SN75LVCP412A
SLLS991 –DECEMBER 2009
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of its channels independently. When the input signal of either or both channels is in the electrical idle
state, i.e. V
IDp-p
<50 mV and stays in this state for > 10 μs, the associated channel(s) enters the low power
state. In this state, the output of the associated channel(s) is held to TX VCM and the device selectively
shuts off some circuitry to lower power by > 90% (typ) of its normal operating power. Exit time from auto
low power mode is less than 50 ns max.
OUT-OF-BAND (OOB) SUPPORT
The squelch detector circuit within the device enables full detection of OOB signaling as specified in SATA
specification 2.6. Differential signal amplitude at the receiver input of 50 mV
p-p
or less is not detected as an
activity and hence is not passed to the output. Differential signal amplitude of 150 mV
p-p
or more is detected as
an activity and therefore passed to the output indicating activity. Squelch circuit on/off time is 8 ns max. While in
squelch mode outputs are held to VCM
TX
.
DEVICE POWER
The SN75LVCL412A is designed to operate from a single 3.3-V supply. Always practice proper power supply
sequencing procedures. Apply V
CC
first before any input signals are applied to the device. The power-down
sequence is in reverse order.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
Supply voltage range
(2)
V
CC
–0.5 to 4 V
Voltage range Differential I/O –0.5 to 4 V
Control I/O –0.5 to V
CC
+ 0.5
Electrostatic discharge Human body model
(3)
±12000 V
Charged-device model
(4)
±1500
Machine model
(5)
±200
Continuous power dissipation See Dissipation Rating Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-A.
(5) Tested in accordance with JEDEC Standard 22, Test Method A115-A.
DISSIPATION RATINGS
PCB JEDEC DERATING FACTOR
(1)
T
A
= 85°C
PACKAGE T
A
≤ 25°C
STANDARD ABOVE T
A
= 25°C POWER RATING
20-pin QFN (RTJ) Low-K 1176 mW 11.76 mW/°C 470 mW
High-K 2631 mW 26.3 mW/°C 1052 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX
(1)
UNIT
R
θJB
Junction-to-board thermal resistance 10 °C/W
R
θJC
Junction-to-case thermal resistance 60 °C/W
R
θJP
Junction-to-pad thermal resistance 15.2 °C/W
(1) The maximum rating is simulated under 3.6-V V
CC
.
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