < 40 mΩ 6.3V GRM32ER70J476ME20L

10 µF C = 10 µF 0603 2-Terminal

Ceramic X7R

or X5R

0.25 nH 5 mΩ 4.0V GRM188R60G106ME47

4.7 µF C > 4.7 µF 0805 2-Terminal

Ceramic X7R

or X5R

0.5 nH 1 mΩ < ESR < 20 mΩ 6.3V GRM21BR71A475KA73

0.47 µF C > 0.47 µF 0603 2-Terminal

Ceramic X7R

or X5R

0.5 nH 1 mΩ < ESR < 20 mΩ 6.3V GRM188R70J474KA01

Notes:

1. Values can be larger than specified.

2. Body size can be smaller than specified.

3. ESR must be within the specified range.

4. Voltage rating can be higher than specified.

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