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گࠀࡼพೕስኸళ
2006
ڼܾ܈
Texas Instruments
64
AGND
AD2 (RSSI/IF)
AD1
AD0
DVDD
RESET
PROG
P2_7
P2_6
P1_7
P1_6
P1_5
P0_3
P0_2 (MISO)
DVDD
DGND
63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
17
AGND
XOSC_Q1
XOSC_Q2
XOSC32_Q2
XOSC32_Q1
AGND
DGND
DGND
POR_E
P1_0
(RXD1) P2_0
(TXD1) P2_1
(PWM3) P3_5
(PWM2) P3_4
(INT1) P3_3
DGND
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P3_0 (RXD0)
P3_1 (TXD0)
P3_2 (INT0)
P2_5
P2_4
DVDD
P2_3
DGND
DVDD
P2_2
P1_4
P1_3
P1_2
P1_1
P0_1 (MOSI)
P0_0 (SCK)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AVDD
AVDD
AGND
RF_IN
RF_OUT
AVDD
AGND
AGND
AGND
L1
L2
AVDD
CHP_OUT
R_BIAS
R131
L101
AVDD
AGND
L32L41C41
C42
C31
AVDD
DVDD
DVDDDVDD
AVDD
C181 C171
Antenna
MODEM
:N.n
PDCHP :RLPF
CODEC Bit synchronizer
Serializer/Deserializer
IF STAGE
LNA
PA
3-24 MHz Crystal
32 kHz Crystal
Bias Resistor
Bias
Main
Crystal
Oscillator
VCO
L1 L2 CHP_OUT
RF_IN
AD0
AD1
AD2
(RSSI/IF)
RF_OUT
RSSI
RF Transceiver
IF
MUX
Clock
Multiplexer
System
clock
UARTs
General
purpose I/ O
Timers/
PWMs
Timers/
Counters
Realtime
Clock
Port 2
Port 3
2048 byte
SRAM
Interrupt Controller RAM Arbiter
Programmable I/O (General purpose or alternate function)
DES Module
FLASH
Programming DMA
8051 Core
Special Function
Registers
(SFRs)
SPI
ADC
Reset
Generation
Watchdog
Timer
128 byte
SRAM
32 kB
FLASH
Power-on
reset
Port 0
POR_E
Port 1
RESET
PROG
VCO inductor
MIXER
GENERAL CHARACTERISTICS
PARAMETER (433/868 MHz, 3.0 V, 25°C) MIN TYP MAX UNIT
OPERATING CONDITIONS:
Operating voltage 2.7 3.6 V
Operating temperature -40 +85 °C
Main oscillator frequency 3 24 MHz
TX MODE:
RF frequency range 300 1000 MHz
Data rate 0.6 76.8 kbps
Output power (programmable) -20 10/4 dBm
FSK separation (programmable) 0 65 kHz
RX MODE:
Receiver sensitivity, 1.2 kbps -107/-106 dBm
POWER SUPPLY:
Supply voltage 2.1 3.6 V
Current consumption, RX 9.1/11.9 mA
Current consumption, TX, -20 dBm 5.3/8.6 mA
Current consumption, TX, -5 dBm 8.9/13.8 mA
Current consumption, TX, 0 dBm 10.4/17.0 mA
Current consumption, TX, 4 dBm 24.8/23.5 mA
Current consumption, TX, 10 dBm 26.6/- mA
Current consumption, power down 0.2 1 μA
SPECIFICATIONS MICROCONTROLLER:
Active mode (14.7456 MHz clock) 14.8 mA
Idle mode (32 kHz clock) 29 μA
Power down current 0.2 μA
FEATURES
• Programmable frequency range (300 –
1000 MHz)
• High sensitivity (typically -107 dBm
at 1.2. kbit/s)
• Programmable output power (–20 to 10 dBm)
• Very low current consumption (RX: 9.1 mA)
• Very few external components, no external
RF switch, or IF filter required
• Fast PLL settling allows frequency hopping
protocols
• FSK modulation with a data rate of up
to 76.8 kbit/s
• Manchester or NRZ coding and decoding
of data performed in hardware. Byte
delineation of data can be performed in
hardware to reduce the processor burden.
• RSSI output which can be sampled by
on-chip ADC
• Complies with EN 300 220 and FCC CFR47
part 15
• Optimized 8051-core typically gives 2.5 x
the performance of a standard 8051
• Dual data pointers
• Idle and sleep modes
• In-circuit interactive debugging is supported
for the Keil™ μVision IDE through a simple
serial interface
• 32 kB of non-volatile Flash memory in-system
programmable through a simple SPI interface
or by the 8051 core
• Typical Flash endurance: 20 000 write/
erase cycles
• Programmable read and write lock of portions
of Flash memory for software security
• 2048 + 128 Byte of internal SRAM
• DES supported in hardware
• Output Feedback Mode or Cipher Feedback
Mode
• Power-On-Reset/Brown-out Detection
• Three channel, max 23 KSPS, 10-bit ADC
• Programmable watchdog timer
• Real-time clock with 32 kHz crystal oscillator
• Four timers/Two PWMs
• Two programmable serial UARTs
• Master SPI interface
• 26 configurable general purpose I/O pins
• Random bit-generator in hardware
• 8051 core and peripherals can use the RTC’s
32 kHz clock
• Idle and sleep modes for reduced power
consumption. System can wake up on interrupt
or when ADC input exceeds a set threshold.
• Low-power, fully static CMOS design
• 2.7 – 3.6 V supply voltage
• -40 to +85 °C operating temperature
• 3 – 24 MHz crystal (up to 50 ppm) for the
main crystal oscillator
• 64-lead TQFP
APPLICATION CIRCUIT DIAGRAM BLOCK DIAGRAM
CC1010
CC1010
ᅃӯ༬Ⴀ
ᆌᆩۉୟ๖ᅪ
ࠓ
༬ۅ
•
Պײೕ୲ݔྷ
(300-1000MHz)
•
ߛଳ௺܈DŽᇀ
1.2.kbit/s
้Ljۆ႙ኵ
ྺ
-107dBm
Dž
•
Պײࠀ୲ݔྷǖ
-20
12dBm
•
גگۉୁࡼ
(
݀พఇ๕ူ
: 9.1mA)
•
ณڦྔևፇLjႷྔዃ
RF
࠲ዐ
ೕ
(IF)
୳հഗ
•
၎࣍
(PLL)
ۨ࿋Ljኧೕ୲ཌ
Վၹᅱ
•
FSK
ۙຕ୲ߛٳ
76.8kbit/s
•
ᆘํ၄ຕڦதןຯ༬
(Manchester)
փࡃଭ
(NRZ)
ՊஓஓLjຕጴব
௮ࣼ
(byte delineation)
ڦᆘํ၄ᆶၳ
ڦইگକتഗڅ
•
ཚࡗೌዃڦ
ADC
ํ၄ܔ
RSSI
ڦ֑ᄣ
•
ፏٗᇀ
EN 300 220
ᅜ
FCC CFR 47
Lj
part 15
Քጚ
•
ᆫࣅڦ
8051
ࢃ႐Ljۆ႙ႠీٳՔጚ
8051
Ⴀీڦ
2.5
Ԡ
•
ມຕኸኍ
•
ှລఇ๕
•
ཚࡗڇزႜথํ၄ᆩᇀ
Keil™
Ӳ
Ԩڦׯ݀࣍ৣ
(IDE)
ڦۉୟాዃ
ࢻႠۙ
•
32kB
ݥᅟ฿Ⴀ٪Ljཚࡗᅟڦ
SPI
থ
8051
ాࢃႜဣཥՊײ
•
Քጚ٪܁ႀْຕǖ
20000
ْႀ
/
։
أዜ
•
ᆩᇀํ၄ҾඇႠڦևݴ٪܁ႀ
ۨՊײ
•
2048+128
ጴবڦాዃ
SRAM
•
ᆘኧڦຕ
(DES)
•
ݒઍఇ๕ஓݒઍఇ๕
•
ฉۉް࿋
/
ۖۉ֪
•
ෙཚڢĂፌٷ୲
23KSPS
ڦ
10
࿋
ADC
•
Պײோࠑ้ۨഗ
•
ټ
32 kHz
ৗ༹ናږഗڦํ้้ዓ
•
຺้߲ഗ
/
ଇ߲ஞۙഗ
(PWM)
•
ଇ߲Պײزႜ
UART
•
ዷ
SPI
থ
•
26
߲ದዃཚᆩ
I/O
ᆅগ
•
ᆘໜ࿋݀ิഗ
•
8051
ࢃ႐ྔยᆩํ้ৗና
(RTC)
ڦ
32kHz
้ዓ
•
ှລఇ๕ᆩᅜইگࠀࡼLjဣཥ
ཚࡗዐ
ADC
גࡗยۨோ၌
ํ၄࣓ႝ
•
گࠀࡼĂඇৢༀ
CMOS
ย
•
2.7–3.6V
ۉᇸۉუ
•
߾ፕ࿒܈ǖ
-40
+85 ŃC
•
3–24MHz
ৗ༹
(
ߛٳ
50ppm )
ᅜᆩᇀ
ዷৗና
•
64
ᆅগ
TQFP
ހጎ