汽车电力电子转换器单元PCU功率模块测试标准AQG324

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"AQG324电动汽车试验标准解读" AQG324是机动车辆电力电子转换器单元（PCU）的功率模块测试标准，该标准定义了功率模块所需验证的测试项目、测试要求以及测试条件。该标准适用于电力电子模块的使用寿命和基于分立器件的等效特殊设计，例如用于高达3.5吨机动车辆的电力电子转换器单元（PCU）。 AQG324标准文件中描述的测试项目主要用于验证汽车工业中功率模块的特性和寿命。该标准列出的测试项目、测试要求以及测试条件，大体上适用于Si基功率半导体模块。后续发行版本将涉及替代半导体技术，如SiC或GaN，以及新型组装和互连技术。 AQG324标准文件的主要内容包括： 1. 功率模块测试项目：该标准定义了功率模块所需验证的测试项目，包括环境测试、电气测试、机械测试等。 2. 测试要求：该标准规定了测试的具体要求，包括测试温度、湿度、振动等环境条件。 3. 测试条件：该标准规定了测试的具体条件，包括测试电压、测试频率、测试时间等。 AQG324标准文件的目标是为了确保功率模块的可靠性和安全性，满足汽车工业对功率模块的需求。该标准的实施将有助于提高汽车工业的整体质量和可靠性。 AQG324标准文件的应用范围包括： 1. 电力电子模块：该标准适用于电力电子模块的使用寿命和基于分立器件的等效特殊设计。 2. 机动车辆：该标准适用于高达3.5吨机动车辆的电力电子转换器单元（PCU）。 3. 功率半导体模块：该标准大体上适用于Si基功率半导体模块，并将涉及替代半导体技术，如SiC或GaN，以及新型组装和互连技术。 AQG324标准文件的优点包括： 1.确保功率模块的可靠性和安全性。 2.提高汽车工业的整体质量和可靠性。 3.为汽车工业提供了明确的测试标准和要求。 AQG324标准文件的局限性包括： 1.该标准不能代替机动车辆完整PCU测试。 2.该标准仅适用于电力电子模块的使用寿命和基于分立器件的等效特殊设计。 AQG324标准文件是汽车工业中功率模块测试的重要标准，旨在确保功率模块的可靠性和安全性，提高汽车工业的整体质量和可靠性。

ECPE Guideline

AQG 324

Release 02.1/2019

Page 12 of 70

4 Terms and definitions

4.1 Definitions

4.1.1 Power electronics converter unit

A Power Electronics Converter Unit (PCU) in motor vehicles describes the most general

form of a power electronics converter in a car, including for example the traction

inverter, the LV and HV DC/DC converter, the on-board charger or the power

electronics for electric power steering.

4.1.2 Power electronics modules

Several active devices, e.g. insulated-gate bipolar transistors (IGBTs), metal-oxide

semiconductor field-effect transistors (MOSFETs) or diodes as well as possibly

additional passive components (e.g. temperature sensors, capacitors), with one or

several current paths integrated using a circuit carrier (e.g. substrate) form a power

electronics module.

4.1.3 Topological switch

A single semiconductor switch or several semiconductor switches connected in parallel

which are controlled simultaneously to represent the function of a single switch.

Example: A half bridge consists of two topological switches – one high-side switch (HS)

and one low-side switch (LS), whereby each topological switch can consist of one or

several semiconductor switches/diodes connected in parallel.

4.1.4 Special designs based on discrete components

The control electronics on printed-circuit-boards (PCBs) installed in different PCUs,

which contain circuit topologies with at least one topological switch consisting of

discrete packaged IGBTs or MOSFETs, are considered power electronics modules as

per section 4.1.1. If a driver infrastructure is additionally integrated in the board, the

board represents an intelligent power module (IPM).

Note: One example for a special design is a B6 bridge (possibly including a driver) for

controlling auxiliary power units on a FR4 PCB.

4.1.5 Current path of a power electronics module

The current path of a power electronics module consists of one or several topological

switches which are interconnected in different circuit topologies, depending on the

function represented.

Note:

Half bridge, consisting of one high-side switch (HS) and one low-side switch (LS) with

center tapping (phase tapping). Any other topologies are also conceivable. For

topologies other than bridge circuits, the definition of the current paths has to be agreed

advance.

ECPE Guideline

AQG 324

Release 02.1/2019

Page 13 of 70

4.1.6 Chip-near interconnection technology

The chip-near interconnection technology describes a design of the chip top side

connection as well as the chip backside connection with the substrate.

Examples:

Chip top surface: bond wire, ribbon bond, copper clip, sinter technology, µ-via connect

Chip backside: chip soldering, sinter technology, diffusion soldering

4.1.7 Chip-remote interconnection technology

The chip-remote interconnection technology describes a design of the connections

which do not directly include the chip. For this, a differentiation must be made between

electrical and thermal interfaces. As a result of the design, chip-remote interconnection

technology can be electrical as well as thermal.

Examples:

Electrical interfaces: Design of the contacting for the load and auxiliary contacts.

Thermal interfaces: System soldering between substrate and base plate (modules with

base plate) or interface between module and cooling system (modules without base

plate).

Note: For modules without base plate, the interface between module and cooling

system, which in this case must be considered differently, must be validated with

suitable tests during the PCU testing.

Special designs:

Chip-remote interconnection technology related to discrete package types integrated on

a PCB (e.g. TO-247 housing): Interface between TO rear side and PCB or heat sink,

e.g. with a heat conducting film.

4.1.8 Circuit carrier

A circuit carrier is an unassembled or assembled wiring carrier for electronics.

4.1.9 System

Functionally linked components e.g. a drive consisting of electric machine, power

electronics, electronic control unit (ECU) and sensors form a system.

4.1.10 Substrate

A substrate is a circuit carrier for power electronics components which can consist of

different materials e.g. Al

, AlN, or organic-based materials e.g. in PCBs.

4.1.11 Direct and indirect cooling

In direct cooling the power module is part of the cooling system. Therefore, no thermal

interface material (TIM) is used.

In indirect cooling the power module is assembled using TIM.

4.1.12 Signal connections

Signal connections mean the control connections of power electronics modules.

4.1.13 High voltage (HV)

High voltage means voltages > 60 V for DC and voltages > 30 V for AC rms.

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